Realisation of new single‐layer triple‐mode substrate‐integrated waveguide and dual‐mode half‐mode substrate‐integrated waveguide filters using a circular shape perturbation

2013 ◽  
Vol 7 (14) ◽  
pp. 1120-1127 ◽  
Author(s):  
Morteza Rezaee ◽  
Amir Reza Attari
Keyword(s):  
Single Layer ◽  
Substrate Integrated Waveguide ◽  
Dual Mode ◽  
Circular Shape ◽  
Waveguide Filters ◽  
Shape Perturbation ◽  
Triple Mode

scholarly journals Dual-Band Dual-Mode Substrate Integrated Waveguide Filters with Independently Reconfigurable TE101 Resonant Mode

2016 ◽  
Vol 6 (1) ◽  
Author(s):  
Yongle Wu ◽  
Yuqing Chen ◽  
Lingxiao Jiao ◽  
Yuanan Liu ◽  
Zabih Ghassemlooy
Keyword(s):  
Resonant Mode ◽  
Dual Band ◽  
Substrate Integrated Waveguide ◽  
Dual Mode ◽  
Waveguide Filters

Substrate-Integrated Waveguide Filters Based on Dual-Mode Air-Filled Resonant Cavities

2018 ◽  
Vol 66 (2) ◽  
pp. 726-736 ◽  
Author(s):  
Cristiano Tomassoni ◽  
Lorenzo Silvestri ◽  
Anthony Ghiotto ◽  
Maurizio Bozzi ◽  
Luca Perregrini
Keyword(s):  
Substrate Integrated Waveguide ◽  
Dual Mode ◽  
Resonant Cavities ◽  
Waveguide Filters

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

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