Integrated antenna element for millimetre wave focal-plane arrays

Author(s):  
J.S. Kot
2018 ◽  
Vol 609 ◽  
pp. A115 ◽  
Author(s):  
R. Adam ◽  
A. Adane ◽  
P. A. R. Ade ◽  
P. André ◽  
A. Andrianasolo ◽  
...  

Context. Millimetre-wave continuum astronomy is today an indispensable tool for both general astrophysics studies (e.g. star formation, nearby galaxies) and cosmology (e.g. cosmic microwave background and high-redshift galaxies). General purpose, large-field-of-view instruments are needed to map the sky at intermediate angular scales not accessible by the high-resolution interferometers (e.g. ALMA in Chile, NOEMA in the French Alps) and by the coarse angular resolution space-borne or ground-based surveys (e.g. Planck, ACT, SPT). These instruments have to be installed at the focal plane of the largest single-dish telescopes, which are placed at high altitude on selected dry observing sites. In this context, we have constructed and deployed a three-thousand-pixel dual-band (150 GHz and 260 GHz, respectively 2 mm and 1.15 mm wavelengths) camera to image an instantaneous circular field-of-view of 6.5 arcmin in diameter, and configurable to map the linear polarisation at 260 GHz. Aims. First, we are providing a detailed description of this instrument, named NIKA2 (New IRAM KID Arrays 2), in particular focussing on the cryogenics, optics, focal plane arrays based on Kinetic Inductance Detectors, and the readout electronics. The focal planes and part of the optics are cooled down to the nominal 150 mK operating temperature by means of an adhoc dilution refrigerator. Secondly, we are presenting the performance measured on the sky during the commissioning runs that took place between October 2015 and April 2017 at the 30-m IRAM telescope at Pico Veleta, near Granada (Spain). Methods. We have targeted a number of astronomical sources. Starting from beam-maps on primary and secondary calibrators we have then gone to extended sources and faint objects. Both internal (electronic) and on-the-sky calibrations are applied. The general methods are described in the present paper. Results. NIKA2 has been successfully deployed and commissioned, performing in-line with expectations. In particular, NIKA2 exhibits full width at half maximum angular resolutions of around 11 and 17.5 arcsec at respectively 260 and 150 GHz. The noise equivalent flux densities are, at these two respective frequencies, 33±2 and 8±1 mJy s1/2. A first successful science verification run was achieved in April 2017. The instrument is currently offered to the astronomy community and will remain available for at least the following ten years.


2006 ◽  
Author(s):  
Donald Butler ◽  
Zeynep Celik-Bulter

2010 ◽  
Author(s):  
Wendy L. Sarney ◽  
John W. Little ◽  
Kimberley A. Olver ◽  
Frank E. Livingston ◽  
Krisztian Niesz ◽  
...  

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.


2019 ◽  
Vol 55 (4) ◽  
pp. 1-5 ◽  
Author(s):  
Fikri Oguz ◽  
Yetkin Arslan ◽  
Erkin Ulker ◽  
Alpan Bek ◽  
Ekmel Ozbay

2016 ◽  
Vol 52 (2) ◽  
pp. 203-209
Author(s):  
M. A. Dem’yanenko ◽  
A. I. Kozlov ◽  
A. R. Novoselov ◽  
V. N. Ovsyuk

2021 ◽  
Vol 15 (6) ◽  
Author(s):  
Alexandros Kyrtsos ◽  
John Glennon ◽  
Andreu Glasmann ◽  
Mark R. O’Masta ◽  
Binh-Minh Nguyen ◽  
...  

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