A highly reversible sodium metal anode by mitigating electrodeposition overpotential
Herein, we successfully introduce a sodiophilic Na–Cu–P composites via in situ alloying reaction, which can greatly mitigate the tip/growth/nucleation overpotential during Na deposition, thereby to realize a stable Na plating/stripping behaviors.
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2021 ◽
Vol 896
◽
pp. 115301
Keyword(s):