scholarly journals Thermal Stability of Beta Phase in a Cu-Al-Be Shape Memory Alloy

1995 ◽  
Vol 05 (C2) ◽  
pp. C2-171-C2-174 ◽  
Author(s):  
H. Flores Zúñiga ◽  
D. Rios-Jara ◽  
F. C. Lovey ◽  
G. Guénin
2015 ◽  
Vol 608 ◽  
pp. 1-6 ◽  
Author(s):  
E.M. Mazzer ◽  
C.S. Kiminami ◽  
C. Bolfarini ◽  
R.D. Cava ◽  
W.J. Botta ◽  
...  

2014 ◽  
Vol 123 ◽  
pp. 250-253 ◽  
Author(s):  
Xin Zhang ◽  
Jiehe Sui ◽  
Zheyi Yang ◽  
Xiaohang Zheng ◽  
Wei Cai

2017 ◽  
Vol 10 (01) ◽  
pp. 1740012 ◽  
Author(s):  
Semir Tulić ◽  
Michael Kerber ◽  
Mitsuhiro Matsuda ◽  
Thomas Waitz

Severe plastic deformation of a Ti[Formula: see text]Ni[Formula: see text]Pd[Formula: see text] high-temperature shape memory alloy yields a nanoscale mixture of an amorphous phase and retained lamellae of the parent B19 martensite. The thermal stability of the deformed martensite is significantly enhanced. Upon heating, B2 austenite occurs within the martensite and by crystallization of the amorphous phase, concomitant with recovery and the formation of an ultrafine grained structure. In the small grains, the B2 austenite to B19 martensitic transformation is shifted to lower temperatures and incomplete.


2015 ◽  
Vol 18 (suppl 2) ◽  
pp. 35-38 ◽  
Author(s):  
Piter Gargarella ◽  
Cláudio Shyinti Kiminami ◽  
Eric Marchezini Mazzer ◽  
Régis Daniel Cava ◽  
Leonardo Albuquerque Basilio ◽  
...  

2012 ◽  
Vol 21 ◽  
pp. 23-28
Author(s):  
Artur S.C. Leal ◽  
Carlos José de Araújo ◽  
Suédina Maria L. Silva ◽  
Antônio Gilson Barbosa de Lima

In this work, the effect of curing agent, curing conditions and the incorporation of small amounts of organoclay on the thermal properties of DGEBA (diglycidyl ether of bisphenol A) epoxy resin was evaluated in order to develop an epoxy system for application as the matrix in active composites whose dispersed phase consists of shape memory alloy wires. The DGEBA resin was prepared using three amine derivatives as hardeners (triethylenetetramine - TETA, diethylenetriamine - DETA and diaminodiphenylsulfone - DDS) under varied curing conditions, in the absence and presence of organoclay. Epoxy systems were characterized by dynamic mechanical analysis (DMA), optical microscopy and X-ray diffraction. According to the obtained results, the cured DETA and DDS epoxy systems at elevated temperatures, above 180°C, showed a higher glass transition temperature (Tg) and thermal stability values than the system cured at low temperature (TETA). In addition, when the post-cure treatment was used, an improvement of the thermal stability was verified. When 1 phr (parts hundred resin) of organoclay was incorporated in DETA and DDS cured epoxy systems and post-cured, either the increase in the Tg and thermal stability values were more significant, especially for the system cured with DDS. Hence, the epoxy/DDS/organoclay system (exfoliated nanocomposite) is the most appropriate to be used as the matrix in the preparation of active composites since this matrix is thermally stable in the Ni-Ti shape memory alloy working range whose phase transformation occurs between 70 and 80 °C.


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