Transponder IC for inductively powered sensors

A transponder IC for wireless auto identification system

2003 5th International Conference on ASIC Proceedings (IEEE Cat No 03TH8690) ICASIC-03 ◽

10.1109/icasic.2003.1277408 ◽

2003 ◽

Author(s):

Junhua Liu ◽

Kun Yang ◽

Chun Zhang ◽

Zhihua Wang

Keyword(s):

Identification System ◽

Transponder Ic ◽

Auto Identification

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RFID 13.56MHz transponder IC frontend

CAS 2010 Proceedings (International Semiconductor Conference) ◽

10.1109/smicnd.2010.5650527 ◽

2010 ◽

Cited By ~ 1

Author(s):

V Chesaru ◽

A Pieleanu ◽

C Dan ◽

M Bodea

Keyword(s):

Transponder Ic

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Investigations of temperature sensor embedded into PCB

Microelectronics International ◽

10.1108/mi-04-2020-0019 ◽

2020 ◽

Vol 37 (4) ◽

pp. 199-204

Author(s):

Kamil Janeczek ◽

Aneta Araźna ◽

Wojciech Stęplewski ◽

Marek Kościelski ◽

Krzysztof Lipiec ◽

...

Keyword(s):

Epoxy Resin ◽

Functional Properties ◽

Integrated Circuit ◽

Printed Circuit Board ◽

Electronic Devices ◽

Circuit Board ◽

Temperature Sensitive ◽

Content Type ◽

Transponder Ic ◽

Passive Sensor

Purpose The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties. Design/methodology/approach A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries. Findings The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity. Research limitations/implications It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties. Practical implications The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way. Originality/value This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

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