scholarly journals Multi‐layered substrate integrated waveguide waffle‐iron filters

2020 ◽  
Vol 14 (10) ◽  
pp. 1038-1046
Author(s):  
Susan Maas ◽  
Petrie Meyer
Keyword(s):  
Substrate Integrated Waveguide ◽  
Layered Substrate

Two-Layered Substrate Integrated Waveguide Filter for UWB Applications

2017 ◽  
Vol 27 (7) ◽  
pp. 633-635 ◽  
Author(s):  
Mohammad Mahdi Honari ◽  
Rashid Mirzavand ◽  
Hossein Saghlatoon ◽  
Pedram Mousavi
Keyword(s):  
Substrate Integrated Waveguide ◽  
Layered Substrate ◽  
Waveguide Filter ◽  
Uwb Applications

Design of Compact, Single-Layered Substrate Integrated Waveguide Filtenna With Parasitic Patch

2020 ◽  
Vol 68 (2) ◽  
pp. 1134-1139
Author(s):  
Kun-Zhi Hu ◽  
Ming-Chun Tang ◽  
Dajiang Li ◽  
Yang Wang ◽  
Mei Li
Keyword(s):  
Substrate Integrated Waveguide ◽  
Parasitic Patch ◽  
Layered Substrate

Codesigned High-Efficiency Single-Layered Substrate Integrated Waveguide Filtering Antenna With a Controllable Radiation Null

2018 ◽  
Vol 17 (2) ◽  
pp. 295-298 ◽  
Author(s):  
Peng Kai Li ◽  
Chang Jiang You ◽  
Hong Fang Yu ◽  
Xiang Li ◽  
Yuan Wang Yang ◽  
...  
Keyword(s):  
High Efficiency ◽  
Substrate Integrated Waveguide ◽  
Layered Substrate

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

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