Adhesion performance study of a novel microstructured stamp for micro transfer printing

Soft Matter ◽  
2021 ◽  
Author(s):  
Cunman Liang ◽  
Fujun Wang ◽  
Zhichen Huo ◽  
Beichao Shi ◽  
Yanling Tian ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Heterogeneous Materials ◽  
Transfer Printing ◽  
Performance Study ◽  
Materials Integration ◽  
Nano Scale ◽  
Adhesion Performance

Micro transfer printing is an effective method that enables micro/nano-scale heterogeneous materials integration for flexible electronics. As the key component of micro transfer printing equipment, the stamp is adopted to...

Microfabricated Instrumented Composite Stamps for Transfer Printing

2015 ◽  
Vol 3 (2) ◽  
Author(s):  
Numair Ahmed ◽  
John A. Rogers ◽  
Placid M. Ferreira
Keyword(s):  
Vantage Point ◽  
Strain Gauges ◽  
Stretchable Electronics ◽  
Adhesion Forces ◽  
Transfer Printing ◽  
Single Cycle ◽  
Flexible Displays ◽  
Materials Integration ◽  
Substrate Interaction ◽  
Nano Scale

Transfer printing is an emerging process that enables micro- and nano-scale heterogeneous materials integration for applications such as flexible displays, biocompatible sensors, stretchable electronics, and others. It transfers prefabricated micro- and nano-scale functional structures, referred to as “ink,” from growth or fabrication donor substrates to functional receiver substrates using a soft polymeric “stamp,” typically made from polydimethylsiloxane (PDMS) with patterned posts for selectively engaging the ink. In high throughput implementations of the process, where several structures or inks are transferred in a single cycle, the ability to detect contact and monitor localized forces at each post during critical events in the printing process allows for the development of a robust and reliable manufacturing process. It also provides a unique vantage point from which to study fundamental issues and phenomena associated with adhesion and delamination of thin films from a variety of substrate materials. In this paper, we present a new composite stamp design consisting of SU-8 cantilevers instrumented with strain gauges, embedded in a thin film of PDMS patterned with posts, and supported by a backing layer. The fabrication of such a stamp, its testing and calibration are discussed. The use of the instrumented stamp in measuring adhesion forces between silicon and PDMS is demonstrated. New modes of programming the print cycle that monitor forces to control the stamp–substrate interaction are also demonstrated. Finally, a classifier-based approach to detecting failed pick-up or release of the ink is developed and demonstrated to work within a transfer printing cycle.

Process Performance of Silicon Thin-Film Transfer Using Laser Micro-Transfer Printing

2014 ◽  
Author(s):  
Ala’a Al-okaily ◽  
Placid Ferreira
Keyword(s):  
Process Parameters ◽  
Substrate Material ◽  
Optimal Operation ◽  
Process Performance ◽  
Transfer Printing ◽  
Silicon Thin Film ◽  
Materials Integration ◽  
Operation Conditions ◽  
Fea Model ◽  
Transfer Method

Micro-transfer printing is rapidly emerging as an effective pathway for heterogeneous materials integration. The process transfers pre-fabricated micro- and nano-scale structures, referred to as “ink,” from growth donor substrates to functional receiving substrates. As a non-contact pattern transfer method, Laser Micro-Transfer Printing (LMTP) has been introduced to enhance the capabilities of transfer printing technology to be independent of the receiving substrate material, geometry, and preparation. Using micro fabricated square silicon as inks and polydimethylsiloxane (PDMS) as the stamp material. The previous work on the LMTP process focused on experimentally characterizing and modeling the effects of transferred inks’ sizes and thicknesses, and laser beam powers on the laser-driven delamination process mechanism. In this paper, several studies are conducted to understand the effects of other process parameters such as stamp post dimensions (size and height), PDMS formulation for the stamp, ink-stamp alignment, and the shape of the transferred silicon inks on the LMTP performance and mechanism. The studies are supported by both experimental data for the laser pulse duration required to initiate the delamination, and thermo-mechanical FEA model predictions of the energy stored at the interface’s edges to release the ink (Energy Release Rate (ERR)), stress levels at the delamination crack tip (Stress Intensity Factors (SIFs)), and interfacial temperature. This study, along with previous studies, should help LMTP users to understand the effects of the process parameters on the process performance so as to select optimal operation conditions.

scholarly journals ZnO Microcrystals for Light Emitting Diode and Photovoltaic Applications with Integration on Flexible Substrates

2009 ◽  
Vol 1192 ◽  
Author(s):  
Jesse J Cole ◽  
Heiko Jacobs
Keyword(s):  
Flexible Electronics ◽  
Light Emitting Diode ◽  
Flexible Substrate ◽  
Oxygen Plasma Treatment ◽  
Near Band Edge ◽  
Transfer Printing ◽  
Light Emitting ◽  
Integration Approach ◽  
Photovoltaic Applications

AbstractWe report a new integration approach to produce arrays of ZnO microcrystals for optoelectronic and photovoltaic applications. Demonstrated applications are n-ZnO/p-GaN heterojunction LEDs and photovoltaic cells. The integration process uses an oxygen plasma treatment in combination with a photoresist pattern on Magnesium doped GaN substrates to define a narrow sub-100nm width nucleation region. ZnO is synthesized in the defined areas by a hydrothermal technique using zinc acetate and hexamethylenetetramine precursors. Nucleation is followed by lateral epitaxial overgrowth producing single crystal disks of ZnO. The process provides control over the dimension and location of the ZnO crystals. The quality of the patterned ZnO is high; the commonly observed defect related emission in the electroluminescence spectra is suppressed and a single near-band-edge UV peak is observed. Transfer printing of the ZnO microcrystals onto a flexible substrate is also demonstrated in the context of transparent flexible electronics.

Heterogeneous materials integration: compliant substrates to active device and materials packaging

2001 ◽  
Vol 87 (3) ◽  
pp. 317-322 ◽  
Author(s):  
A.S Brown ◽  
W.A Doolittle ◽  
N.M Jokerst ◽  
S Kang ◽  
S Huang ◽  
...  
Keyword(s):  
Heterogeneous Materials ◽  
Active Device ◽  
Materials Integration ◽  
Compliant Substrates

High-Resolution Transfer Printing of Graphene Lines for Fully Printed, Flexible Electronics

ACS Nano ◽  
2017 ◽  
Vol 11 (7) ◽  
pp. 7431-7439 ◽  
Author(s):  
Donghoon Song ◽  
Ankit Mahajan ◽  
Ethan B. Secor ◽  
Mark C. Hersam ◽  
Lorraine F. Francis ◽  
...  
Keyword(s):  
High Resolution ◽  
Flexible Electronics ◽  
Transfer Printing

scholarly journals High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Abhishek Singh Dahiya ◽  
Dhayalan Shakthivel ◽  
Yogeenth Kumaresan ◽  
Ayoub Zumeit ◽  
Adamos Christou ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Functional Materials ◽  
Transfer Printing ◽  
Semiconducting Materials ◽  
Large Area ◽  
Contact Printing ◽  
Scale Structures ◽  
Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

scholarly journals Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Ayoub Zumeit ◽  
Abhishek Singh Dahiya ◽  
Adamos Christou ◽  
Dhayalan Shakthivel ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Field Effect Transistors ◽  
High Mobility ◽  
Single Step ◽  
High Yield ◽  
Transfer Printing ◽  
Large Area ◽  
Direct Printing

AbstractTransfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

Characterization of Delamination in Laser Microtransfer Printing

2014 ◽  
Vol 2 (1) ◽  
Author(s):  
Ala'a M. Al-okaily ◽  
John A. Rogers ◽  
Placid M. Ferreira
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Laser Heating ◽  
Thermal Gradient ◽  
Heterogeneous Materials ◽  
Element Model ◽  
Extensive Study ◽  
Materials Integration ◽  
Gradient Fields

Microtransfer printing is rapidly emerging as an effective method for heterogeneous materials integration. Laser microtransfer printing (LMTP) is a noncontact variant of the process that uses laser heating to drive the release of the microstructure from the stamp. This makes the process independent of the properties or preparation of the receiving substrate. In this paper, an extensive study is conducted to investigate the capability of the LMTP process. Furthermore, a thermomechanical finite element model (FEM) is developed, using the experimentally observed delamination times and absorbed powers, to estimate the delamination temperatures at the interface, as well as the strain, displacement, and thermal gradient fields.

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