Warpage of GaAs‐on‐Si wafers and its reduction by selective growth of GaAs through a silicon shadow mask by molecular beam epitaxy

1988 ◽  
Vol 53 (3) ◽  
pp. 225-227 ◽  
Author(s):  
N. Chand ◽  
J. P. van der Ziel ◽  
J. S. Weiner ◽  
A. M. Sergent ◽  
A. Y. Cho ◽  
...  
1986 ◽  
Vol 25 (Part 2, No. 4) ◽  
pp. L285-L287 ◽  
Author(s):  
Mitsuo Kawabe ◽  
Toshio Ueda

2011 ◽  
Vol 318 (1) ◽  
pp. 450-453 ◽  
Author(s):  
Chia-Hung Lin ◽  
Ryota Abe ◽  
Takahiro Maruyama ◽  
Shigeya Naritsuka

1991 ◽  
Author(s):  
Paul Panayotatos ◽  
Alexandros Georgakilas ◽  
Jean-Loic Mourrain ◽  
Aristos Christou

1991 ◽  
Author(s):  
Y. L. Wang ◽  
A. Feygenson ◽  
R. A. Hamm ◽  
D. Ritter ◽  
J. S. Weiner ◽  
...  

1985 ◽  
Author(s):  
Seiji Nishi ◽  
Masahiro Akiyama ◽  
Katsuzo Kaminishi

1993 ◽  
Vol 334 ◽  
Author(s):  
Seikoh Yoshida ◽  
Masahiro Sasaki

AbstractA new damage-less patterning method of the photo-oxidized GaAs mask used for the selective-area growth of GaAs has been developed. We have found a new characteristic of the GaAs oxide: a metal Ga deposition onto the GaAs oxide surface lowers the desorption temperature of the oxide. The patterning method employed is based upon this characteristic. The GaAs oxide where 15 atomic layers (ALs) of Ga is deposited is locally removed at 540°C to form an opening area in the oxide mask. After forming this opening area, GaAs is selectively grown there by metal-organic molecular beam epitaxy (MOMBE).


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