Influence of dislocation loops created by amorphizing implants on point defect and boron diffusion in silicon

1996 ◽  
Vol 68 (25) ◽  
pp. 3570-3572 ◽  
Author(s):  
H. S. Chao ◽  
P. B. Griffin ◽  
J. D. Plummer
Keyword(s):  
Point Defect ◽  
Dislocation Loops ◽  
Boron Diffusion

Point Defect Absorption and Dislocation Loop Formation at Grain Boundaries in Hvem-Irradiated Zr and Its Alloys:1. Influence of Solute Addition

1985 ◽  
Vol 43 ◽  
pp. 350-351
Author(s):  
R.A. Herring ◽  
M. Griffiths ◽  
M.H Loretto ◽  
R.E. Smallman
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Point Defect ◽  
Reactor Core ◽  
Solute Concentration ◽  
Nuclear Industry ◽  
Dislocation Loops ◽  
Loop Formation ◽  
Component Material ◽  
Impurity Interaction

Because Zr is used in the nuclear industry to sheath fuel and as structural component material within the reactor core, it is important to understand Zr's point defect properties. In the present work point defect-impurity interaction has been assessed by measuring the influence of grain boundaries on the width of the zone denuded of dislocation loops in a series of irradiated Zr alloys. Electropolished Zr and its alloys have been irradiated using an AEI EM7 HVEM at 1 MeV, ∼675 K and ∼10-6 torr vacuum pressure. During some HVEM irradiations it has been seen that there is a difference in the loop nucleation and growth behaviour adjacent to the grain boundary as compared with the mid-grain region. The width of the region influenced by the presence of the grain boundary should be a function of the irradiation temperature, dose rate, solute concentration and crystallographic orientation.

On the interpretation of dislocation-loop growth during in-situ high-voltage Electron Microscopy

1990 ◽  
Vol 48 (4) ◽  
pp. 532-533
Author(s):  
E. Holzäpfel ◽  
F. Phillipp ◽  
M. Wilkens
Keyword(s):  
Point Defect ◽  
Rate Equations ◽  
Rate Theory ◽  
Dislocation Loops ◽  
High Voltage Electron Microscopy ◽  
Vacancy Migration ◽  
Voltage Electron ◽  
Reaction Rate Theory ◽  
Defect Reactions

During in-situ radiation damage experiments aiming on the investigation of vacancy-migration properties interstitial-type dislocation loops are used as probes monitoring the development of the point defect concentrations. The temperature dependence of the loop-growth rate v is analyzed in terms of reaction-rate theory yielding information on the vacancy migration enthalpy. The relation between v and the point-defect production rate P provides a critical test of such a treatment since it is sensitive to the defect reactions which are dominant. If mutual recombination of vacancies and interstitials is the dominant reaction, vαP0.5 holds. If, however, annihilation of the defects at unsaturable sinks determines the concentrations, a linear relationship vαP is expected.Detailed studies in pure bcc-metals yielded vαPx with 0.7≾×≾1.0 showing that besides recombination of vacancies and interstitials annihilation at sinks plays an important role in the concentration development which has properly to be incorporated into the rate equations.

Transition From Inclined to In-Plane 60° Misfit Dislocations in a Diffuse Interface

1993 ◽  
Vol 319 ◽  
Author(s):  
X. J. Ning ◽  
P. Pirouz
Keyword(s):  
Strain Relaxation ◽  
Classical Model ◽  
Diffuse Interface ◽  
Misfit Dislocations ◽  
Dislocation Loops ◽  
Boron Diffusion ◽  
Plan View ◽  
Transmission Electron ◽  
Mechanisms Of Formation ◽  
Film Substrate

AbstractDespite tremendous activity during the last few decades in the study of strain relaxation in thin films grown on substrates of a dissimilar material, there are still a number of problems which are unresolved. One of these is the nature of misfit dislocations forming at the film/substrate interface: depending on the misfit, the dislocations constituting the interfacial network have predominantly either in-plane or inclined Burgers vectors. While, the mechanisms of formation of misfit dislocations with inclined Burgers vectors are reasonably well understood, this is not the case for in-plane misfit dislocations whose formation mechanism is still controversial. In this paper, misfit dislocations generated to relax the strains caused by diffusion of boron into silicon have been investigated by plan-view and crosssectional transmission electron microscopy. The study of different stages of boron diffusion shows that, as in the classical model of Matthews, dislocation loops are initially generated at the epilayer surface. Subsequently the threading segments expand laterally and lay down a segment of misfit dislocation at the diffuse interface. The Burgers vector of the dislocation loop is inclined with respect to the interface and thus the initial misfit dislocations are not very efficient. However, as the diffusion proceeds, non-parallel dislocations interact and give rise to product segments that have parallel Burgers vectors. Based on the observations, a model is presented to elucidate the details of these interactions and the formation of more efficient misfit dislocations from the less-efficient inclined ones.

scholarly journals Defect mastering - one of the topic challenges for crystal growth

2014 ◽  
Vol 70 (a1) ◽  
pp. C32-C32
Author(s):  
Peter Rudolph
Keyword(s):  
Crystal Growth ◽  
Grain Boundaries ◽  
Point Defect ◽  
Dislocation Dynamics ◽  
Cell Diameter ◽  
Second Phase ◽  
Dislocation Loops ◽  
Misfit Stress ◽  
Dislocation Interaction

The quality of single crystals, epitaxial layers and devices made there from are very sensitively influenced by structural and atomistic deficiencies generated during the crystal growth. Crystalline imperfections comprise point defects, dislocations, grain boundaries, second-phase particles. Over more than a half-century of the development of crystal growth, most of the important defect-forming mechanisms have become well understood [1-2]. As a result, the present state of technology makes it possible to produce crystals of remarkably high quality. However, that is not to say that all problems are already solved. For instance, in comparison with silicon the point defect dynamics in semiconductor and oxide compounds is not nearly as well understood. The density of equivalent defect types and antisites in each sub-lattice is determined by deviation from stoichiometry. Their charge state depends on the Fermi level position leading via interaction with dopants to certain compensation level and complex formation. One measure proves to be the in situ control of stoichiometry. Due to high-temperature dislocation dynamics heterogeneous dislocation substructures are formed. Both, acting thermo-mechanical stress and given point defect situation force the dislocation to glide and climb. In the course of enthalpy minimization the long-range character of dislocation interaction produces agglomerates and patterns with polygonized cell walls, i.e. small angle grain boundaries [3]. Thanks to the rules of correspondence of Taylor and Kuhlmann-Wilsdorf one is able to estimate the interaction between shear stress, dislocation density and cell diameter (Fig.). In epitaxy the Nye tensor, describing dislocation distribution inhomogeneity, affects the layer stress considerably. The growth under minimum stress, solution hardening and in situ stoichiometry control are effective counteracting methods. One of the most serious consequences during cooling down of as-grown crystals is the point defect condensation in precipitates and micro-voids decorating dislocation patterns or inducing high mechanical misfit stress that generates dislocation loops. It proves to be favourable to anneal the crystal a few degrees below the melting point in order to dissolve the particles and re-diffuse their into the crystal matrix.

The Effect of Fluorine Implantation on Boron Diffusion in Metastable Si0.86 Ge0.14

2004 ◽  
Vol 810 ◽  
Author(s):  
Huda A. W. A. El Mubarek ◽  
Yun Wang ◽  
Janet M. Bonar ◽  
Peter Hemment ◽  
Peter Ashburn
Keyword(s):  
Thermal Diffusion ◽  
Sige Layer ◽  
Dislocation Loops ◽  
Boron Diffusion ◽  
Rich Region ◽  
Implantation Energy ◽  
Enhanced Diffusion ◽  
Partial Relaxation ◽  
Transient Enhanced Diffusion ◽  
Marker Layer

ABSTRACTThis paper investigates the effect of varying F+ implantation energy on boron thermal diffusion and boron transient enhanced diffusion (TED) in metastable Si0.86Ge0.14 by characterising the diffusion of a boron marker layer in samples with and without P+ and F+ implants. The effect of two F+ implantation energies (185keV and 42keV) was studied at two anneal temperatures 950°C and 1025°C. In samples implanted with P+ & 185keV F+, the fluorine suppresses boron transient enhanced diffusion completely at 950°C and suppresses thermal diffusion by 25% at 1025°C. In samples implanted with P+ & 42keV F+, the fluorine does not reduce boron transient enhanced diffusion at 950°C. This result is explained by the location of the boron marker layer in the vacancy-rich region of the fluorine damage profile for the 185keV implant but in the interstitial-rich region for the 42keV implant. Isolated dislocation loops are seen in the SiGe layer for the 185keV implant. We postulate that these loops are due to the partial relaxation of the metastable Si0.86Ge0.14 layer.

Application of High Energy Ion Beam on the Control of Boron Diffusion

2003 ◽  
Vol 792 ◽  
Author(s):  
Wei-Kan Chu ◽  
Lin Shao ◽  
Jiarui Liu
Keyword(s):  
Point Defect ◽  
Point Defects ◽  
Anomalous Diffusion ◽  
Ion Beam ◽  
Surface Region ◽  
High Energy ◽  
Boron Diffusion ◽  
Defect Engineering ◽  
Projected Range ◽  
Ultrashallow Junction

ABSTRACTAnomalous diffusion of boron during annealing is a detriment on the fabrication of ultrashallow junction required by the next generation Si devices. This has driven the need to develop new doping methods. In the point defect engineering approach, high-energy ion bombardments inject vacancies near the surface region and create excessive interstitials near the end of projected range of incident ions. Such manipulation of point defects can retard boron diffusion and enhance activation of boron. We will review the current understanding of boron diffusion and our recent activities in point defect engineering.

The Influence of Amorphizing Implants on Boron Diffusion in Silicon

1997 ◽  
Vol 469 ◽  
Author(s):  
H. S. Chao ◽  
P. B. Griffin ◽  
J. D. Plummer
Keyword(s):  
Point Defects ◽  
Field Enhancement ◽  
Enhancement Effect ◽  
Dislocation Loops ◽  
Boron Diffusion ◽  
Electric Field Enhancement ◽  
Diffusion Behavior ◽  
Enhanced Diffusion ◽  
Pile Up ◽  
Experimental Structure

ABSTRACTThe transient enhanced diffusion behavior of B after ion implantation above the amorphization threshold is investigated. The experimental structure uses a layer of epitaxially grown Si, uniformly doped with B to act as a diffusion monitor. Wafers using this structure are implanted with amorphizing doses of Si, As, or P and annealed for various times at various temperatures. The experimental results show that upon annealing after Si implantation, there is a large amount of B pile-up that occurs at the amorphous/crystalline (A/C) interface while B is depleted from the region just beyond the A/C interface. This pile-up/depletion phenomenon can be attributed to the dislocation loops that form at the A/C interface. These loops act as sinks for interstitial point defects. There is also B pile-up/depletion behavior for As and P implants as well. However, this behavior may be explained by an electric field enhancement effect. While dislocation loops are known to form at the A/C interface for all of the investigated implant conditions, it appears that while they are necessary to simulate for Si amorphizing implants, they may not be necessary to simulate for As and P amorphizing implants.

Point Defect Detector Studies of Ge+ Implanted Silicon upon Oxidation

1992 ◽  
Vol 262 ◽  
Author(s):  
H. L. Meng ◽  
S. Prusstn ◽  
K. S. Jones
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Point Defect ◽  
Point Defects ◽  
Type Ii ◽  
Dislocation Loops ◽  
Furnace Annealing ◽  
Plan View ◽  
Atom Concentration ◽  
Transmission Electron

ABSTRACTPrevious results [1] have shown that type II (end-of-range) dislocation loops can be used as point defect detectors and are efficient in measuring oxidation induced point defects. This study investigates the interaction between oxidation-induced point defects and dislocation loops when Ge+ implantation was used to form the type II dislocation loops. The type II dislocation loops were introduced via Ge+ implants into <100> Si wafers at 100 keV to at doses ranging from 2×1015 to l×1016/cm2. The subsequent furnace annealing at 900 °C was done for times between 30 min and 4 hr in either a dry oxygen or nitrogen ambient. The change in atom concentration bound by dislocation loops as a result of oxidation was measured by plan-view transmission electron microscopy (PTEM). The results show that the oxidation rate for Ge implanted Si is similar to Si+ implanted Si. Upon oxidation a decrease in the interstitial injection was observed for the Ge implanted samples relative to the Si implanted samples. With increasing Ge+ dose the trapped atom concentration bound by the loops actually decreases upon oxidation relative to the inert ambient implying oxidation of Ge+ implanted silicon can result in either vacancy injection or the formation of an interstitial sink.

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