Influence of mechanical stress on the polarizability of atoms in a solid medium

1963 ◽  
Vol 1 (3) ◽  
pp. 8-15
Author(s):  
K. Achyuthan
Keyword(s):  
Mechanical Stress ◽  
Solid Medium

Behaviour of Ni-Mn-Ga alloys under mechanical stress

2003 ◽  
Vol 112 ◽  
pp. 943-946 ◽  
Author(s):  
K. Koho ◽  
J. Vimpari ◽  
L. Straka ◽  
N. Lanska ◽  
O. Sôderberg ◽  
...  
Keyword(s):  
Mechanical Stress

Enhancement of Platelet Sensitivity to ADP-Aggregation by Isometric Exercise in Arteriosclerotic Patients and its Prevention

1977 ◽  
Vol 37 (02) ◽  
pp. 329-338 ◽  
Author(s):  
Tadahiro Sano ◽  
Takeshi Motomiya ◽  
Hiroh Yamazaki ◽  
Takio Shimamoto
Keyword(s):  
Cyclic Amp ◽  
Mechanical Stress ◽  
Optical Density ◽  
Platelet Function ◽  
Isometric Exercise ◽  
Phosphodiesterase Inhibitor ◽  
New Method ◽  
Platelet Aggregability ◽  
Control Subjects ◽  
Healthy Control

SummaryA new method for assessment of platelet sensitivity to ADP-aggregation was devised. Its reproducibility and the correlations between the values obtained by this method, the optical density (O. D.) method, and the screen filtration pressure (SFP) method were assessed. In summary, this method may be said to have three main points:1. It can be performed without centrifugation, avoiding mechanical stress to platelets, using only 0.8 ml. of blood and inexpensive equipment.2. It may reflect different aspects of platelet function from the O. D. method and the SFP method, despite the positive significant correlations between the values obtained by these three methods.3. It was proved to be highly reproducible and is thought to be useful clinically.By using this method, the effect of sustained isometric exercise by handgripping on platelet aggregability was assessed in coronary sclerotic and cerebral arteriosclerotic patients on placebo and EG-626, a newly synthesized cyclic AMP phosphodiesterase inhibitor. On placebo, an enhancement of platelet sensitivity was observed after isometric exercise in coronary and cerebral arteriosclerotic patients but not in healthy control subjects. The enhancement was prevented by pretreatment of EG-626, administered orally 1.5 hours prior to exercise.

Exploring the Biological Protective Role of Carotenoids by Raman Spectroscopy: Mechanical Stress of Cells

2019 ◽  
Vol 64 (1-2) ◽  
pp. 75-82
Author(s):  
F. Nekvapil ◽  
◽  
Cs. Müller Molnár ◽  
S. Tomšić ◽  
S. Cintă Pinzaru ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Mechanical Stress ◽  
Protective Role

Sensitive Mechanocontrolled Luminescence in Cross-Linked Polymer Films

2019 ◽  
Author(s):  
Ayumu Karimata ◽  
Pradnya Patil ◽  
Eugene Khaskin ◽  
Sébastien Lapointe ◽  
robert fayzullin ◽  
...  
Keyword(s):  
Mechanical Stress ◽  
Polymer Films ◽  
Soft Matter ◽  
Small Strain ◽  
Visual Methods ◽  
Photoluminescence Intensity ◽  
Stimuli Responsive ◽  
Responsive Materials ◽  
Highly Sensitive ◽  
Mechanical Stretching

Direct translation of mechanical force into changes in chemical behavior on a molecular level has important implication not only for the fundamental understanding of mechanochemical processes, but also for the development of new stimuli-responsive materials. In particular, detection of mechanical stress in polymers via non-destructive methods is important in order to prevent material failure and to study the mechanical properties of soft matter. Herein, we report that highly sensitive changes in photoluminescence intensity can be observed in response to the mechanical stretching of cross-linked polymer films when using stable, (pyridinophane)Cu-based dynamic mechanophores. Upon stretching, the luminescence intensity increases in a fast and reversible manner even at small strain (< 50%) and applied stress (< 0.1 MPa) values. Such sensitivity is unprecedented when compared to previously reported systems based on organic mechanophores. The system also allows for the detection of weak mechanical stress by spectroscopic measurements or by direct visual methods.<br>

Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow Trench Isolation CMOS Structures: Correlation with Defect Generation and Diode Leakage

1998 ◽  
Author(s):  
I. De Wolf ◽  
G. Groeseneken ◽  
H.E. Maes ◽  
M. Bolt ◽  
K. Barla ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Mechanical Stress ◽  
Defect Formation ◽  
Active Area ◽  
Wet Oxidation ◽  
Leakage Currents ◽  
Shallow Trench Isolation ◽  
Micro Raman Spectroscopy ◽  
Silicon Devices ◽  
Trench Isolation

Abstract It is shown, using micro-Raman spectroscopy, that Shallow Trench Isolation introduces high stresses in the active area of silicon devices when wet oxidation steps are used. These stresses result in defect formation in the active area, leading to high diode leakage currents. The stress levels are highest near the outer edges of line structures and at square structures. They also increase with decreasing active area dimensions.

Failure Analysis of Broken Stitch Bonds in TSSOP Packages Using Scanning Acoustic Microscopy (SAM) and Time Domain Reflectometry (TDR)

2004 ◽  
Author(s):  
Bilal Abd-AlRahman ◽  
Corey Lewis ◽  
Todd Simons
Keyword(s):  
Failure Analysis ◽  
Mechanical Stress ◽  
Time Domain ◽  
Open Circuit ◽  
Time Domain Reflectometry ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Root Cause ◽  
Analysis Application

Abstract A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.

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