Schottky contacts on ternary compound semiconductors: Compositional variations of barrier heights

1995 ◽  
Vol 67 (15) ◽  
pp. 2209-2211 ◽  
Author(s):  
Winfried Mönch
Keyword(s):  
Ternary Compound ◽  
Compound Semiconductors ◽  
Schottky Contacts ◽  
Barrier Heights ◽  
Compositional Variations

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Barrier heights of Schottky contacts on strained AlGaN/GaN heterostructures: Determination and effect of metal work functions

2003 ◽  
Vol 82 (24) ◽  
pp. 4364-4366 ◽  
Author(s):  
Zhaojun Lin ◽  
Wu Lu ◽  
Jaesun Lee ◽  
Dongmin Liu ◽  
Jeffrey S. Flynn ◽  
...  
Keyword(s):  
Schottky Contacts ◽  
Barrier Heights ◽  
Work Functions ◽  
Metal Work

Metal Contacts on a-GaN

1996 ◽  
Vol 1 ◽  
Author(s):  
T. U. Kampen ◽  
W. Mönch
Keyword(s):  
Tight Binding ◽  
Image Force ◽  
Schottky Contacts ◽  
Metal Contacts ◽  
Zero Bias ◽  
Barrier Heights ◽  
Current Voltage ◽  
Optical Dielectric Constant ◽  
Optical Dielectric ◽  
Gap States

The Schottky barrier heights of silver and lead contacts on n-type GaN (0001) epilayers were determined from current-voltage characteristics. The zero-bias barrier heights and the ideality factors were found to be linearly correlated. Similar observations were previously reported for metal contacts on Si (111) and GaAs (110) surfaces. The barrier heights of ideal Schottky contacts are characterized by image force lowering of the barrier only. This gives an ideality factor of 1.01. From our data we obtain barrier heights of 0.82 eV and 0.73eV for ideal Ag and Pb contacts on GaN, respectively. The metal-induced gap states (MIGS) model predicts the barrier heights of ideal Schottky contacts on a given semiconductor to be linearly correlated with the electronegativities of the metals. The two important parameters of this MIGS-and-electronegativity model are the charge neutrality level (CNL) of the MIGS and a slope parameter. The CNL may be calculated from the dielectric band gap and using the empirical tight-binding method. The slope parameters are given by the optical dielectric constant of the respective semiconductor. The predictions of the MIGS model for metal/GaN contacts are confirmed by the results presented here and by barrier heights previously reported by others for Au, Ti, Pt, and Pd contacts on GaN.

Transient photocurrent measurements in alkali chalcogenide ternary compound semiconductors

2012 ◽  
Vol 28 (1) ◽  
pp. 015022 ◽  
Author(s):  
Z Liu ◽  
J A Peters ◽  
H Li ◽  
M G Kanatzidis ◽  
B W Wessels
Keyword(s):  
Ternary Compound ◽  
Compound Semiconductors ◽  
Transient Photocurrent

Band structure of ternary-compound semiconductors using a modified tight-binding method

1990 ◽  
Vol 42 (2) ◽  
pp. 1452-1454 ◽  
Author(s):  
Seong Jae Lee ◽  
Hahn Soo Chung ◽  
Kyun Nahm ◽  
Chul Koo Kim
Keyword(s):  
Band Structure ◽  
Ternary Compound ◽  
Tight Binding ◽  
Compound Semiconductors ◽  
Tight Binding Method

Phase Inhomogeneity and Electrical Characteristics of Nickel Silicide Schottky Contacts Formed on 4H-SiC

2009 ◽  
Vol 615-617 ◽  
pp. 577-580 ◽  
Author(s):  
Irina P. Nikitina ◽  
Konstantin Vassilevski ◽  
Alton B. Horsfall ◽  
Nicolas G. Wright ◽  
Anthony G. O'Neill ◽  
...  
Keyword(s):  
Nickel Silicide ◽  
Schottky Contacts ◽  
Electrical Characteristics ◽  
Adhesion Layer ◽  
Temperature Range ◽  
Barrier Heights ◽  
Phase Inhomogeneity ◽  
Layer 4 ◽  
State Chemical ◽  
Nisi Phase

Nickel silicide Schottky contacts were formed on 4H-SiC by consecutive deposition of a titanium adhesion layer, 4 nm thick, and nickel, 100 nm thick, followed by annealing at temperatures from 600 to 750 °C. It was found that contacts with barrier heights of 1.45 eV, consisting mainly of NiSi phase, formed in the 600-660 °C temperature range, while annealing at around 750 °C led to the formation of Ni2Si phase with barrier heights of 1.1 eV. Annealing at intermediate temperatures resulted in the nucleation of Ni2Si grains embedded in the NiSi film which were directly observed by micro-Raman mapping. It was concluded that the thermodynamically unfavourable NiSi phase appeared in the 600-660 °C temperature range due to the fact that the solid state chemical reaction between Ni and SiC at these temperatures is controlled by nickel diffusion through the titanium barrier.

Schottky Contacts on n-InP with High Barrier Heights and Reduced Fermi-Level Pinning by a Novel In Situ Electrochemical Process

1995 ◽  
Vol 34 (Part 1, No. 2B) ◽  
pp. 1162-1167 ◽  
Author(s):  
Nan-Jian Wu ◽  
Tamotsu Hashizume ◽  
Hideki Hasegawa ◽  
Yoshihito Amemiya
Keyword(s):  
Fermi Level ◽  
Electrochemical Process ◽  
Schottky Contacts ◽  
Fermi Level Pinning ◽  
Barrier Heights

The Study of TiWN Schottky Contacts on n-Ga0.51 In0.49P

1993 ◽  
Vol 300 ◽  
Author(s):  
Edward Y. Chang ◽  
Yeong-Lin Lai ◽  
Kuen-Chyuan Lin ◽  
Chun-Yen Chang ◽  
F. Y. Juang
Keyword(s):  
Schottky Contact ◽  
Rf Magnetron Sputtering ◽  
Schottky Contacts ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Barrier Heights ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Lattice Matched ◽  
Thermal Stability Of

ABSTRACTThe first study of the TiW nitrides (TiWNx) as the Schottky contact metals to the n type Ga0.51In0 49P has been made. The Ga0.51 In0.49P epitaxial layer was successfully grown on the GaAs substrate by LP-MOCVD to form a lattice-matched heterostructure. The RF-magnetron sputtering system was utilized for the nitride deposition. The thermal stability of the nitride films were studied using rapid thermal annealing (RTA) method. Both the electrical characteristics and the materials characteristics were investigated. The materials properties of the nitride films were characterized by X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). The TiWNx Schottky contacts demonstrate excellent electrical and physical characteristics, even after high temperature annealing. The barrier heights range from 0.81 to 1.05 eV depending on the content of the nitrogen and the annealing conditions. The XRD and AES results show no indication of interaction at the TiWNX/GaInP interface of both as-deposited and annealed samples. The outstanding characteristics of the contact were attributed to the high bandgap nature of the Ga0.51In0.49P and the incorporation of nitrogen into the TiW films.

Analysis of temperature-dependent Schottky barrier parameters of Cu–Au Schottky contacts to n-InP

2012 ◽  
Vol 90 (1) ◽  
pp. 73-81 ◽  
Author(s):  
V. Lakshmi Devi ◽  
I. Jyothi ◽  
V. Rajagopal Reddy
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Gaussian Distribution ◽  
Ideality Factor ◽  
Thermionic Emission ◽  
Schottky Contacts ◽  
Temperature Dependent ◽  
Semiconductor Interface ◽  
Zero Bias ◽  
Barrier Heights

In this work, we have investigated the electrical characteristics of Au–Cu–n-InP Schottky contacts by current–voltage (I–V) and capacitance–voltage (C–V) measurements in the temperature range 260–420 K in steps of 20 K. The diode parameters, such as the ideality factor, n, and zero-bias barrier height, Φb0, have been found to be strongly temperature dependent. It has been found that the zero-bias barrier height, Φb0(I–V), increases and the ideality factor, n, decreases with an increase in temperature. The forward I–V characteristics are analyzed on the basis of standard thermionic emission (TE) theory and the assumption of gaussian distribution of barrier heights, due to barrier inhomogeneities that prevail at the metal–semiconductor interface. The zero-bias barrier height Φb0 versus 1/2kT plot has been drawn to obtain the evidence of a gaussian distribution of the barrier heights. The corresponding values are Φb0 = 1.16 eV and σ0 = 159 meV for the mean barrier height and standard deviation, respectively. The modified Richardson plot has given mean barrier height, Φb0, and Richardson constant, A**, as 1.15 eV and 7.34 Acm−2K−2, respectively, which is close to the theoretical value of 9.4 Acm−2K−2. Barrier heights obtained from C–V measurements are higher than those obtained from I–V measurements. This inconsistency between Schottky barrier heights (SBHs) obtained from I–V and C–V measurements was also interpreted. The temperature dependence of the I–V characteristics of the Au–Cu–n-InP Schottky diode has been explained on the basis of TE mechanism with gaussian distribution of the SBHs.

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