Integrated cross-section interface engineering and surface encapsulating strategy: a high-response, waterproof, and low-cost paper-based bending strain sensor

2021 ◽  
Author(s):  
Zaihua Duan ◽  
Yadong Jiang ◽  
Qi Huang ◽  
Qiuni Zhao ◽  
Zhen Yuan ◽  
...  
Keyword(s):  
Cross Section ◽  
Flexible Electronics ◽  
Low Cost ◽  
Strain Sensor ◽  
High Response ◽  
Interface Engineering ◽  
Bending Deformation ◽  
Bending Strain ◽  
Integrated Cross Section

In recent years, the paper-based bending strain (PBS) sensor for bending deformation and angle detections has attracted much attention in flexible electronics. However, the PBS sensor based on the surface...

scholarly journals Skin-Like Strain Sensors Enabled by Elastomer Composites for Human–Machine Interfaces

Coatings ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 711
Author(s):  
Chunki Yiu ◽  
Tsz Hung Wong ◽  
Yiming Liu ◽  
Kuanming Yao ◽  
Ling Zhao ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Mechanical Performance ◽  
Mechanical Stability ◽  
Low Cost ◽  
Strain Sensor ◽  
Wearable Electronics ◽  
Mechanical Motion ◽  
Metallic Electrode ◽  
Resistance Change ◽  
Human Machine Interfaces

Flexible electronics exhibit tremendous potential applications in biosensing and human–machine interfaces for their outstanding mechanical performance and excellent electrical characteristics. In this work, we introduce a soft, skin-integrated strain sensor enabled by a ternary elastomer composite of graphene/carbon nanotube (CNT)/Ecoflex, providing a low-cost skin-like platform for conversion of mechanical motion to electricity and sensing of human activities. The device exhibits high sensitivity (the absolute value of the resistance change rate under a testing strain level, 26) and good mechanical stability (surviving ~hundreds of cycles of repeated stretching). Due to the advanced mechanical design of the metallic electrode, the strain sensor shows excellent mechanical tolerance to pressing, bending, twisting, and stretching. The flexible sensor can be directly mounted onto human skin for detecting mechanical motion, exhibiting its great potential in wearable electronics and human–machine interfaces.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Development of a Strain Transferring Sensor Housing for a Lumbar Spinal Fusion Detection System

2006 ◽  
Vol 1 (2) ◽  
pp. 159-164 ◽  
Author(s):  
J. W. Aebersold ◽  
W. P. Hnat ◽  
M. J. Voor ◽  
R. M. Puno ◽  
D. J. Jackson ◽  
...  
Keyword(s):  
Finite Element ◽  
Spinal Fusion ◽  
Detection System ◽  
Spinal Instrumentation ◽  
Strain Sensor ◽  
Internal Surface ◽  
Disc Disease ◽  
Bending Strain ◽  
Exploratory Surgery

Lumbar arthrodesis or spinal fusion is usually performed to relieve back pain, and regain functionality from degenerative disc disease, trauma, etc. Fusion is determined from radiographic images (X-ray) or computed tomography scans, yet these inspection procedures are subjective methods of review. As a result, exploratory surgery is performed if the presence of fusion cannot be confirmed. Therefore, a need exists to provide objective data to determine the presence of fusion that could avoid the cost, pain, and risk of exploratory surgery. One method to achieve this objective is to observe bending strain from spinal rods implanted during surgery. A system has been developed that will attach to the spinal instrumentation rods, transmit strain information wirelessly, and without the use of batteries. Major components of the system include a strain transferring sensor housing, a microelectromechanical (MEMS)-based strain sensor, telemetry circuitry, and antennae. Only discussed herein are the design, testing, and results of the housing without a cover and its ability to transfer strain from the rod to an internal surface where a foil strain gage is attached to characterize strain transfer efficiency. Strain gauges rather than the MEMS sensor were employed for housing characterization due cost and limited availability. Design constraints for the housing are long-term implantation, small size, greater than 95% transfer of bending strain from the spinal rods to the internal strain sensor, and ease of installation. ABAQUS finite element modeling software was employed to develop a working model that was fabricated using polyetheretherkeytone. The housing underwent cycle testing in a material testing system to simulate long-term implantation along with static testing to determine if creep was present. Both series of tests showed that the housing’s response did not degrade over a period of time and there was no indication of creep. The experimental results also validated the results of the ABAQUS finite element model.

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

When circuits are printed, labels can talk - New nanomaterials enable low cost flexible electronics

2009 ◽  
Vol 21 (2) ◽  
pp. A18-A23 ◽  
Author(s):  
Volker Arning ◽  
Mark A.M. Leenen ◽  
Jürgen Steiger ◽  
Ralf Anselmann
Keyword(s):  
Flexible Electronics ◽  
Low Cost

scholarly journals Low Dark Current and Performance Enhanced Perovskite Photodetector by Graphene Oxide as an Interfacial Layer

Nanomaterials ◽  
2022 ◽  
Vol 12 (2) ◽  
pp. 190
Author(s):  
Ali Hassan ◽  
Muhammad Azam ◽  
Yeong Hwan Ahn ◽  
Muhammad Zubair ◽  
Yu Cao ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Dark Current ◽  
High Performance ◽  
Carrier Transport ◽  
Defect Density ◽  
Low Cost ◽  
Degradation Process ◽  
Device Performance ◽  
Interface Engineering ◽  
Defect Passivation

Organic–inorganic hybrid perovskite photodetectors are gaining much interest recently for their high performance in photodetection, due to excellent light absorption, low cost, and ease of fabrication. Lower defect density and large grain size are always favorable for efficient and stable devices. Herein, we applied the interface engineering technique for hybrid trilayer (TiO2/graphene oxide/perovskite) photodetector to attain better crystallinity and defect passivation. The graphene oxide (GO) sandwich layer has been introduced in the perovskite photodetector for improved crystallization, better charge extraction, low dark current, and enhanced carrier lifetime. Moreover, the trilayer photodetector exhibits improved device performance with a high on/off ratio of 1.3 × 104, high responsivity of 3.38 AW−1, and low dark current of 1.55 × 10−11 A. The insertion of the GO layer also suppressed the perovskite degradation process and consequently improved the device stability. The current study focuses on the significance of interface engineering to boost device performance by improving interfacial defect passivation and better carrier transport.

Flexible and Degradable Paper-Based Strain Sensor with Low Cost

2017 ◽  
Vol 5 (11) ◽  
pp. 10538-10543 ◽  
Author(s):  
Hanbin liu ◽  
Huie Jiang ◽  
Fei Du ◽  
Danping Zhang ◽  
Zhijian Li ◽  
...  
Keyword(s):  
Low Cost ◽  
Strain Sensor

Evaluation of a low-cost optical-fiber-based strain sensor

1999 ◽  
Author(s):  
D. C. Inder ◽  
M. A. Buckley ◽  
Tonguy Liu ◽  
Gerard F. Fernando
Keyword(s):  
Optical Fiber ◽  
Low Cost ◽  
Strain Sensor

scholarly journals Bias Stress in Organic Thin-Film Transistors Towards Low-Cost Flexible Gas Sensors

2021 ◽  
Vol 16 (2) ◽  
pp. 1-11
Author(s):  
José Enrique Eirez Izquierdo ◽  
José Diogo da Silva Oliveira ◽  
Vinicius Augusto Machado Nogueira ◽  
Dennis Cabrera García ◽  
Marco Roberto Cavallari ◽  
...  
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
Thin Film Transistors ◽  
Low Cost ◽  
Thin Film Deposition ◽  
Dielectric Surface ◽  
Organic Thin Film Transistors ◽  
Film Deposition ◽  
Organic Thin Film ◽  
Bias Stress

This work is focused on the bias stress (BS) effects in Organic Thin-Film Transistors (OTFTs) from poly(2,5-bis(3-alkylthiophen-2-yl)thieno[3,2-b]thiophene) (PBTTT-C14) on both highly-doped Si and glass substrates. While the former had a thermally-grown SiO2 dielectric, the latter demanded an alternative dielectric that should be capable to withstand bottom contact lithography, as well as semiconducting thin-film deposition. In addition, it should represent one more step towards flexible electronics. In order to do that, poly(4-vinylphenol) (PVP) was blended to poly(melamine-co-formaldehyde) methylated (PMF). OTFTs on glass with a cross-linked polymer dielectric had a charge carrier mobility (μ) of 4.0x10-4 cm2/Vs, threshold voltage (VT) of 18 V, current modulation (ION/OFF) higher than 1x102, and subthreshold slope (SS) of -7.7 V/dec. A negative BS shifted VT towards negative values and produced an increase in ION/OFF. A positive BS, on the other hand, produced the opposite effect only for OTFTs on Si. This is believed to be due to a higher trapping at the PVP:PMF interface with PBTTT-C14. Modeling the device current along time by a stretched exponential provided shorter time constants of ca. 105 s and higher exponents of 0.7–0.9 for devices on glass. Due to the presence of increased BS effects, the application of organic TFTs based on PVP:PMF as flexible sensors will require compensating circuits, lower voltages or less measurements in time. Alternatively, BS effects could be reduced by a dielectric surface treatment.

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