Control Circuits in Power Electronics: Practical issues in design and implementation

Energies ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1527
Author(s):  
José Aravena ◽  
Dante Carrasco ◽  
Matias Diaz ◽  
Matias Uriarte ◽  
Felix Rojas ◽  
...  

In recent years, different off-the-shelf solutions for the rapid control prototyping of power electronics converters have been commercialised. The main benefits of those systems are based on a fast and easy-to-use environment due to high-level programming. However, most of those systems are very expensive and are closed software and hardware solutions. In this context, this paper presents the design and implementation of a control platform targeting at the segment in between expensive off-the-shelf control platforms and low-cost controllers. The control platform is based on the Launchpad TMS320F28379D from Texas Instruments, and it is equipped with an expansion board that provide analogue-to-digital measurements, switching signals and hardware protections. The performance of the control platform is experimentally tested on a 20 kVA power converter.


2020 ◽  
Vol 3 (4) ◽  
pp. 328-335
Author(s):  
Yiyi Chen ◽  
Yuying Yan ◽  
Bo Li

AbstractInsulated gate bipolar transistor (IGBT) power module is used for power switching transistor devices in the power supply and motor control circuits in both hybrid electric vehicles and electric vehicles. The target of heat flux of IGBT is continuously increasing due to the demand for power rating improvements and miniaturisation. Without suitable efficient cooling technologies, excessively high temperature and uneven temperature distribution can cause high thermal stress, eventually leading to severe module failures. Therefore, highly efficient cooling solutions are highly required. Vapour chamber with phase change can provide quick heat transfer and low temperature gradient. This study proposes a new IGBT structure integrated with vapour chamber. The tests and simulation results indicate that the thermal and thermo-mechanical performances of IGBT integrated with vapour chamber are better than those of the IGBT with copper baseplate module. The thermal resistance between the junction and heat sink is reduced from 0.25 to 0.14 °C/W, and the temperature uniformity is greatly improved due to the phase change in the vapour chamber. The simulation also investigates the thermal stress distribution, deformation and thermal fatigue lifespan of IGBT power electronics module. A reduction of 21.8% in thermal stress and an increase of 9% in lifespan of Sn–3.5Ag solder are achieved.


2011 ◽  
Vol 301-303 ◽  
pp. 1428-1433
Author(s):  
Jun Wei Wu ◽  
Ling Juan Miao ◽  
Yan Ji Wu

The key design and implementation methods of Miniature 3-axial Fiber Optic Rate Sensor are described in detail. Based on plenty of theoretical analysis and experimental validation, effective measures and key technology on optical components, fiber coil technics, assembly methods, control circuits and structure solidity are adopt and summarized. Finally, its main engineering performance is tested and listed detailedly. From experimental results and engineering practice, we can conclude that Miniature 3-axial Fiber Optic Rate Sensor has the performance of high reliability, radiation resistance, low air pressure resistance, temperature resistance and high reliability, and can be widely used in some special and professional fields. More importantly, it greatly promotes the development of fiber optic sensing and inertial technology application of China.


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