Modification of internal temperature distribution in broad area semiconductor lasers and the effect on near- and far-field distributions

2000 ◽  
Vol 147 (1) ◽  
pp. 31-35 ◽  
Author(s):  
É. O'Neill ◽  
J. McInerney ◽  
P. O'Brien ◽  
J. Houlihan
Keyword(s):  
Temperature Distribution ◽  
Semiconductor Lasers ◽  
Far Field ◽  
Internal Temperature ◽  
Broad Area ◽  
Field Distributions

1064 nm High-Power Broad Area Semiconductor Lasers with Electrode Pattern

2011 ◽  
Vol 84-85 ◽  
pp. 590-593
Author(s):  
Zhong Liang Qiao ◽  
Si Yu Zhang ◽  
Xin Gao ◽  
Peng Lu ◽  
Hui Li ◽  
...  
Keyword(s):  
Aluminum Nitride ◽  
Semiconductor Lasers ◽  
High Power ◽  
Continuous Wave ◽  
Far Field ◽  
Full Width ◽  
Half Maximum ◽  
Broad Area ◽  
Continuous Wave Output Power ◽  
Area Distribution

According to the principle of carrier diffusion, aluminum nitride (AlN) coating, and RIE deep etching technology are implemented, 1064 nm broad area distribution electrode lasers have been obtained exhibiting near single lobe near and far field. We report electrode pattern lasers emitting at 1064 nm with the minimal full width at half maximum (FWHM) horizontal angle of 2.7° while the maximum continuous-wave output power up to 3.65 W and slope efficiencies as high as 0.85 W/A.

Conductively Cooled 637-nm InGaP Broad-Area Lasers and Laser Bars With Conversion Efficiencies Up to 37% and a Small Vertical Far Field of 30$^{\circ}$

2008 ◽  
Vol 20 (22) ◽  
pp. 1824-1826 ◽  
Author(s):  
Christian Kaspari ◽  
Bernd Sumpf ◽  
Martin Zorn ◽  
JÖrg Fricke ◽  
Peter Ressel ◽  
...  
Keyword(s):  
Far Field ◽  
Broad Area ◽  
Conversion Efficiencies ◽  
Broad Area Lasers

Fabrication of narrow far-field InGaAs-InAlGaAs broad-area lasers using quantum well intermixed extended cavities

1998 ◽  
Author(s):  
O.P. Kowalski ◽  
C.J. Hamilton ◽  
S.D. McDougall ◽  
B. Vogele ◽  
J.H. Marsh ◽  
...  
Keyword(s):  
Quantum Well ◽  
Far Field ◽  
Broad Area ◽  
Broad Area Lasers

scholarly journals Thermal management evaluation of the complex electro-optical system

2017 ◽  
Vol 21 (5) ◽  
pp. 2189-2196
Author(s):  
Srecko Nijemcevic ◽  
Milan Tasic ◽  
Branko Livada ◽  
Dragana Peric ◽  
Marko Tasic
Keyword(s):  
Temperature Distribution ◽  
Thermal Management ◽  
Optical System ◽  
Life Time ◽  
System Optimization ◽  
Working Environment ◽  
Outdoor Environment ◽  
System Component ◽  
Catastrophic Failure ◽  
Internal Temperature

The thermal management of a complex electro-optical system aimed for outdoor application is challenging task due to the requirement of having an air-sealed enclosure, harsh working environment, and an additional thermal load generated by sunlight. It is essential to consider the effect of heating loads in the system components, as well as the internal temperature distribution, that can have influence on the system life expectancy, operational readiness and parameters, and possibility for catastrophic failure. The main objective of this paper is to analyze internal temperature distribution and evaluate its influence on system component operation capability. The electro-optical system simplified model was defined and related thermal balance simulation model based on Solid Works thermal analysis module was set and applied for temperature distribution calculation. Various outdoor environment scenarios were compared to evaluate system temperature distribution and evaluate its influence on system operation, reliability, and life time in application environment. This work was done during the design process as a part of the electro-optical system optimization. The results show that temperature distribution will not be cause for catastrophic failure and malfunction operation during operation in the expected environment.

Placement Optimization for Thermal Performance of Embedded Power Chip Microwave Modules Using BP-GA

2011 ◽  
Vol 189-193 ◽  
pp. 639-642
Author(s):  
Sheng Zhang ◽  
Zhao Hua Wu ◽  
Hong Yan Huang ◽  
Pin Chen ◽  
Tang Wen Bi
Keyword(s):  
Finite Element Analysis ◽  
Temperature Field ◽  
Thermal Field ◽  
Thermal Design ◽  
Internal Temperature ◽  
Element Analysis ◽  
Thermal Distribution ◽  
Placement Optimization ◽  
Field Distributions ◽  
Embedded Power

In the thermal design of Embedded Power Chip Microwave Modules, the placement of chips on substrate has a significant effect on internal temperature field, thus, influence the reliability of the modules. In this paper, Based on BP-GA, the optimization for chips placement of EPCM is achieved by corresponding optimization program. To demonstrate the effectiveness of the results, ANSYS, finite element analysis (FEA) is carried out to assess the thermal field distribution of the optimization for chips placement. The result shows that the thermal field distributions of the optimization are consistent with the FEA results. The internal highest temperature of the initial placements is 90.369°C. After optimization, the internal highest temperature is 86.128°C, the highest temperature be reduced more than 5°C. It can effectively deal with the problem about optimize the thermal placement of EPCM chips, and improves the internal thermal distribution.

Spatiotemporal chaos in broad-area semiconductor lasers

1993 ◽  
Vol 10 (4) ◽  
pp. 658 ◽  
Author(s):  
H. Adachihara ◽  
P. Ru ◽  
J. V. Moloney ◽  
O. Hess ◽  
E. Abraham
Keyword(s):  
Semiconductor Lasers ◽  
Spatiotemporal Chaos ◽  
Broad Area
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