Integration of dual-mode RF bandpass filter on ceramic ball grid array package

2002 ◽  
Vol 38 (19) ◽  
pp. 1106 ◽  
Author(s):  
Y.P. Zhang
Keyword(s):  
Bandpass Filter ◽  
Ball Grid Array ◽  
Dual Mode ◽  
Ceramic Ball ◽  
Ball Grid Array Package

Ceramic ball grid array package stress analysis

2017 ◽  
Author(s):  
S. H. B. S. Badri ◽  
M. H. A. Aziz ◽  
N. R. Ong ◽  
Z. Sauli ◽  
J. B. Alcain ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Ball Grid Array ◽  
Ceramic Ball ◽  
Ball Grid Array Package

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

2010 ◽  
Vol 97-101 ◽  
pp. 23-27 ◽  
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Ball Grid Array ◽  
Statistic Analysis ◽  
Curing Process ◽  
Ceramic Ball ◽  
Die Attach ◽  
Ball Grid Array Package ◽  
Flip Chip Packaging ◽  
The Impact

Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

Research on the rework process of the ceramic ball grid array package

2013 ◽  
Author(s):  
Yingzhuo Huang ◽  
Bo Huang ◽  
Pengrong Lin ◽  
Yusheng Cao ◽  
Binhao Lian ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Ceramic Ball ◽  
Ball Grid Array Package ◽  
Rework Process

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

2004 ◽  
Vol 126 (1) ◽  
pp. 41-47 ◽  
Author(s):  
Seungmin Cho ◽  
Bongtae Han ◽  
Jinwon Joo
Keyword(s):  
Thermal Cycling ◽  
Ball Grid Array ◽  
Maximum Temperature ◽  
Deformation Analysis ◽  
Temperature Dependent ◽  
Ceramic Ball ◽  
Ball Grid Array Package ◽  
Rapid Temperature ◽  
Time Observation ◽  
Accelerated Thermal Cycling

A robust scheme of moire´ interferometry for real-time observation is employed to study the temperature dependent thermo-mechanical behavior of a ceramic ball grid array package assembly. The scheme is implemented with a convection-type environmental chamber that provides the rapid temperature control required in accelerated thermal cycling. Thermal deformations are documented at various temperatures. Thermal-history dependent analyses of global and local deformations are presented. A significant nonlinear global behavior is documented due to complete stress relaxation at the maximum temperature. An analysis of solder interconnections reveals that inelastic deformation accumulates at the bottom eutectic solder fillet only at high temperatures.

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