Efficiency and reliability of Fowler‐Nordheim tunnelling in CMOS floating‐gate transistors

2013 ◽  
Vol 49 (23) ◽  
pp. 1484-1486 ◽  
Author(s):  
B. Rumberg ◽  
D.W. Graham
2020 ◽  
Vol 12 (4) ◽  
pp. 281-285
Author(s):  
A. V. Martynov ◽  
N. E. Kutko

The article deals with the problem of waste disposal and, accordingly, landfills in the Moscow Region, which have now become the number 1 problem for the environment in Moscow and the Moscow Region. To solve this problem, incineration plants (IP) will be established in the near future. 4 plants will be located in the Moscow Region that will be able to eliminate 2800 thousand tons of waste per year. Burning of waste results in formation of slag making 25% of its volume, which has a very high temperature (1300.1500°C). An arrangement is considered, in which slag is sent to a water bath and heats the water to 50.90°C. This temperature is sufficient to evaporate any low-temperature substance (freons, limiting hydrocarbons, etc.), whereupon the steam of the low-temperature working medium is sent to a turbine, which produces additional electricity. The creation of a low-temperature thermal power plant (TPP) increases the reliability of electricity generation at the IP. The operation of low-temperature TPPs due to the heat of slag is very efficient, their efficiency factor being as high as 40.60%. In addition to the efficiency of TPPs, capital costs for the creation of additional devices at the IP are of great importance. Thermal power plants operating on slag are just such additional devices, so it is necessary to minimize the capital costs of their creation. In addition to equipment for the operation of TPPs, it is necessary to have a working medium in an amount determined by calculations. From the wide variety of working media, which are considered in the article, it is necessary to choose the substance with the lowest cost.


Author(s):  
Jun Hirota ◽  
Ken Hoshino ◽  
Tsukasa Nakai ◽  
Kohei Yamasue ◽  
Yasuo Cho

Abstract In this paper, the authors report their successful attempt to acquire the scanning nonlinear dielectric microscopy (SNDM) signals around the floating gate and channel structures of the 3D Flash memory device, utilizing the custom-built SNDM tool with a super-sharp diamond tip. The report includes details of the SNDM measurement and process involved in sample preparation. With the super-sharp diamond tips with radius of less than 5 nm to achieve the supreme spatial resolution, the authors successfully obtained the SNDM signals of floating gate in high contrast to the background in the selected areas. They deduced the minimum spatial resolution and seized a clear evidence that the diffusion length differences of the n-type impurity among the channels are less than 21 nm. Thus, they concluded that SNDM is one of the most powerful analytical techniques to evaluate the carrier distribution in the superfine three dimensionally structured memory devices.


Author(s):  
H. Lorenz ◽  
C. Engel

Abstract Due to the continuously decreasing cell size of DRAMs and concomitantly diminishing thickness of some insulating layers new failure mechanisms appear which until now had no significance for the cell function. For example high resistance leakage paths between closely spaced conductors can lead to retention problems. These are hard to detect by electrical characterization in a memory tester because the involved currents are in the range of pA. To analyze these failures we exploit the very sensitive passive voltage contrast of the Focused Ion Beam Microscope (FIB). The voltage contrast can further be enhanced by in-situ FIB preparations to obtain detailed information about the failure mechanism. The first part of this paper describes a method to detect a leakage path between a borderless contact on n-diffusion and an adjacent floating gate by passive voltage contrast achieved after FIB circuit modification. In the second part we will demonstrate the localization of a DRAM trench dielectric breakdown. In this case the FIB passive voltage contrast technique is not limited to the localization of the failing trench. We can also obtain the depth of the leakage path by selective insitu etching with XeF2 stopped immediately after a voltage contrast change.


2009 ◽  
Vol 48 (4) ◽  
pp. 04C153 ◽  
Author(s):  
Kosuke Ohara ◽  
Yukiharu Uraoka ◽  
Takashi Fuyuki ◽  
Ichiro Yamashita ◽  
Toshitake Yaegashi ◽  
...  

2021 ◽  
pp. 108062
Author(s):  
Maksym Paliy ◽  
Tommaso Rizzo ◽  
Piero Ruiu ◽  
Sebastiano Strangio ◽  
Giuseppe Iannaccone

Author(s):  
Zu-Jia Lo ◽  
Bipasha Nath ◽  
Yuan-Chuan Wang ◽  
Yun-Jie Huang ◽  
Hui-Chun Huang ◽  
...  

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Seongin Hong ◽  
Junwoo Park ◽  
Jung Joon Lee ◽  
Sunjong Lee ◽  
Kyungho Yun ◽  
...  

AbstractTwo-dimensional transition metal dichalcogenide materials (TMDs), such as molybdenum disulfide (MoS2), have been considered promising candidates for future electronic applications owing to their electrical, mechanical, and optical properties. Here, we present a new concept for multifunctional MoS2 flash memory by combining a MoS2 channel with a PEDOT:PSS floating layer. The proposed MoS2 memory devices exhibit a switching ratio as high as 2.3 × 107, a large memory window (54.6 ± 7.80 V), and high endurance (>1,000 cycles). As the PEDOT:PSS film enables a low-temperature solution-coating process and mechanical flexibility, the proposed P-memory can be embedded on a polyimide substrate over a rigid silicon substrate, offering high mechanical endurance (over 1,000 cycle bending test). Furthermore, both MoS2 and PEDOT:PSS have a bandgap that is desirable in optoelectronic memory operation, where charge carriers are stored differently in the floating gate depending on light illumination. As a new application that combines photodiodes and memory functions, we demonstrate multilevel memory programming based on light intensity and color.


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