scholarly journals Thermodynamics and ordering kinetics in asymmetric PS-b-PMMA block copolymer thin films

Soft Matter ◽  
2020 ◽  
Vol 16 (23) ◽  
pp. 5525-5533 ◽  
Author(s):  
Gabriele Seguini ◽  
Fabio Zanenga ◽  
Gianluca Cannetti ◽  
Michele Perego
Keyword(s):  
Thin Films ◽  
Block Copolymer ◽  
Time Evolution ◽  
Correlation Length ◽  
Driving Force ◽  
Annealing Temperatures ◽  
Ordering Kinetics ◽  
Thermodynamic Driving Force ◽  
Kinetics And Thermodynamic

The coupling between kinetics and thermodynamic driving force of standing cylinder-forming PS-b-PMMA BCPs on flat and unpatterned surface is investigated following the time evolution of the correlation length at different annealing temperatures.

Mechanism of CO production around oxygen vacancy of LaMnO3: an efficient and rapid evaluation of the doping effect on the kinetics and thermodynamic driving force of CO2-splitting

2020 ◽  
Vol 8 (4) ◽  
pp. 1709-1716 ◽  
Author(s):  
Mingkai Fu ◽  
Lei Wang ◽  
Tianzeng Ma ◽  
Haitao Ma ◽  
Huajun Xu ◽  
...  
Keyword(s):  
Oxygen Vacancy ◽  
Driving Force ◽  
Screening Method ◽  
Doping Effect ◽  
Rapid Evaluation ◽  
Thermodynamic Driving Force ◽  
Solar Thermochemical ◽  
Kinetics And Thermodynamic

A rapid perovskite screening method for the fast and efficient solar thermochemical production of CO.

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

Nanoscratch-Directed Self-Assembly of Block Copolymer Thin Films

2021 ◽  
Vol 13 (4) ◽  
pp. 5772-5781
Author(s):  
Dong Hyup Kim ◽  
Ahram Suh ◽  
Geonhyeong Park ◽  
Dong Ki Yoon ◽  
So Youn Kim
Keyword(s):  
Thin Films ◽  
Block Copolymer ◽  
Self Assembly

scholarly journals Continuous Equilibrated Growth of Ordered Block Copolymer Thin Films by Electrospray Deposition

ACS Nano ◽  
2013 ◽  
Vol 7 (4) ◽  
pp. 2960-2970 ◽  
Author(s):  
Hanqiong Hu ◽  
Sofia Rangou ◽  
Myungwoong Kim ◽  
Padma Gopalan ◽  
Volkan Filiz ◽  
...  
Keyword(s):  
Thin Films ◽  
Block Copolymer ◽  
Electrospray Deposition

Effects of Annealing Temperature on Morphology and Dielectric Property of BiFeO3 Films

2012 ◽  
Vol 512-515 ◽  
pp. 1736-1739
Author(s):  
Li Li Zhang ◽  
Guo Qiang Tan ◽  
Meng Cheng ◽  
Hui Jun Ren ◽  
Ao Xia
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Dielectric Property ◽  
Annealing Temperature ◽  
Raw Materials ◽  
Sol Gel ◽  
Frequency Range ◽  
Annealing Temperatures ◽  
Pure Phase ◽  
Lower Loss

Fe(NO3)3•9H2O and Bi(NO3)3•5H2O were used as raw materials. BiFeO3 thin films were prepared by sol-gel method. The effects of annealing temperatures on the morphology and dielectric property of the thin films were studied. XRD results show that the multi-crystal thin films with pure phase are obtained when annealed at 500°C and 550°C. But annealing at 580°C will lead to the appearance of Bi2.46Fe5O12 phase.AFM images show that as the increase of annealing temperatures the surface toughness of the thin film is decreased, but the surface undulation of the thin films is decreased gradually. Within the frequency range of 1KHz~1MHz, the dielectric constant of BiFeO3 thin films is kept over 125 and it does not change very much from 500°C to 580°C. Annealed at 550°C, the BiFeO3 thin films with the lower loss are obtained. At 1MHz, the dielectric loss is 0.12.

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