scholarly journals Effect of curing conditions on the cutting resistance of fabrics coated with inorganic-powder-reinforced epoxy composite

RSC Advances ◽  
2020 ◽  
Vol 10 (55) ◽  
pp. 33576-33584
Author(s):  
Xuefeng Yan ◽  
Leilei Wu ◽  
Shanshan Jin ◽  
Wei Zhao ◽  
Haijian Cao ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Polyethylene Terephthalate ◽  
Epoxy Composite ◽  
Curing Process ◽  
Curing Conditions ◽  
Cutting Resistance ◽  
Thermosetting Epoxy

Inorganic powders, SiO2 and Al2O3, were used as reinforcements and thermosetting epoxy resin was utilized as a matrix to manufacture IP/epoxy preform, which was coated on the surfaces of 2/1 twill woven polyethylene terephthalate fabrics before the final curing process.

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

2014 ◽  
Vol 936 ◽  
pp. 63-66 ◽  
Author(s):  
Chun Hua Han ◽  
Lin Wang ◽  
Dong Yu Zhao
Keyword(s):  
Epoxy Resin ◽  
Room Temperature ◽  
Curing Agent ◽  
Curing Process ◽  
Curing Conditions ◽  
Temperature Spectra ◽  
Infrared Spectral ◽  
Ft Ir ◽  
Ir Analysis ◽  
Epoxy Groups

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

scholarly journals Heterogeneous dynamics in the curing process of epoxy resins

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Taiki Hoshino ◽  
Yasushi Okamoto ◽  
Atsushi Yamamoto ◽  
Hiroyasu Masunaga
Keyword(s):  
Physical Properties ◽  
Epoxy Resin ◽  
Correlation Spectroscopy ◽  
Resonance Spectroscopy ◽  
Curing Process ◽  
Microscopic Mechanism ◽  
Curing Conditions ◽  
Temperature Conditions ◽  
Heterogeneous Dynamics ◽  
Microscopic Dynamics

AbstractEpoxy resin is indispensable for modern industry because of its excellent mechanical properties, chemical resistance, and excellent moldability. To date, various methods have been used to investigate the physical properties of the cured product and the kinetics of the curing process, but its microscopic dynamics have been insufficiently studied. In this study, the microscopic dynamics in the curing process of a catalytic epoxy resin were investigated under different temperature conditions utilizing X-ray photon correlation spectroscopy. Our results revealed that the temperature conditions greatly affected the dynamical heterogeneity and cross-linking density of the cured materials. An overview of the microscopic mechanism of the curing process was clearly presented through comparison with the measurement results of other methods, such as 1H-pulse nuclear magnetic resonance spectroscopy. The quantification of such heterogeneous dynamics is particularly useful for optimizing the curing conditions of various materials to improve their physical properties.

A dynamic DSC study of the curing process of epoxy resin

1997 ◽  
Vol 49 (1) ◽  
pp. 123-129 ◽  
Author(s):  
Susumu Tatsumiya ◽  
Katsumasa Yokokawa ◽  
Kyosuke Miki
Keyword(s):  
Epoxy Resin ◽  
Curing Process

scholarly journals Effect of Terminal Groups on Thermomechanical and Dielectric Properties of Silica–Epoxy Composite Modified by Hyperbranched Polyester

Polymers ◽  
2021 ◽  
Vol 13 (15) ◽  
pp. 2451
Author(s):  
Jianwen Zhang ◽  
Dongwei Wang ◽  
Lujia Wang ◽  
Wanwan Zuo ◽  
Lijun Zhou ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Binding Energy ◽  
Epoxy Resin ◽  
Volume Fraction ◽  
Epoxy Composite ◽  
Mean Square Displacement ◽  
Mean Square ◽  
Hyperbranched Polyester ◽  
Free Volume Fraction

To study the effect of hyperbranched polyester with different kinds of terminal groups on the thermomechanical and dielectric properties of silica–epoxy resin composite, a molecular dynamics simulation method was utilized. Pure epoxy resin and four groups of silica–epoxy resin composites were established, where the silica surface was hydrogenated, grafted with silane coupling agents, and grafted with hyperbranched polyester with terminal carboxyl and terminal hydroxyl, respectively. Then the thermal conductivity, glass transition temperature, elastic modulus, dielectric constant, free volume fraction, mean square displacement, hydrogen bonds, and binding energy of the five models were calculated. The results showed that the hyperbranched polyester significantly improved the thermomechanical and dielectric properties of the silica–epoxy composites compared with other surface treatments, and the terminal groups had an obvious effect on the enhancement effect. Among them, epoxy composite modified by the hyperbranched polyester with terminal carboxy exhibited the best thermomechanical properties and lowest dielectric constant. Our analysis of the microstructure found that the two systems grafted with hyperbranched polyester had a smaller free volume fraction (FFV) and mean square displacement (MSD), and the larger number of hydrogen bonds and greater binding energy, indicating that weaker strength of molecular segments motion and stronger interfacial bonding between silica and epoxy resin matrix were the reasons for the enhancement of the thermomechanical and dielectric properties.

Studies on Thermal Property of Silica Aerogel/Epoxy Composite

2007 ◽  
Vol 546-549 ◽  
pp. 1581-1584 ◽  
Author(s):  
Jiu Peng Zhao ◽  
Deng Teng Ge ◽  
Sai Lei Zhang ◽  
Xi Long Wei
Keyword(s):  
Thermal Conductivity ◽  
Thermal Property ◽  
Epoxy Resin ◽  
Silica Aerogel ◽  
Epoxy Composite ◽  
Transfer Model ◽  
Insulation Material ◽  
Thermal Transfer ◽  
Heat Distortion Temperature ◽  
Ft Ir

Silica aerogel/epoxy composite, a kind of efficient thermal insulation material, was prepared by doping silica aerogel of different sizes into epoxy resin through thermocuring process. The results of thermal experiments showed that silica aerogel/epoxy composite had a lower thermal conductivity (0.105W/(m·k) at 60 wt% silica aerogel) and higher serviceability temperature (Martens heat distortion temperature: 160°C at 20 wt% silica aerogel). In addition, the composite doping larger size (0.2-2mm) of silica aerogel particle had lower thermal conductivity and higher Martens heat distortion temperature. Based on the results of SEM and FT-IR, the thermal transfer model was established. Thermal transfer mechanism and the reasons of higher Martens heat distortion temperature have been discussed respectively.

MECHANICAL PROPERTIES OF EPOXY RESIN BASED GRAPHENE NANO PARTICLES COMPOSITE

2020 ◽  
Vol 15 (4) ◽  
Author(s):  
Durgaprasad Kollipara ◽  
Prabhakar Gope VNB ◽  
Raja Loya
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin ◽  
Epoxy Composite ◽  
Hardness Test ◽  
Industrial Applications ◽  
Mechanical Tests ◽  
Nano Particles ◽  
Potential Candidate ◽  
Matrix Composites ◽  
Reinforcing Material

Composites have tremendous applicability due to their excellent capabilities. The performance of composites mainly depends on the reinforcing material applied. A Graphene nanoparticle (GNP) is successful as an efficient reinforcing material due to its versatile as well as superior properties. Even at very low content, graphene can dramatically improve the properties of polymer and metal matrix composites. In this paper the effects of GNP on composites based on epoxy resin were analyzed. Different contents of GNP (0 – 4.5 vol. %) were added to the epoxy resin. The GNP/epoxy composite was fabricated under room temperature. Mechanical tests result such as tensile, flexural and hardness test show enhancements of the mechanical properties of the GNP/epoxy composite. The experimental results clearly show an improvement in Young’s modulus, tensile strength, and hardness as compared to pure epoxy. The results of this research are strong evidence for GNP/epoxy composites being a potential candidate for use in a variety of industrial applications, especially for automobile parts, aircraft components, and electronic parts such as super capacitors, transistors, etc.

scholarly journals Synthesis of Co(II), Ni(II) and Cu(II) Complexes from Schiff base Ligand and Reactivity Studies with Thermosetting Epoxy Resin

2011 ◽  
Vol 32 (5) ◽  
pp. 1613-1619 ◽  
Author(s):  
B. Lakshmi ◽  
K.N. Shivananda ◽  
Gouda Avaji Prakash ◽  
Krishna Reddy K. Rama ◽  
K.N. Mahendra
Keyword(s):  
Schiff Base ◽  
Epoxy Resin ◽  
Schiff Base Ligand ◽  
Thermosetting Epoxy
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