scholarly journals Non-destructive inspection method for FRPM pipelines utilising time-domain responses of microwave guided-modes

2020 ◽  
Vol 56 (19) ◽  
pp. 982-985 ◽  
Author(s):  
S. Matsukawa ◽  
K. Yoshida ◽  
T. Okuda ◽  
M. Hazama ◽  
S. Kurokawa ◽  
...  
Keyword(s):  
Time Domain ◽  
Inspection Method ◽  
Guided Modes ◽  
Non Destructive

Microvia Non-Destructive Inspection Method

2009 ◽  
Author(s):  
Cholmin Choi ◽  
Abhijit Dasgupta
Keyword(s):  
Time Domain ◽  
Metal Layer ◽  
Experimental Methods ◽  
Time Domain Reflectometry ◽  
Reflow Process ◽  
Inspection Method ◽  
Infra Red ◽  
Inspection Techniques ◽  
Non Destructive ◽  
Poor Adhesion

In this paper, the effectiveness of two non-destructive inspection techniques were investigated for quality assessment of microvias in high-density PWBs. Manufactured PWBs can fail during the reflow process due to microvia quality issues such as thin metallization in the barrel or shoulder of microvia or poor adhesion between the microvias and the metal layer underneath. The two investigated non-destructive inspection techniques are Transient Infra-red Thermography (IRT) and Time Domain Reflectometry (TDR). This study develops experimental methods to obtain thermal signatures of microvias using IRT technique and RF impedance signatures of microvias using TDR technique. Numerical analysis methods are also developed in this study to quantify and interpret the obtained microvia signatures to validate the functionality of selected non-destructive microvia inspection techniques.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

Time Domain Reflectometry Technique for Failure Analysis

2004 ◽  
Author(s):  
Teoh King Long ◽  
Ko Yin Fern
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Reference Plane ◽  
First Case ◽  
Main Emphasis ◽  
Plastic Ball ◽  
Solder Balls ◽  
Non Destructive

Abstract In time domain reflectometry (TDR), the main emphasis lies on the reflected waveform. Poor probing contact is one of the common problems in getting an accurate waveform. TDR probe normalization is essential before measuring any TDR waveforms. The advantages of normalization include removal of test setup errors in the original test pulse and the establishment of a measurement reference plane. This article presents two case histories. The first case is about a Plastic Ball Grid Array package consisting of 352 solder balls where the open failure mode was encountered at various terminals after reliability assessment. In the second, a three-digit display LED suspected of an electrical short failure was analyzed using TDR as a fault isolation tool. TDR has been successfully used to perform non-destructive fault isolation in assisting the routine failure analysis of open and short failure. It is shown to be accurate and reduces the time needed to identify fault locations.

Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Meng Yeow Tay ◽  
Wen Qiu ◽  
J. Alton ◽  
...  
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Experimental Results ◽  
Terahertz Pulse ◽  
Isolation And Identification ◽  
Isolation Technique ◽  
Non Destructive

Abstract Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

Non-destructive Inspection Method for Defects in Epoxy Resin by using THz Wave

2020 ◽  
Author(s):  
Rieko Mizuuchi ◽  
Yuji Hisazato ◽  
Hiroaki Cho ◽  
Yusuke Nakamura ◽  
Yuichi Sumimoto ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Inspection Method ◽  
Thz Wave ◽  
Non Destructive

scholarly journals Pipeline In-Line Inspection Method, Instrumentation and Data Management

Sensors ◽  
2021 ◽  
Vol 21 (11) ◽  
pp. 3862
Author(s):  
Qiuping Ma ◽  
Guiyun Tian ◽  
Yanli Zeng ◽  
Rui Li ◽  
Huadong Song ◽  
...  
Keyword(s):  
Data Management ◽  
Petroleum Products ◽  
Metal Loss ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Inspection Method ◽  
Safety Issues ◽  
Pipeline Inspection ◽  
Inspection Systems ◽  
Non Destructive

Pipelines play an important role in the national/international transportation of natural gas, petroleum products, and other energy resources. Pipelines are set up in different environments and consequently suffer various damage challenges, such as environmental electrochemical reaction, welding defects, and external force damage, etc. Defects like metal loss, pitting, and cracks destroy the pipeline’s integrity and cause serious safety issues. This should be prevented before it occurs to ensure the safe operation of the pipeline. In recent years, different non-destructive testing (NDT) methods have been developed for in-line pipeline inspection. These are magnetic flux leakage (MFL) testing, ultrasonic testing (UT), electromagnetic acoustic technology (EMAT), eddy current testing (EC). Single modality or different kinds of integrated NDT system named Pipeline Inspection Gauge (PIG) or un-piggable robotic inspection systems have been developed. Moreover, data management in conjunction with historic data for condition-based pipeline maintenance becomes important as well. In this study, various inspection methods in association with non-destructive testing are investigated. The state of the art of PIGs, un-piggable robots, as well as instrumental applications, are systematically compared. Furthermore, data models and management are utilized for defect quantification, classification, failure prediction and maintenance. Finally, the challenges, problems, and development trends of pipeline inspection as well as data management are derived and discussed.

Non-Destructive Detection of Tobacco Filter Capsule by Terahertz Time Domain Spectroscopy

2021 ◽  
Author(s):  
Longhai Liu ◽  
Guoqiang He ◽  
Liang Wu ◽  
Chenglong Zheng ◽  
Silei Wang ◽  
...  
Keyword(s):  
Time Domain ◽  
Terahertz Time Domain Spectroscopy ◽  
Time Domain Spectroscopy ◽  
Non Destructive

scholarly journals Numerical Simulation and Experimental Study of Capacitive Imaging Technique as a Non-Destructive Testing Method

2021 ◽  
Author(s):  
Farima Abdollahi Mamoudan ◽  
Sebastien Savard ◽  
Tobin Filleter ◽  
Clemente Ibarra-Castanedo ◽  
Xavier Maldague
Keyword(s):  
Numerical Simulation ◽  
Surface Defects ◽  
Capacitive Sensor ◽  
Experimental Result ◽  
Destructive Testing ◽  
Fe Modelling ◽  
Inspection Method ◽  
Physical Experiments ◽  
Imaging Performance ◽  
Non Destructive

It was recently demonstrated that a co-planar capacitive sensor could be applied to the evaluation of materials without the disadvantages associated with the other techniques. This technique effectively detects changes in the dielectric properties of the materials due to, for instance, imperfections or variations in the internal structure, by moving a set of simple electrodes on the surface of the specimen. An AC voltage is applied to one or more electrodes and signals are detected by others. This is a promising inspection method for imaging the interior structure of the numerous materials, without the necessity to be in contact with the surface of the sample. In this paper, Finite Element (FE) modelling was employed to simulate the electric field distribution from a co-planar capacitive sensor and the way it interacts with a non-conducting sample. Physical experiments with a prototype capacitive sensor were also performed on a Plexiglas sample with sub-surface defects, to assess the imaging performance of the sensor. A good qualitative agreement was observed between the numerical simulation and experimental result.

Sign in / Sign up

Export Citation Format

Share Document