Large area fabrication of high aspect ratio nano‐cylinders on micro‐pillars based on a colloidal crystal mask

2020 ◽  
Vol 15 (15) ◽  
pp. 1115-1119
Author(s):  
Zexiang Yan ◽  
Ying Wang ◽  
Xingchang Zeng ◽  
Jiangbo Lu ◽  
Xianglian Lv ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Colloidal Crystal ◽  
Large Area ◽  
Micro Pillars

Highly ordered nanoscale phosphomolybdate-grafted polyaniline/metal hybrid layered structures prepared via secondary sputtering phenomenon as high-performance pseudocapacitor electrodes

2021 ◽  
Author(s):  
Eun Seop Yoon ◽  
Bong Gill Choi ◽  
Hwan-Jin Jeon
Keyword(s):  
Electron Transfer ◽  
Aspect Ratio ◽  
Electrochemical Performance ◽  
High Aspect Ratio ◽  
High Performance ◽  
Electrode Materials ◽  
Rate Capability ◽  
High Specific Capacitance ◽  
High Rate ◽  
Large Area

Abstract The development of energy storage electrode materials is important for enhancing the electrochemical performance of supercapacitors. Despite extensive research on improving electrochemical performance with polymer-based materials, electrode materials with micro/nanostructures are needed for fast and efficient ion and electron transfer. In this work, highly ordered phosphomolybdate (PMoO)-grafted polyaniline (PMoO-PAI) deposited onto Au hole-cylinder nanopillar arrays is developed for high-performance pseudocapacitors. The three-dimensional nanostructured arrays are easily fabricated by secondary sputtering lithography, which has recently gained attention and features a high resolution of 10 nm, a high aspect ratio greater than 20, excellent uniformity/accuracy/precision, and compatibility with large area substrates. These 10nm scale Au nanostructures with a high aspect ratio of ~30 on Au substrates facilitate efficient ion and electron transfer. The resultant PMoO-PAI electrode exhibits outstanding electrochemical performance, including a high specific capacitance of 114 mF/cm2, a high-rate capability of 88%, and excellent long-term stability.

scholarly journals Fabrication of high aspect-ratio polymer microstructures for large-area electronic portal X-ray imagers

2007 ◽  
Vol 140 (2) ◽  
pp. 185-193 ◽  
Author(s):  
J.H. Daniel ◽  
A. Sawant ◽  
M. Teepe ◽  
C. Shih ◽  
R.A. Street ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Large Area ◽  
X Ray ◽  
Polymer Microstructures

Multi-Layer Photopolymer Micromachining

2005 ◽  
Vol 872 ◽  
Author(s):  
J. R. Huang ◽  
B. Bai ◽  
J. Shaw ◽  
T. N. Jackson ◽  
C. Y. Wei ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Solution Process ◽  
Microfluidic Channel ◽  
Width Ratio ◽  
Large Area ◽  
Additive Process ◽  
Infiltration Process

AbstractThis paper presents a novel method to create and integrate micro-machined devices and high aspect-ratio (height-to-width ratio) microstructures in which the microstructures are built up using multiple layers of photopolymer film and/or viscous solution. Very high aspect-ratio 2-and 3-dimensional (2-D and 3-D) microstructures were constructed by stacking photo-imageable polymer films. Such films may be dry films applied by lamination or solution layers applied by bar coating, or doctor blade coating. Photolithography is used in both cases to define the microstructure. This additive process of thin-film micromachining facilitates high aspect-ratio microstructure fabrication. We have demonstrated structures of up to 12-layers comprising 2-D arrays of deep trenches (180 μm deep and 25 μm wide) and a 2-layer SU-8 micro-trench array with an aspect ratio up to 36 on glass substrates. Miniaturized structures of interconnected reservoirs as small as 50 μm × 50 μm × 15 μm (∼38 pico liter storage capacity) are also being fabricated, along with a novel 5-layer microfluidic channel array and a vacuum-infiltration process for fluid manipulation. This method has the potential to create functional large-area micro-devices at low-cost and with increased device flexibility, durability, prototyping speed, and reduced process complexity for applications in optoelectronics, integrated detectors, and bio-devices. The novel multi-layer photopolymer dry film and solution process also allows microstructures in micro-electro-mechanical systems (MEMS) to be built with ease and provides the functionality of MEMS integration with electronic devices and integrated circuits (ICs).

Roll-to-Roll Hot Embossing of High Aspect Ratio Micro Pillars for Superhydrophobic Applications

2019 ◽  
Vol 34 (5) ◽  
pp. 502-512 ◽  
Author(s):  
N. Kodihalli Shivaprakash ◽  
J. Zhang ◽  
T. Nahum ◽  
C. Barry ◽  
Q. Truong ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Roll To Roll ◽  
Micro Pillars

Covalent bonding-assisted nanotransfer lithography for the fabrication of plasmonic nano-optical elements

Nanoscale ◽  
2017 ◽  
Vol 9 (38) ◽  
pp. 14335-14346 ◽  
Author(s):  
Soon Hyoung Hwang ◽  
Sohee Jeon ◽  
Myung Ju Kim ◽  
Dae-Geun Choi ◽  
Jun-Hyuk Choi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Covalent Bonding ◽  
Large Area ◽  
Optical Elements

Covalent bonding-assisted nanotransfer lithography provides a means of achieving large-area and high-aspect-ratio nano-optical elements with a simple roll-to-plate process.

Fabrication of large-area high-aspect-ratio periodic nanostructures on various substrates by soft X-ray interference lithography

2017 ◽  
Vol 425 ◽  
pp. 553-557 ◽  
Author(s):  
Chaofan Xue ◽  
Jun Zhao ◽  
Yanqing Wu ◽  
Huaina Yu ◽  
Shumin Yang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Interference Lithography ◽  
Large Area ◽  
Periodic Nanostructures ◽  
X Ray

Fabrication of Large-Area Imprint Mold with High-Aspect-Ratio Nanotip Arrays of Sub-Micron Diameter

2007 ◽  
Vol 364-366 ◽  
pp. 607-612 ◽  
Author(s):  
Chia Jen Ting ◽  
Hung Yin Tsai ◽  
Chang Pin Chou
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electron Cyclotron Resonance ◽  
Plasma Process ◽  
Large Area ◽  
Ecr Plasma ◽  
Aspect Ratios ◽  
Electroforming Process ◽  
Micron Diameter ◽  
Short Time

Many research works have been focusing on nanoimprint technology due to the recent potential mass production for the nanostructure applications. For optical or display application, a nanoimprint mold of large area becomes one of the thorniest techniques since it takes much time to fabricate the whole mold with nanostructure and it may make the beginning nanostructures inconsistent with the final ones. In order to fabricate the nanostructure mold of large area in a short time, the plasma process forming nanostructures on silicon substrate and the electroforming process are explored in the current study. Well-aligned nanotip arrays of 4 inch silicon were fabricated by electron cyclotron resonance (ECR) plasma process using gas mixtures of silane, methane, argon, and hydrogen. The resultant tips have nano-scale apexes, approximately ~1 nm, with high aspect ratios, nearly ~15, which were achieved by simultaneous SiC nano-mask formation and dry etching during ECR plasma process. Next, the nickel mold of nanostructures is made from silicon nanostructures through the electroforming process by using Nickel Sulfamate. The total thickness of the nickel mold is 120 μm after a 10-hour-long electroforming process. The nanostructures of 100 nm diameter holes are successfully obtained. Nanoimprint process is proceeded by the nickel mold and the reflectance of the PMMA after imprinting at 160 °C has the lowest value, 0.2 %, compared with the other results for the incident optical wavelength of 550 nm. The large-area imprint mold with high-aspect-ratio nanotip arrays of sub-micron diameter is fabricated and is proofed by the optical application.

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