Compact, inexpensive target design for steady‐state heat removal in high‐heat‐flux fusion applications

1985 ◽  
Vol 56 (8) ◽  
pp. 1526-1530 ◽  
Author(s):  
S. K. Combs ◽  
S. L. Milora ◽  
C. A. Foster ◽  
H. H. Haselton ◽  
M. M. Menon ◽  
...  
2017 ◽  
Author(s):  
Tomio Okawa ◽  
Junki Ohashi ◽  
Ryo Hirata ◽  
Koji Enoki

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Genesis Vasquez ◽  
Siavash Rastkar

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.


Author(s):  
Rongliang Zhou ◽  
Juan Catano ◽  
Tiejun Zhang ◽  
John T. Wen ◽  
Greg J. Michna ◽  
...  

Steady-state modeling and analysis of a two-loop cooling system for high heat flux removal applications are studied. The system structure proposed consists of a primary pumped loop and a vapor compression cycle (VCC) as the secondary loop to which the pumped loop rejects heat. The pumped loop consists of evaporator, condenser, pump, and bladder liquid accumulator. The pumped loop evaporator has direct contact with the heat generating device and CHF must be higher than the imposed heat fluxes to prevent device burnout. The bladder liquid accumulator adjusts the pumped loop pressure level and, hence, the subcooling of the refrigerant to avoid pump cavitation and to achieve high critical heat flux (CHF) in the pumped loop evaporator. The vapor compression cycle of the two-loop cooling system consists of evaporator, liquid accumulator, compressor, condenser and electronic expansion valve. It is coupled with the pumped loop through a fluid-to-fluid heat exchanger that serves as both the vapor compression cycle evaporator and the pumped loop condenser. The liquid accumulator of the vapor compression cycle regulates the cycle active refrigerant charge and provides saturated vapor to the compressor at steady state. The heat exchangers are modeled with the mass, momentum, and energy balance equations. Due to the projected incorporation of microchannels in the pumped loop to enhance the heat transfer in heat sinks, the momentum equation, rarely seen in previous refrigeration system modeling efforts, is included to capture the expected significant microchannel pressure drop witnessed in previous experimental investigations. Electronic expansion valve, compressor, pump, and liquid accumulators are modeled as static components due to their much faster dynamics compared with heat exchangers. The steady-state model can be used for static system design that includes determining the total refrigerant charge in the vapor compression cycle and the pumped loop to accommodate the varying heat load, sizing of various components, and parametric studies to optimize the operating conditions for a given heat load. The effect of pumped loop pressure level, heat exchangers geometries, pumped loop refrigerant selection, and placement of the pump (upstream or downstream of the evaporator) are studied. The two-loop cooling system structure shows both improved coefficient of performance (COP) and CHF overthe single loop vapor compression cycle investigated earlier by authors for high heat flux removal.


2020 ◽  
Vol 25 ◽  
pp. 100816
Author(s):  
V.P. Budaev ◽  
S.D. Fedorovich ◽  
A.V. Dedov ◽  
A.V. Karpov ◽  
A.T. Komov ◽  
...  

Author(s):  
Akira Matsui ◽  
Kazuhisa Yuki ◽  
Hidetoshi Hashizume

Detailed heat transfer characteristics of particle-sintered porous media and metal foams are evaluated to specify the important structural parameters suitable for high heat removal. The porous media used in this experiment are particle-sintered porous media made of bronze and SUS316L, and metal foams made of copper and nickel. Cooling water flows into the porous medium opposite to heat flux input loaded by a plasma arcjet. The result indicates that the bronze-particle porous medium of 100μm in pore size shows the highest performance and achieves heat transfer coefficient of 0.035MW/m2K at inlet heat flux 4.6MW/m2. Compared with the heat transfer performance of copper fiber-sintered porous media, the bronze particlesintered ones give lower heat transfer coefficient. However, the stable cooling conditions that the heat transfer coefficient does not depend on the flow velocity, were confirmed even at heat flux of 4.6MW/m2 in case of the bronze particle-sintered media, while not in the case of the copper-fiber sintered media. This signifies the possibility that the bronze-particle sintered media enable much higher heat flux removal of over 10MW/m2, which could be caused by higher permeability of the particle-sintered pore structures. Porous media with high permeability provide high performance of vapor evacuation, which leads to more stable heat removal even under extremely high heat flux. On the other hand, the heat transfer coefficient of the metal foams becomes lower because of the lower capillary and fin effects caused by too high porosity and low effective thermal conductivity. It is concluded that the pore structure having high performance of vapor evacuation as well as the high capillary and high fin effects is appropriate for extremely high heat flux removal of over 10MW/m2.


1998 ◽  
Vol 120 (2) ◽  
pp. 365-370 ◽  
Author(s):  
K. H. Haddad ◽  
F. B. Cheung

Steady-state nucleate boiling heat transfer experiments in saturated and subcooled water were conducted. The heating surface was a 0.305 m hemispherical aluminum vessel heated from the inside with water boiling on the outside. It was found that subcooling had very little effect on the nucleate boiling curve in the high heat flux regime where latent heat transport dominated. On the other hand, a relatively large effect of subcooling was observed in the low-heat-flux regime where sensible heat transport was important. Photographic records of the boiling phenomenon and the bubble dynamics indicated that in the high-heat-flux regime, boiling in the bottom center region of the vessel was cyclic in nature with a liquid heating phase, a bubble nucleation and growth phase, a bubble coalescence phase, and a large vapor mass ejection phase. At the same heat flux level, the size of the vapor masses was found to decrease from the bottom center toward the upper edge of the vessel, which was consistent with the increase observed in the critical heat flux in the flow direction along the curved heating surface.


2014 ◽  
Vol 2014.20 (0) ◽  
pp. _10310-1_-_10310-2_
Author(s):  
Daiki Hanzawa ◽  
Kyosuke Katsumata ◽  
Tomio Okawa

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