High cooling power density SiGe/Si micro-coolers

2001 ◽  
Vol 37 (2) ◽  
pp. 126 ◽  
Author(s):  
X. Fan ◽  
G. Zeng ◽  
E. Croke ◽  
C. LaBounty ◽  
C.C. Ahn ◽  
...  
Keyword(s):  
Power Density ◽  
Cooling Power

DESIGN AND ANALYSIS OF THERMOACOUSTIC REFRIGERATOR

2013 ◽  
Vol 21 (01) ◽  
pp. 1350001 ◽  
Author(s):  
B. G. PRASHANTHA ◽  
M. S. GOVINDE GOWDA ◽  
S. SEETHARAMU ◽  
G. S. V. L. NARASIMHAM
Keyword(s):  
Boundary Layer ◽  
Power Density ◽  
Gas Pressure ◽  
Coefficient Of Performance ◽  
Cooling Power ◽  
Boundary Layer Approximation ◽  
Resonator Design ◽  
Quarter Wavelength ◽  
Calculation Results ◽  
Thermoacoustic Refrigerator

This paper deals with the design and analysis of a quarter-wavelength, 10 W capacity, thermoacoustic refrigerator using short stack boundary layer approximation assumptions. The effect of operating frequency on the performance of the refrigerator is studied using dimensional normalization technique. The variation of stack diameter with average gas pressure and cooling power is discussed. The resonator optimization is discussed and the calculation results show a 9% improvement in the coefficient of performance and 201% improvement in power density for the optimized quarter-wavelength resonator compared to published optimization studies. The optimized resonator design is tested with DeltaEC software and the results show better performance compared to past established resonator designs.

Simulation of chip-size electrocaloric refrigerator with high cooling-power density

2013 ◽  
Vol 102 (11) ◽  
pp. 112901 ◽  
Author(s):  
Haiming Gu ◽  
Brent Craven ◽  
Xiaoshi Qian ◽  
Xinyu Li ◽  
Ailan Cheng ◽  
...  
Keyword(s):  
Power Density ◽  
Cooling Power ◽  
Chip Size

scholarly journals Integration of daytime radiative cooling and solar heating for year-round energy saving in buildings

2020 ◽  
Vol 11 (1) ◽  
Author(s):  
Xiuqiang Li ◽  
Bowen Sun ◽  
Chenxi Sui ◽  
Ankita Nandi ◽  
Haoming Fang ◽  
...  
Keyword(s):  
United States ◽  
Energy Consumption ◽  
Power Density ◽  
Thermal Contact ◽  
Building Energy ◽  
The United States ◽  
Thermal Contact Conductance ◽  
Cooling Power ◽  
Dual Mode ◽  
Heating And Cooling

AbstractThe heating and cooling energy consumption of buildings accounts for about 15% of national total energy consumption in the United States. In response to this challenge, many promising technologies with minimum carbon footprint have been proposed. However, most of the approaches are static and monofunctional, which can only reduce building energy consumption in certain conditions and climate zones. Here, we demonstrate a dual-mode device with electrostatically-controlled thermal contact conductance, which can achieve up to 71.6 W/m2 of cooling power density and up to 643.4 W/m2 of heating power density (over 93% of solar energy utilized) because of the suppression of thermal contact resistance and the engineering of surface morphology and optical property. Building energy simulation shows our dual-mode device, if widely deployed in the United States, can save 19.2% heating and cooling energy, which is 1.7 times higher than cooling-only and 2.2 times higher than heating-only approaches.

Modeling of Near-Field Concentrated Solar Thermophotovoltaic Microsystem

2014 ◽  
Author(s):  
Mahmoud Elzouka ◽  
Mukesh Kulsreshath ◽  
Sidy Ndao
Keyword(s):  
Power Density ◽  
Output Power ◽  
Conversion Efficiency ◽  
Near Field ◽  
Separation Distance ◽  
Heat Radiation ◽  
Cooling Power ◽  
Emitter Temperature ◽  
Pv Cell ◽  
Field Radiation

Modeling of a near-field concentrated solar thermophotovoltaic (STPV) microsystem is carried out to investigate the use of STPV-based solid-state energy conversion as a high power density MEMS power generator. Near-field radiation can be realized between two closely separated surfaces (i.e. order of radiation wavelength), resulting in the enhancement of the heat radiation flux orders of magnitudes higher than the blackbody limit, consequently increasing cell output power density. The Near-field STPV model consists of an absorber/emitter model used to estimate the net power absorbed from solar irradiance, a near-field radiation transfer model to evaluate the power tunneled from the emitter to the PV cell at different separation distances, and a PV cell model to determine the photocurrent generated due to thermal radiation absorbed. Results reveal that decreasing separation distance between the emitter and the PV cell increases the absorber/emitter thermal efficiency, increases conversion efficiency, and the power density (×100 far-field). The results also predict increase in cooling power requirement as the separation distance is decreased, which may be a limiting design parameter for near-field STPV microsystems. Based on the model, an overall conversion efficiency of 17% at a separation distance of 10 nm and emitter temperature of 2000 K with solar concentration 6000 sun can be reached; this corresponds to an output power density of 9×105 W/m2.

Flexible microfluidic electrocaloric cooling capillary tube with giant specific device cooling power density

Joule ◽  
2022 ◽  
Author(s):  
Heng Cui ◽  
Quan Zhang ◽  
Yiwen Bo ◽  
Peijia Bai ◽  
Mengyan Wang ◽  
...  
Keyword(s):  
Power Density ◽  
Capillary Tube ◽  
Cooling Power ◽  
Specific Device

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

2005 ◽  
Author(s):  
Kazuhiko Fukutani ◽  
Ali Shakouri
Keyword(s):  
Power Density ◽  
Integrated Circuit ◽  
Heat Dissipation ◽  
Thermoelectric Module ◽  
Cooling Power ◽  
Cross Sectional ◽  
Maximum Heat ◽  
Chip Cooling ◽  
Operating Current ◽  
Key Parameter

The use of bulk thermoelectric (TE) coolers for thermal management of integrated circuit (IC) chips is analyzed by a detailed electrothermal model. Various ideal and non-ideal parameters that affect the maximum cooling performance are discussed. Thermal resistance between the hot side of the thermoelectric module and ambient is a key parameter determining maximum heat dissipation in the IC chip if its temperature should be kept below a critical value. We show that the thermoelectric geometry factor (the ratio of the leg’s cross sectional area to its length) and the TE module operating current can be optimized to significantly increase the maximum power dissipation. There is an optimum leg thickness that gives the highest cooling power density to the IC chip and further thinning of the TE module will degrade the performance. The optimum thickness and the corresponding maximum cooling power density are calculated. The effect of various material properties are also discussed.

A double-sided radiative cooling architecture with a record local cooling power density of 270 W/m2

2021 ◽  
Author(s):  
Lyu Zhou ◽  
Haomin Song ◽  
Nan Zhang ◽  
Jacob Rada ◽  
Matthew Signer ◽  
...  
Keyword(s):  
Power Density ◽  
Cooling Power ◽  
Radiative Cooling ◽  
Local Cooling

Magnetocaloric materials and the optimization of cooling power density

Cryogenics ◽  
2014 ◽  
Vol 62 ◽  
pp. 150-162 ◽  
Author(s):  
Patrick Wikus ◽  
Edgar Canavan ◽  
Sarah Trowbridge Heine ◽  
Koichi Matsumoto ◽  
Takenori Numazawa
Keyword(s):  
Power Density ◽  
Cooling Power ◽  
Magnetocaloric Materials

High Cooling Power Density of SiGe/Si Superlattice Microcoolers

2001 ◽  
Vol 691 ◽  
Author(s):  
Gehong Zeng ◽  
Xiaofeng Fan ◽  
Chris LaBounty ◽  
John E. Bowers ◽  
Edward Croke ◽  
...  
Keyword(s):  
Thin Film ◽  
Power Density ◽  
Room Temperature ◽  
Density Measurement ◽  
Thermionic Emission ◽  
Cooling Power ◽  
Thin Film Resistors ◽  
Fabrication And Characterization ◽  
Superlattice Structures

ABSTRACTFabrication and characterization of SiGe/Si superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 W/cm2 for 40 × 40 μm2 devices were measured at room temperature.

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