Highly Thermoconductive Yet Ultraflexible Polymer Composite with Superior Mechanical Properties and Autonomous Self-Healing Functionality via Binary Fillers Strategy

2022 ◽  
Author(s):  
Dong Wang ◽  
Dingyao Liu ◽  
JianHua Xu ◽  
JiaJun Fu ◽  
Kai Wu

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction...

RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.


Author(s):  
Peter Rodgers ◽  
Valerie Eveloy ◽  
Antoine Diana ◽  
Ismail Darawsheh ◽  
Fahad Almaskari

The thermal, mechanical, and morphological characteristics of three selected commercially available, injection-moldable, high thermal conductivity (20–32 W/m K), polyimide 66 (PA66) polymer composites from two vendors are characterized for possible heat exchange applications in electronic equipment. The fillers are found to consist of 10 μm diameter, 120–350 μm long fibers, made of carbon in two composites, and a hybrid combination of essentially carbon, oxygen, and silicon in the third composite. Fiber weight loading ranges from 63% to 69%. The hybrid, high-length fiber-reinforced material overall displays superior mechanical properties (i.e., ultimate tensile, flexural and impact strengths, and flexural modulus) compared with the other two carbon-filled composites. For the hybrid-filled and one carbon-filled material (both having a thermal conductivity of 20 W/m K), good agreement between mechanical property measurements and corresponding vendor data is obtained. For the material having the highest vendor-specified thermal conductivity (i.e., 32 W/m K) and weight filler fraction (i.e., 69%), mechanical properties are up to 37% lower than corresponding vendor data. The heat transfer rates of parallel plate, cross-flow air–water heat exchanger prototypes made of the three PA66 materials are comparable to that of an aluminum prototype having the same geometry. Based on the combined heat transfer and mechanical property characterization results, the hybrid, long fiber-filled PA66 polymer composite appears to have the best combination of mechanical and heat transfer characteristics, for potential use in electronics heat exchange applications.


2017 ◽  
Vol 9 (2) ◽  
pp. 1801-1809 ◽  
Author(s):  
Jarrod C. Williams ◽  
Baochau N. Nguyen ◽  
Linda McCorkle ◽  
Daniel Scheiman ◽  
Justin S. Griffin ◽  
...  

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.


RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).


Materials ◽  
2019 ◽  
Vol 12 (17) ◽  
pp. 2770 ◽  
Author(s):  
Dongxu Wu ◽  
Congliang Huang ◽  
Yukai Wang ◽  
Yi An ◽  
Chuwen Guo

In this work, SiC and Cu particles were utilized to enhance the thermal and mechanical properties of Al matrix composites. The ball-milling and cold-compact methods were applied to prepare Al matrix composites, and the uniform distribution of SiC and Cu particles in the composite confirms the validity of our preparation method. After characterizing the thermal conductivity and the compressibility of the prepared composites, results show that small particles have a higher potential to improve compressibility than large particles, which is attributed to the size effect of elastic modulus. The addition of SiC to the Al matrix will improve the compressibility behavior of Al matrix composites, and the compressibility can be enhanced by 100% when SiC content is increased from 0 to 30%. However, the addition of SiC particles has a negative effect on thermal conductivity because of the low thermal conductivity of SiC particles. The addition of Cu particles to Al-SiC MMCs could further slightly improve the compressibility behavior of Al-SiC/Cu MMCs, while the thermal conductivity could be enhanced by about 100% when the Cu content was increased from 0 to 30%. To meet the need for low density and high thermal conductivity in applications, it is more desirable to enhance the specific thermal conductivity by enlarging the preparation pressure and/or sintering temperature. This work is expected to supply some information for preparing Al matrix composites with low density but high thermal conductivity and high compressibility.


Nanoscale ◽  
2018 ◽  
Vol 10 (8) ◽  
pp. 3759-3768 ◽  
Author(s):  
Bohayra Mortazavi ◽  
Meysam Makaremi ◽  
Masoud Shahrokhi ◽  
Mostafa Raeisi ◽  
Chandra Veer Singh ◽  
...  

Mechanical properties, thermal conductivity, electronic and optical responses of borophene hydride, a newly synthesized 2D material are explored using the first-principles simulations.


2015 ◽  
Vol 833 ◽  
pp. 48-51 ◽  
Author(s):  
Wei Shi ◽  
Jia Yan Li ◽  
Qi Fan You ◽  
Tong Lu ◽  
Yi Tan

Matrix derived from resin after carbonization in rigid carbon felt thermal insulation has many advantages. The microstructures and properties of these materials were investigated in this paper. Results showed that matrix tend to accumulate at the intersections of fibers. This can improve mechanical properties and have a little influence on thermal conductivities of the composites. The excellent bending strength of 2.66MPa, compressive strength of 0.91MPa and a high thermal conductivity of 0.81W/(m·K) (at 1500°C) with a matrix concentration of 32.7% is achieved. However, high thermal conductivity is harmful for those materials which are used as thermal insulators.


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