A quasi zero-magnetic-flux current sensor with large bandwidth for power semiconductor switches

Author(s):  
N. Aouda
Author(s):  
Jingwen Chen ◽  
Hongshe Dang

Background: Traditional thyristor-based three-phase soft starters of induction motor often suffer from high starting current and heavy harmonics. Moreover, both the trigger pulse generation and driving circuit design are usually complicated. Methods: To address these issues, we propose a novel soft starter structure using fully controlled IGBTs in this paper. Compared to approaches of traditional design, this structure only uses twophase as the input, and each phase is controlled by a power module that is composed of one IGBT and four diodes. Results: Consequently, both driving circuit and control design are greatly simplified due to the requirement of fewer controlled power semiconductor switches, which leads to the reduction of the total cost. Conclusion: Both Matlab/Simulink simulation results and experimental results on a prototype demonstrate that the proposed soft starter can achieve better performances than traditional thyristorbased soft starters for Starting Current (RMS) and harmonics.


2015 ◽  
Vol 15 (2) ◽  
pp. 77-84 ◽  
Author(s):  
Tao Ma ◽  
Shaotao Dai ◽  
Jingye Zhang ◽  
Lianqi Zhao

Abstract A Rogowski coil based sensor for current measurement in a cryogenic environment and results of its application for paralleled high temperature superconducting (HTS) coil current sharing are presented. The current sensor consists of a Rogowski coil and an integrator, where the coil output voltage is proportional to the derivative of primary current and the integrator transfers the differentiation to normal state. The Rogowski coil has promising applicability at cryogenic circumstance because its body is made of low temperature materials. The integrator ensures a large bandwidth with feasible magnitude, which is vital for dynamic current measurement during the quench of the HTS coil. The proposed current sensor is used for current sharing measurement of two paralleled Bi2223 HTS coils, and the experimental results show that the measurement precision is better than 0.5%.


Author(s):  
A Sowmya ◽  
Dr. D Murali

The resonant converters have attracted a lot of attention because of their high efficiency and low switching losses. This paper presents the analysis of a high voltage gain non-isolated step-up DC-DC converter topology using resonant technology. The proposed converter configuration has reduced number of power semiconductor switches compared to the existing isolated converter topology having four semiconductor switches. The proposed topology employs capacitor-inductor-capacitor (C-L-C) resonant circuit configuration. The size of the proposed converter and the losses in the converter are greatly reduced. Both the converters with resonant components are simulated in Matlab/Simulink platform to validate their performance. The time-domain simulation results demonstrate that the proposed non-isolated converter gives improved voltage gain compared to the existing two-stage isolated resonant DC-DC converter.


2021 ◽  
Vol 11 (18) ◽  
pp. 8302
Author(s):  
Giuseppe Mauromicale ◽  
Alessandro Sitta ◽  
Michele Calabretta ◽  
Salvatore Massimo Oliveri ◽  
Gaetano Sequenzia

New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been developed, and many more are in the design stage. New and more integrated power devices are useful to guarantee the performances in electric vehicles, in terms of thermal management, size reduction, and low power losses. In this paper, a GaN-based system in package solution is simulated to assess the structure temperature submitted to a Joule heating power loss. The monolithic package solution involves a half-bridge topology, as well as a driver logic. A novel integrated electromagnetic and thermal method, based on finite element simulations, is proposed in this work. More specifically, dynamic electric power losses of the copper interconnections are computed in the first simulation stage, by an electromagnetic model. In the second stage, the obtained losses’ geometrical map is imported in the finite element thermal simulation, and it is considered as the input. Hence, the temperature distribution of the package’s copper traces is computed. The simulation model verifies the proper design of copper traces. The obtained temperature swing avoids any thermal-related reliability bottleneck.


2019 ◽  
Vol 90 (9) ◽  
pp. 096103
Author(s):  
Zhengyu Ou ◽  
Hai Zhou ◽  
Aichao Yang ◽  
Caijiang Lu ◽  
Renren Zhu ◽  
...  

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