The effect of the moving boundary on molecular diffusion controlled dissolution or growth kinetics

1962 ◽  
Vol 58 ◽  
pp. 2468 ◽  
Author(s):  
A. R. Cooper
Keyword(s):  
Growth Kinetics ◽  
Moving Boundary ◽  
Molecular Diffusion ◽  
Diffusion Controlled

Measurement of Growth Kinetics of Deeply Undercooled Zr50Cu50 Melt by Electromagnetic Levitation Technique

2014 ◽  
Vol 513-517 ◽  
pp. 56-59
Author(s):  
Li Xin Li ◽  
Jun Liang Zhao ◽  
Xue Mao Guan
Keyword(s):  
Crystal Growth ◽  
Growth Kinetics ◽  
Electromagnetic Levitation ◽  
Maximum Growth ◽  
Maximum Growth Rate ◽  
Diffusion Controlled ◽  
Crystal Growth Mechanism ◽  
Crystal Growth Kinetics ◽  
First Time ◽  
Kinetics Of

The crystal growth kinetics in the deeply undercooled Zr50Cu50 melt was studied with the electromagnetic levitation technique. The maximum growth rate umax was, for the first time, demonstrated in undercooled metal and alloy melts, and this allowed us to construct the complete profile of crystal growth kinetics in the whole undercooling region of Zr50Cu50 melt. In deep undercooling region near glass transition, the diffusion-controlled crystal growth mechanism accounted for the growth kinetics, while at lower undercooling the profile around umax remarkably differed from what the classical growth theory covers.

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chung-Yung Lin
Keyword(s):  
Growth Kinetics ◽  
Composite Solder ◽  
Solder Matrix ◽  
Alloying Elements ◽  
Alloying Element ◽  
Content Type ◽  
Flat Substrate ◽  
Diffusion Controlled ◽  
Kinetics Of ◽  
Rate Controlling Step

Purpose This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element. Design/methodology/approach A composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied. Findings Experimental results showed that only the IMC Ni3Sn4 was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements. Originality/value The similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate.

Diffusion Controlled Abnormal Grain Growth in Ceramics

2007 ◽  
Vol 558-559 ◽  
pp. 1227-1236 ◽  
Author(s):  
Shen J. Dillon ◽  
Martin P. Harmer
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Growth Kinetics ◽  
Abnormal Grain Growth ◽  
Growth Theory ◽  
Diffusion Controlled ◽  
Grain Growth Kinetics ◽  
Kinetics Of

The grain growth kinetics of silica and calcia doped alumina at 1400oC and their grain boundary complexion is characterized. These data are compared to predictions of both diffusion controlled and nucleation limited interface controlled grain growth theory. It is deduced from the indicators that the mechanism for normal and abnormal grain growth in these aluminas is diffusion controlled.

A Kinetic study of Cadmium(Ii) Adsorption on Lewatit Tp260 Resin

2003 ◽  
Vol 2003 (3) ◽  
pp. 144-146 ◽  
Author(s):  
Francisco José Alguacil
Keyword(s):  
Ion Exchange ◽  
Moving Boundary ◽  
Exchange Resin ◽  
Ion Exchange Resin ◽  
Langmuir Equation ◽  
Metal Adsorption ◽  
Particle Diffusion ◽  
Operating Variables ◽  
Concentration Time ◽  
Diffusion Controlled

Cadmium(II) adsorption from aqueous sulphate medium on Lewatit TP260 cationic (di-Na+) ion exchange resin was investigated. The influence of operating variables such as aqueous pH, metal concentration, time and temperature on the equilibrium parameters was studied. Cadmium(II) adsorption on the resin can described by the Langmuir equation, whereas cadmium(II) uptake is particle diffusion controlled. The moving boundary particle diffusion model only fits the initial metal adsorption on the resin.

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