Manufacturability of high-performance discrete electronic devices

2002 ◽  
Vol 14 (2) ◽  
pp. 73-78 ◽  
Author(s):  
M.J. Kelly
Keyword(s):  
High Performance ◽  
Electronic Devices

Organic Electronics

2020 ◽  
Author(s):  
Stephen R. Forrest
Keyword(s):  
Thin Film ◽  
Organic Electronics ◽  
Thin Film Transistors ◽  
High Performance ◽  
Electronic Devices ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Organic Thin Film ◽  
Graduate Studies ◽  
Organic Light

Organic electronics is a platform for very low cost and high performance optoelectronic and electronic devices that cover large areas, are lightweight, and can be both flexible and conformable to irregularly shaped surfaces such as foldable smart phones. Organics are at the core of the global organic light emitting device (OLED) display industry, and also having use in efficient lighting sources, solar cells, and thin film transistors useful in medical and a range of other sensing, memory and logic applications. This book introduces the theoretical foundations and practical realization of devices in organic electronics. It is a product of both one and two semester courses that have been taught over a period of more than two decades. The target audiences are students at all levels of graduate studies, highly motivated senior undergraduates, and practicing engineers and scientists. The book is divided into two sections. Part I, Foundations, lays down the fundamental principles of the field of organic electronics. It is assumed that the reader has an elementary knowledge of quantum mechanics, and electricity and magnetism. Background knowledge of organic chemistry is not required. Part II, Applications, focuses on organic electronic devices. It begins with a discussion of organic thin film deposition and patterning, followed by chapters on organic light emitters, detectors, and thin film transistors. The last chapter describes several devices and phenomena that are not covered in the previous chapters, since they lie outside of the current mainstream of the field, but are nevertheless important.

scholarly journals A thin, deformable, high-performance supercapacitor implant that can be biodegraded and bioabsorbed within an animal body

2021 ◽  
Vol 7 (2) ◽  
pp. eabe3097
Author(s):  
Hongwei Sheng ◽  
Jingjing Zhou ◽  
Bo Li ◽  
Yuhang He ◽  
Xuetao Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Electronic Devices ◽  
Form Factors ◽  
Time Frame ◽  
Water Soluble ◽  
Two Dimensional ◽  
Medical Electronics ◽  
Thin Structure ◽  
Shed Light

It has been an outstanding challenge to achieve implantable energy modules that are mechanically soft (compatible with soft organs and tissues), have compact form factors, and are biodegradable (present for a desired time frame to power biodegradable, implantable medical electronics). Here, we present a fully biodegradable and bioabsorbable high-performance supercapacitor implant, which is lightweight and has a thin structure, mechanical flexibility, tunable degradation duration, and biocompatibility. The supercapacitor with a high areal capacitance (112.5 mF cm−2 at 1 mA cm−2) and energy density (15.64 μWh cm−2) uses two-dimensional, amorphous molybdenum oxide (MoOx) flakes as electrodes, which are grown in situ on water-soluble Mo foil using a green electrochemical strategy. Biodegradation behaviors and biocompatibility of the associated materials and the supercapacitor implant are systematically studied. Demonstrations of a supercapacitor implant that powers several electronic devices and that is completely degraded after implantation and absorbed in rat body shed light on its potential uses.

scholarly journals Ultrathin, Lightweight, and Flexible CNT Buckypaper Enhanced Using MXenes for Electromagnetic Interference Shielding

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Rongliang Yang ◽  
Xuchun Gui ◽  
Li Yao ◽  
Qingmei Hu ◽  
Leilei Yang ◽  
...  
Keyword(s):  
Electromagnetic Interference ◽  
High Performance ◽  
Electronic Devices ◽  
Deposition Process ◽  
Shielding Effectiveness ◽  
Emi Shielding ◽  
Emi Shielding Effectiveness ◽  
X Band ◽  
Wearable Electronic Devices ◽  
Emi Se

AbstractLightweight, flexibility, and low thickness are urgent requirements for next-generation high-performance electromagnetic interference (EMI) shielding materials for catering to the demand for smart and wearable electronic devices. Although several efforts have focused on constructing porous and flexible conductive films or aerogels, few studies have achieved a balance in terms of density, thickness, flexibility, and EMI shielding effectiveness (SE). Herein, an ultrathin, lightweight, and flexible carbon nanotube (CNT) buckypaper enhanced using MXenes (Ti3C2Tx) for high-performance EMI shielding is synthesized through a facile electrophoretic deposition process. The obtained Ti3C2Tx@CNT hybrid buckypaper exhibits an outstanding EMI SE of 60.5 dB in the X-band at 100 μm. The hybrid buckypaper with an MXene content of 49.4 wt% exhibits an EMI SE of 50.4 dB in the X-band with a thickness of only 15 μm, which is 105% higher than that of pristine CNT buckypaper. Furthermore, an average specific SE value of 5.7 × 104 dB cm2 g−1 is exhibited in the 5-μm hybrid buckypaper. Thus, this assembly process proves promising for the construction of ultrathin, flexible, and high-performance EMI shielding films for application in electronic devices and wireless communications.

Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices

2017 ◽  
Vol 53 (11) ◽  
pp. 3241-3247 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Koichi Mashiko ◽  
Masataka Mochizuki
Keyword(s):  
Heat Pipe ◽  
High Performance ◽  
Electronic Devices ◽  
Cooling Module

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

Dirac nodal surface semimetallic carbon based structure as a universal anode material for metal-ion batteries with high performance

2021 ◽  
Author(s):  
Shouren Zhang ◽  
Huili Liu ◽  
Yadan Zhang ◽  
Shuaiwei Wang ◽  
Baocheng Yang
Keyword(s):  
Anode Material ◽  
High Power ◽  
Metal Ion ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Storage Battery ◽  
Nodal Surface ◽  
Power Storage ◽  
Carbon Based

The rapid development of electronic devices require the high power storage battery. However, the reported 3D carbon based materials are semiconductor or metal and used for Li- or Na-ion battery...

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