Influence of the strain rate on the tensile strength in aluminas of different purity

2000 ◽  
Vol 10 (PR9) ◽  
pp. Pr9-323-Pr9-328 ◽  
Author(s):  
F. Gálvez ◽  
J. Rodriguez ◽  
V. Sánchez Gálvez
Keyword(s):  
2020 ◽  
Vol 27 ◽  
pp. 1218-1223
Author(s):  
Sagar Chokshi ◽  
Piyush Gohil ◽  
Amul Lalakiya ◽  
Parth Patel ◽  
Amit Parmar

2004 ◽  
Vol 449-452 ◽  
pp. 305-308
Author(s):  
Lei Wang ◽  
Toshiro Kobayashi ◽  
Chun Ming Liu

Tensile test at loading velocities up to 10 m·s-1(strain rate up to 3.2x102s-1) was carried out forr SiCp/AC4CH composite and AC4CH alloy. The microstructure of the composite before and after tensile deformation was carefully examined with both optical microscope and SEM. The experimental results demonstrated that the ultimate tensile strength (UTS) and yield strength (YS) increase with increasing loading velocity up to 10 m·s-1. Comparing with AC4CH alloy, the fracture elongation of the composite is sensitivity with the increasing strain rate. The YS of both the composite and AC4CH alloy shows more sensitive than that of the UTS with the increasing strain rate, especially in the range of strain rate higher than 102s-1.


1985 ◽  
Vol 132 (2) ◽  
pp. 181-191 ◽  
Author(s):  
G.A.C. Boyd ◽  
J. Harding ◽  
P.A. Bleasdale ◽  
K. Dunn ◽  
G.I. Turner

2021 ◽  
Vol 1016 ◽  
pp. 292-296
Author(s):  
Yuliya Igorevna Borisova ◽  
Diana Yuzbekova ◽  
Anna Mogucheva

An Al-4.57Mg-0.35Mn-0.2Sc-0.09Zr (wt. %) alloy was studied in the fine-grained state obtaining after equal channel angular pressing. The mechanical behavior of alloy at the temperatures 173 K, 298 K and 348 K and at strain rate 1×10–3 s–1 is studied. Increase of the temperature testing from 173 K to 348 K decreases the yield stress by 80 MPa, the ultimate tensile strength by 60 MPa while elongation-to failure increases by a factor of 1.4. It was found that at temperatures of 298 and 173 K, the studied alloy mainly demonstrates the mode of ductile fracture, and at a temperature of 348 K the mechanism can be described as mixed ductile-brittle fracture. It was also established that of the studied alloy is the temperature dependence of the size of the dimples on the fracture surface. The formation of smaller dimples in the samples deformed at 298 K was observed.


Metals ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 791 ◽  
Author(s):  
Kaipeng Wang ◽  
Fengjiang Wang ◽  
Ying Huang ◽  
Kai Qi

Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag3Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu6Sn5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.


2013 ◽  
Vol 209 ◽  
pp. 6-9 ◽  
Author(s):  
Rajendra Doiphode ◽  
S.V.S. Narayana Murty ◽  
Nityanand Prabhu ◽  
Bhagwati Prasad Kashyap

Mg-3Al-1Zn (AZ31) alloy was caliber rolled at 250, 300, 350, 400 and 450 °C. The effects of caliber rolling temperature on the microstructure and tensile properties were investigated. The room temperature tensile tests were carried out to failure at a strain rate of 1 x 10-4s-1. The nature of stress-strain curves obtained was found to vary with the temperature employed in caliber rolling. The yield strength and tensile strength followed a sinusoidal behaviour with increasing caliber rolling temperature but no such trend was noted in ductility. These variations in tensile properties were explained by the varying grain sizes obtained as a function of caliber rolling temperature.


2018 ◽  
Vol 183 ◽  
pp. 02042
Author(s):  
Lloyd Fletcher ◽  
Fabrice Pierron

Testing ceramics at high strain rates presents many experimental diffsiculties due to the brittle nature of the material being tested. When using a split Hopkinson pressure bar (SHPB) for high strain rate testing, adequate time is required for stress wave effects to dampen out. For brittle materials, with small strains to failure, it is difficult to satisfy this constraint. Because of this limitation, there are minimal data (if any) available on the stiffness and tensile strength of ceramics at high strain rates. Recently, a new image-based inertial impact (IBII) test method has shown promise for analysing the high strain rate behaviour of brittle materials. This test method uses a reflected compressive stress wave to generate tensile stress and failure in an impacted specimen. Throughout the propagation of the stress wave, full-field displacement measurements are taken, from which strain and acceleration fields are derived. The acceleration fields are then used to reconstruct stress information and identify the material properties. The aim of this study is to apply the IBII test methodology to analyse the stiffness and strength of ceramics at high strain rates. The results show that it is possible to identify the elastic modulus and tensile strength of tungsten carbide at strain rates on the order of 1000 s-1. For a tungsten carbide with 13% cobalt binder the elastic modulus was identified as 516 GPa and the strength was 1400 MPa. Future applications concern boron carbide and sapphire, for which limited data exist in high rate tension.


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