Absence of low temperature saturation of electron–electron scattering in a single mode quantum wire

1992 ◽  
Vol 61 (7) ◽  
pp. 831-833 ◽  
Author(s):  
Gerhard Fasol
Keyword(s):  
Low Temperature ◽  
Electron Scattering ◽  
Quantum Wire ◽  
Single Mode

Low temperature behavior of entropy and specific heat of a three dimensional quantum wire: Shannon and Tsallis entropies

2020 ◽  
Vol 93 (6) ◽  
Author(s):  
Mojtaba Servatkhah ◽  
Reza Khordad ◽  
Arezoo Firoozi ◽  
Hamid Reza Rastegar Sedehi ◽  
Ahmad Mohammadi
Keyword(s):  
Low Temperature ◽  
Specific Heat ◽  
Quantum Wire ◽  
Three Dimensional ◽  
Temperature Behavior

Failure Analysis of Fiber Optic Communication System in Deep-Water Remotely Operated Vehicle ROSUB 6000

2014 ◽  
Vol 48 (3) ◽  
pp. 63-72 ◽  
Author(s):  
Raju Ramesh ◽  
Dharmaraj Sathianarayanan ◽  
Vittal Doss Prakash ◽  
Arumugam Vadivelan ◽  
Sethuraman Ramesh ◽  
...  
Keyword(s):  
Low Temperature ◽  
Failure Analysis ◽  
Deep Water ◽  
Fiber Optic ◽  
Single Mode ◽  
Single Mode Fiber ◽  
Link Failure ◽  
Remotely Operated Vehicle ◽  
Link Loss ◽  
Optic Communication

AbstractSingle-mode fiber optic systems can play vital roles in cabled deep-water vehicle operations at greater depths (>3,000 m). One kind of single-mode fiber optic system, the ROSUB 6000, is used in a deep-water work-class remotely operated vehicle (ROV). Fiber optic link failure of ROV telemetry and sound navigation and ranging were noticed at a water depth of 3,050 m during the ROSUB 6000 system sea trials. A failure analysis of the fiber optic communication system was carried out with the link data logged during different phases of the deep-sea trials. The results from the failure analysis carried out during deep-sea trials showed an increase in the fiber optic link loss from a depth of 900 m onwards. Further analysis of the fiber optic link loss in the laboratory involved pressure and low-temperature testing of all the subsea components in the ROV telemetry link. From the laboratory pressure test results, it was concluded that pressure was not the root cause of the fiber optic link failure. On further analysis, a complete fiber optic link failure was noticed during the low-temperature testing of the subsea components. Furthermore, the low-temperature testing of the individual subsea components revealed that the fiber optic rotary joint (FORJ) insertion loss increased rapidly at low temperatures. This FORJ insertion loss led to complete failure of the fiber optic links in the ROV. The degradation of index-matching fluid in the FORJ was identified to be the root cause of fiber link failure.

SILICON WAVEGUIDE SIDEWALL SMOOTHING BY RESIST REFLOWING

2010 ◽  
Vol 19 (04) ◽  
pp. 801-809 ◽  
Author(s):  
JINGNAN CAI ◽  
PENG HUEI LIM ◽  
YASUHIKO ISHIKAWA ◽  
KAZUMI WADA
Keyword(s):  
Low Temperature ◽  
Optical Transmission ◽  
Single Mode ◽  
Line Edge Roughness ◽  
Reflow Process ◽  
Sidewall Roughness ◽  
Silicon Waveguide ◽  
Edge Roughness ◽  
Transmission Measurements ◽  
Expansion Effect

We present a chip-upending method to reflow the resist and reduce the line edge roughness of submicron single mode waveguide. The resist expansion effect was studied and it was found that the expansion could be suppressed by using the chip-upending method while reflowing the resist. The line edge roughness was estimated to be reduced from ~8 nm to ~6 nm by theoretical calculation. Optical transmission measurements also demonstrated that the sidewall roughness can be smoothed. This kind of reflow process is operated at low temperature and is adaptable for different resists and it could be available for various waveguide materials as well.

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