Origami Folding Technique using Flexible Substrate with Arrays of Vivaldi Antennas

2018 ◽  
Author(s):  
C.C.H. Ng ◽  
P.R. Young
Keyword(s):  
Flexible Substrate ◽  
Vivaldi Antennas

Thickness Effects on Microwave Magnetic Properties of FeCoBSi Films Deposited on Flexible Substrate

PIERS Online ◽  
2010 ◽  
Vol 6 (2) ◽  
pp. 105-108 ◽  
Author(s):  
Haipeng Lu ◽  
Jing Yang ◽  
Longjiang Deng
Keyword(s):  
Magnetic Properties ◽  
Flexible Substrate

Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending Deformation

2011 ◽  
Author(s):  
Byoung-Joon Kim ◽  
Hae-A-Seul Shin ◽  
In-Suk Choi ◽  
Young-Chang Joo
Keyword(s):  
Fatigue Resistance ◽  
Electrical Resistance ◽  
Metal Film ◽  
Flexible Substrate ◽  
Resistance Change ◽  
Cyclic Bending ◽  
Capping Layer ◽  
Bending Strain ◽  
Cu Film ◽  
Electrical Resistance Change

Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.

Structure and Optical Properties CdS and CdTe Films on Flexible Substrate Obtained by DC Magnetron Sputtering for Solar Cells

2017 ◽  
Vol 9 (5) ◽  
pp. 05035-1-05035-6 ◽  
Author(s):  
G. I. Kopach ◽  
◽  
R. P. Mygushchenko ◽  
G. S. Khrypunov ◽  
A. I. Dobrozhan ◽  
...  
Keyword(s):  
Optical Properties ◽  
Solar Cells ◽  
Magnetron Sputtering ◽  
Flexible Substrate ◽  
Dc Magnetron Sputtering ◽  
Cdte Films

A temperature sensor based on flexible substrate with ultra-high sensitivity for low temperature measurement

2020 ◽  
Vol 315 ◽  
pp. 112341
Author(s):  
Zhaojun Liu ◽  
Bian Tian ◽  
Xu Fan ◽  
Jiangjiang Liu ◽  
Zhongkai Zhang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Temperature Measurement ◽  
Temperature Sensor ◽  
Flexible Substrate ◽  
High Sensitivity

scholarly journals Droplet impact onto a spring-supported plate: analysis and simulations

2021 ◽  
Vol 128 (1) ◽  
Author(s):  
Michael J. Negus ◽  
Matthew R. Moore ◽  
James M. Oliver ◽  
Radu Cimpeanu
Keyword(s):  
High Speed ◽  
Flexible Substrate ◽  
Practical Importance ◽  
Hybrid Approach ◽  
Hydrodynamic Pressure ◽  
Analytical Framework ◽  
Canonical System ◽  
Linear Process ◽  
Plate Motion ◽  
The Impact

AbstractThe high-speed impact of a droplet onto a flexible substrate is a highly non-linear process of practical importance, which poses formidable modelling challenges in the context of fluid–structure interaction. We present two approaches aimed at investigating the canonical system of a droplet impacting onto a rigid plate supported by a spring and a dashpot: matched asymptotic expansions and direct numerical simulation (DNS). In the former, we derive a generalisation of inviscid Wagner theory to approximate the flow behaviour during the early stages of the impact. In the latter, we perform detailed DNS designed to validate the analytical framework, as well as provide insight into later times beyond the reach of the proposed analytical model. Drawing from both methods, we observe the strong influence that the mass of the plate, resistance of the dashpot, and stiffness of the spring have on the motion of the solid, which undergo forced damped oscillations. Furthermore, we examine how the plate motion affects the dynamics of the droplet, predominantly through altering its internal hydrodynamic pressure distribution. We build on the interplay between these techniques, demonstrating that a hybrid approach leads to improved model and computational development, as well as result interpretation, across multiple length and time scales.

scholarly journals Fabrication of Piezoelectric ZnO Nanowires Energy Harvester on Flexible Substrate Coated with Various Seed Layer Structures

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1433
Author(s):  
Taoufik Slimani Tlemcani ◽  
Camille Justeau ◽  
Kevin Nadaud ◽  
Daniel Alquier ◽  
Guylaine Poulin-Vittrant
Keyword(s):  
Seed Layer ◽  
Layer Structure ◽  
Mechanical Energy ◽  
Flexible Substrate ◽  
Average Power ◽  
Electrical Characterization ◽  
Zno Nanowires ◽  
Device Structure ◽  
Layer Structures ◽  
Electrical Output

Flexible piezoelectric nanogenerators (PENGs) are very attractive for mechanical energy harvesting due to their high potential for realizing self-powered sensors and low-power electronics. In this paper, a PENG that is based on zinc oxide (ZnO) nanowires (NWs) is fabricated on flexible and transparent Polydimethylsiloxane (PDMS) substrate. The ZnO NWs were deposited on two different seed layer structures, i.e., gold (Au)/ZnO and tin-doped indium-oxide (ITO)/ZnO, using hydrothermal synthesis. Along with the structural and morphological analyses of ZnO NWs, the electrical characterization was also investigated for ZnO NWs-based flexible PENGs. In order to evaluate the suitability of the PENG device structure, the electrical output performance was studied. By applying a periodic mechanical force of 3 N, the ZnO NWs-based flexible PENG generated a maximum root mean square (RMS) voltage and average power of 2.7 V and 64 nW, respectively. Moreover, the comparison between the fabricated device performances shows that a higher electrical output can be obtained when ITO/ZnO seed layer structure is adopted. The proposed ZnO NWs-based PENG structure can provide a flexible and cost-effective device for supplying portable electronics.

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