scholarly journals An anti-leakage liquid metal thermal interface material

RSC Advances ◽  
2020 ◽  
Vol 10 (32) ◽  
pp. 18824-18829
Author(s):  
Kaiyuan Huang ◽  
Wangkang Qiu ◽  
Meilian Ou ◽  
Xiaorui Liu ◽  
Zenan Liao ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
High Performance ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Indium Film ◽  
Micropillar Arrays

An improved form of LM/indium film/LM sandwich pad with surface micropillar arrays is a high-performance thermal interface material for thermal management.

Liquid metal nano/micro-channels as thermal interface materials for efficient energy saving

2018 ◽  
Vol 6 (39) ◽  
pp. 10611-10617 ◽  
Author(s):  
Liuying Zhao ◽  
Huiqiang Liu ◽  
Xuechen Chen ◽  
Sheng Chu ◽  
Han Liu ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Thermal Management ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Efficient Energy ◽  
Micro Channels ◽  
High Elasticity ◽  
Interface Materials

Thermal interface material (TIMs) pads/sheets with both high elasticity and low thermal resistance are indispensable components for thermal management.

Characterization of a Liquid-Metal Micro Droplets Thermal Interface Material

2010 ◽  
Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Applied Load ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance ◽  
Droplet Array

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.

A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

2015 ◽  
Vol 2015 (1) ◽  
pp. 000627-000632 ◽  
Author(s):  
Swapan K. Bhattacharya ◽  
Fei Xie ◽  
Han Wu ◽  
Kelley Hodge ◽  
Keck Pathammavong ◽  
...  
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Cycle Times ◽  
High Adhesion ◽  
Machine Cycle

The objective of this study is to design and fabricate a high reliability LED Insulated Metal Substrate (IMS) package to complex heat sink attachment using an advanced thermal interface material (TIM). The assembly consists of LED IMS parts bonded to a heat spreader/sink using an advanced TIM and a corner bond material to quickly and accurately secure the LEDs in position. The corner bond adhesive is snap cured for fast machine cycle times while the high performance, high adhesion TIM materials cure throughout the rest of the assembly operation. This approach allows high accuracy LED bonding without the need for alignment pins or fasteners to anchor to the IMS. The IMS attached to the heat sink is then electrically interconnected with a thin flex substrate on top of the IMS. This approach is expected to replace the current mechanical fastners and low strength silicone TIM materials and reduce the cycle time and overall placement cost which are key drivers especially for the automotive industry.

Thermal Property Enhancement of Liquid Metal Used As Thermal Interface Material by Mixing Magnetic Particles

2019 ◽  
Author(s):  
Xianfeng Ma ◽  
Gen Li ◽  
Xuelin Zheng ◽  
Xiaozhong Wang ◽  
Zhongcheng Wang ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Liquid Metal ◽  
Magnetic Particles ◽  
Nickel Particle ◽  
Field Application ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Micro Particles ◽  
Steady State Method

Abstract The usage of low melting temperature alloys (LMAs) as thermal interface materials (TIMs) has attracted more and more attention for their high thermal conductivity. However, the wettability between liquid metal and ordinary metal surface was poor, which results in high thermal interface resistance. The thermal and physical properties of LMAs can be modified by adding nano or micro particles. In this study, the room temperature liquid metal (gallium, indium and tin eutectic) was used as TIM and its properties were modified by mixing magnetic nickel particles. Further, the effects of magnetic field application on the thermal performance of modified LMAs were evaluated by steady state method with specially designed sample holder. Results showed that the thermal conductivity of liquid metal mixed with nickel particle increased from 27.33 W/(m · K) to 33.33 W/(m · K) with the application of magnetic field.

scholarly journals Non-Curing Thermal Interface Materials with Graphene Fillers for Thermal Management of Concentrated Photovoltaic Solar Cells

2019 ◽  
Vol 6 (1) ◽  
pp. 2 ◽  
Author(s):  
Barath Kanna Mahadevan ◽  
Sahar Naghibi ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Solar Cells ◽  
Solar Cell ◽  
Thermal Management ◽  
Temperature Rise ◽  
Thermal Interface Material ◽  
Maximum Temperature ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Photovoltaic Solar Cells ◽  
Interface Materials

Temperature rise in multi-junction solar cells reduces their efficiency and shortens their lifetime. We report the results of the feasibility study of passive thermal management of concentrated multi-junction solar cells with the non-curing graphene-enhanced thermal interface materials. Using an inexpensive, scalable technique, graphene and few-layer graphene fillers were incorporated in the non-curing mineral oil matrix, with the filler concentration of up to 40 wt% and applied as the thermal interface material between the solar cell and the heat sink. The performance parameters of the solar cells were tested using an industry-standard solar simulator with concentrated light illumination at 70× and 200× suns. It was found that the non-curing graphene-enhanced thermal interface material substantially reduces the temperature rise in the solar cell and improves its open-circuit voltage. The decrease in the maximum temperature rise enhances the solar cell performance compared to that with the commercial non-cured thermal interface material. The obtained results are important for the development of the thermal management technologies for the next generation of photovoltaic solar cells.

scholarly journals RGO-Coated Polyurethane Foam/Segmented Polyurethane Composites as Solid–Solid Phase Change Thermal Interface Material

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 3004
Author(s):  
Cong Zhang ◽  
Zhe Shi ◽  
An Li ◽  
Yang-Fei Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
High Performance ◽  
In Situ Polymerization ◽  
Solid Phase ◽  
Thermal Interface Material ◽  
Segmented Polyurethane ◽  
Thermal Interface ◽  
Self Assembling

Thermal interface material (TIM) is crucial for heat transfer from a heat source to a heat sink. A high-performance thermal interface material with solid–solid phase change properties was prepared to improve both thermal conductivity and interfacial wettability by using reduced graphene oxide (rGO)-coated polyurethane (PU) foam as a filler, and segmented polyurethane (SPU) as a matrix. The rGO-coated foam (rGOF) was fabricated by a self-assembling method and the SPU was synthesized by an in situ polymerization method. The pure SPU and rGOF/SPU composite exhibited obvious solid–solid phase change properties with proper phase change temperature, high latent heat, good wettability, and no leakage. It was found that the SPU had better heat transfer performance than the PU without phase change properties in a practical application as a TIM, while the thermal conductivity of the rGOF/SPU composite was 63% higher than that of the pure SPU at an ultra-low rGO content of 0.8 wt.%, showing great potential for thermal management.

Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Muna E. Raypah ◽  
Mutharasu Devarajan ◽  
Shahrom Mahmud
Keyword(s):  
Low Power ◽  
Thermal Resistance ◽  
Thermal Management ◽  
Light Output ◽  
Luminous Flux ◽  
Thermal Interface Material ◽  
Junction Temperature ◽  
Thermal Interface ◽  
Content Type ◽  
Thermally Conductive

Purpose One major problem in the lighting industry is the thermal management of the devices. Handling of thermal resistance from solder point to the ambiance of the light-emitting diode (LED) package is linked to the external thermal management that includes a selection of the cooling mode, design of heatsink/substrate and thermal interface material (TIM). Among the significant factors that increase the light output of the of the LED system are efficient substrate and TIM. In this work, the influence of TIM on the luminous flux performance of commercial indium gallium aluminium phosphide (InGaAlP) low-power (LP) LEDs was investigated. Design/methodology/approach One batch of LEDs was mounted directly onto substrates which were glass-reinforced epoxy (FR4) and aluminium-based metal-core printed circuit boards (MCPCBs) with a dielectric layer of different thermal conductivities. Another batch of LEDs was prepared in a similar way, but a layer of TIM was embedded between the LED package and substrate. The TIMs were thermally conductive epoxy (TCE) and thermally conductive adhesive (TCA). The LED parameters were measured by using the integrated system of thermal transient tester (T3Ster) and thermal-radiometric characterization of LEDs at various input currents. Findings With the employment of TIM, the authors found that the LED’s maximum luminous flux was significantly higher than the value mentioned in the LED datasheet, and that a significant reduction in thermal resistance and junction temperature was revealed. The results showed that for a system with low thermal resistance, the maximum luminous flux appeared to occur at a higher power level. It was found that the maximum luminous flux was 24.10, 28.40 and 36.00 lm for the LEDs mounted on the FR4 and two MCPCBs, respectively. After TCA application on the LEDs, the maximum luminous flux values were 32.70, 36.60 and 37.60 lm for the FR4 and MCPCBs, respectively. Moreover, the findings demonstrated that the performance of the LED mounted on the FR4 substrate was more affected by the employment of the TIM than that of MCPCBs. Research limitations/implications One of the major problems in the lighting industry is the thermal management of the device. In many low-power LED applications, the air gap between the two solder pads is not filled up. Heat flow is restricted by the air gap leading to thermal build-up and higher thermal resistance resulting in lower maximum luminous flux. Among the significant factors that increase the light output of the LED system are efficient substrate and TIM. Practical implications The findings in this work can be used as a method to improve thermal management of LP LEDs by applying thermal interface materials that can offer more efficient and brighter LP LEDs. Using aluminium-based substrates can also offer similar benefits. Social implications Users of LP LEDs can benefit from the findings in this work. Brighter automotive lighting (signalling and backlighting) can be achieved, and better automotive lighting can offer better safety for the people on the street, especially during raining and foggy weather. User can also use a lower LED power rating to achieve similar brightness level with LED with higher power rating. Originality/value Better thermal management of commercial LP LEDs was achieved with the employment of thermal interface materials resulting in lower thermal resistance, lower junction temperature and brighter LEDs.

Characterization of a liquid–metal microdroplet thermal interface material

2011 ◽  
Vol 35 (7) ◽  
pp. 1250-1254 ◽  
Author(s):  
A. Hamdan ◽  
A. McLanahan ◽  
R. Richards ◽  
C. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Interface Material ◽  
Thermal Interface
Sign in / Sign up

Export Citation Format

Share Document