High growth rate and high wet etch resistance silicon nitride grown by low temperature plasma enhanced atomic layer deposition with a novel silylamine precursor
Keyword(s):
Trisilylamine homolog, tris(disilanyl)amine (TDSA), is introduced as a novel precursor for the deposition of highly etch resistant silicon nitride thin films having a high growth rate at a low temperature (<300 °C) using plasma enhanced ALD process.
2015 ◽
Vol 7
(40)
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pp. 22525-22532
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2019 ◽
Vol 45
(6)
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pp. 7407-7412
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Keyword(s):
High growth-rate atomic layer deposition process of cerium oxide thin film for solid oxide fuel cell
2019 ◽
Vol 45
(3)
◽
pp. 3811-3815
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Keyword(s):
2018 ◽
Vol 6
(24)
◽
pp. 6471-6482
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Keyword(s):
2012 ◽
Vol 30
(1)
◽
pp. 011504
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