Simulation of the RF performance of AlGaAs/GaAs heterojunction bipolar transistors: application of fast Fourier transform

1991 ◽  
Vol 27 (6) ◽  
pp. 523
Author(s):  
L.L. Liou ◽  
A. Ezis ◽  
K. Ikossi-Anastasiou ◽  
C.I. Huang
Keyword(s):  
Fourier Transform ◽  
Fast Fourier Transform ◽  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Rf Performance

Small signal RF performance of AlGaN∕GaN heterojunction bipolar transistors

2002 ◽  
Vol 38 (3) ◽  
pp. 144 ◽  
Author(s):  
L.S. McCarthy ◽  
I.P. Smorchkova ◽  
P. Fini ◽  
M.J.W. Rodwell ◽  
J. Speck ◽  
...  
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Small Signal ◽  
Rf Performance

A comparison of the dc and rf characteristics of single and double InP/InGaAs heterojunction bipolar transistors

1996 ◽  
Vol 74 (S1) ◽  
pp. 239-242 ◽  
Author(s):  
W. R. McKinnon ◽  
S. P. McAlister ◽  
Z. Abid ◽  
E. E. Guzzo ◽  
S. Laframboise
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Heterojunction Devices ◽  
Double Heterojunction ◽  
Rf Performance ◽  
Current Blocking

The dc and rf characteristics for InP/InGaAs heterojunction bipolar transistors having a single heterojunction design were measured and compared with those for double heterojunction devices that employ a composite collector. Although the composite-collector design improves the breakdown characteristics of our devices the rf performance was not as good. This we partially attribute to the collector heterojunction, which causes "current blocking".

ULTRAHIGH fmax AlInAs/GaInAs TRANSFERRED-SUBSTRATE HETEROJUNCTION BIPOLAR TRANSISTORS FOR INTEGRATED CIRCUITS APPLICATIONS

1998 ◽  
Vol 09 (02) ◽  
pp. 643-670 ◽  
Author(s):  
BIPUL AGARWAL ◽  
RAJASEKHAR PULLELA ◽  
UDDALAK BHATTACHARYA ◽  
DINO MENSA ◽  
QING-HUNG LEE ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Bipolar Transistors ◽  
Fabrication Process ◽  
Material System ◽  
Rf Performance ◽  
Consequent Increase ◽  
Very High

Transferred-substrate heterojunction bipolar transistors (HBTs) have demonstrated very high bandwidths and are potential candidates for very high speed integrated circuit (IC) applications. The transferred-substrate process permits fabrication of narrow and aligned emitter-base and collector-base junctions, reducing the collector-base capacitance and increasing the device f max . Unlike conventional double-mesa HBTs, transferred-substrate HBTs can be scaled to submicron dimensions with a consequent increase in bandwidth. This paper introduces the concept of transferred-substrate HBTs. Fabrication process in the AlInAs/GaInAs material system is presented, followed by DC and RF performance. A demonstration IC is shown along with some integrated circuits in development.

TEM evaluation of graded SixGe1-x heterolayers

1991 ◽  
Vol 49 ◽  
pp. 894-895
Author(s):  
N. David Theodore ◽  
Mamoru Tomozane ◽  
Ming Liaw
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Gas Flow ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Dark Field ◽  
Bipolar Transistors ◽  
Structural Quality ◽  
Weak Beam ◽  
Transmission Electron ◽  
And Behavior

There is extensive interest in SiGe for use in heterojunction bipolar transistors. SiGe/Si superlattices are also of interest because of their potential for use in infrared detectors and field-effect transistors. The processing required for these materials is quite compatible with existing silicon technology. However, before SiGe can be used extensively for devices, there is a need to understand and then control the origin and behavior of defects in the materials. The present study was aimed at investigating the structural quality of, and the behavior of defects in, graded SiGe layers grown by chemical vapor deposition (CVD).The structures investigated in this study consisted of Si1-xGex[x=0.16]/Si1-xGex[x= 0.14, 0.13, 0.12, 0.10, 0.09, 0.07, 0.05, 0.04, 0.005, 0]/epi-Si/substrate heterolayers grown by CVD. The Si1-xGex layers were isochronally grown [t = 0.4 minutes per layer], with gas-flow rates being adjusted to control composition. Cross-section TEM specimens were prepared in the 110 geometry. These were then analyzed using two-beam bright-field, dark-field and weak-beam images. A JEOL JEM 200CX transmission electron microscope was used, operating at 200 kV.

TEM study of phosphorus-implanted pseudomorphic Si0.88Ge0.12 on Si(100)

1995 ◽  
Vol 53 ◽  
pp. 468-469
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Room Temperature ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Sige Hbt ◽  
Integrated Circuit Manufacturing ◽  
Microstructural Behavior

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.

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