scholarly journals Deformation mechanisms of Inconel-718 at nanoscale by molecular dynamics

2021 ◽  
Author(s):  
Abrar Faiyad ◽  
Md Adnan Mahathir Munshi ◽  
Md Mahbubul Islam ◽  
Sourav Saha
Keyword(s):  
Molecular Dynamics ◽  
3D Printing ◽  
Dislocation Density ◽  
Cooling Rate ◽  
Inconel 718 ◽  
Thermal Gradient ◽  
Deformation Mechanisms ◽  
Initial Dislocation Density ◽  
Metal 3D Printing ◽  
Super Alloy

Ni-based super alloy Inconel-718 is ubiquitous in metal 3D printing where a high cooling rate and thermal gradient are present. These manufacturing conditions are conducive to high initial dislocation density...

A Theoretical Study of the Temperature Gradient Effect on the Soret Coefficient in n-Pentane/n-Decane Mixtures Using Non-Equilibrium Molecular Dynamics

2020 ◽  
Vol 45 (4) ◽  
pp. 319-332
Author(s):  
Xiaoyu Chen ◽  
Ruquan Liang ◽  
Yong Wang ◽  
Ziqi Xia ◽  
Lichun Wu ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Temperature Gradient ◽  
Thermal Gradient ◽  
Linear Response ◽  
Theoretical Study ◽  
Soret Coefficient ◽  
Thermal Gradients ◽  
Gradient Effect ◽  
Non Equilibrium Molecular Dynamics ◽  
Non Equilibrium

AbstractThe effect of the temperature gradient on the Soret coefficient in n-pentane/n-decane (n-C5/n-C10) mixtures was investigated using non-equilibrium molecular dynamics (NEMD) with the heat exchange (eHEX) algorithm. n-Pentane/n-decane mixtures with three different compositions (0.25, 0.5, and 0.75 mole fractions, respectively) and the TraPPE-UA force field were used in computing the Soret coefficient ({S_{T}}) at 300 K and 1 atm. Added/removed heat quantities (ΔQ) of 0.002, 0.004, 0.006, 0.008, and 0.01 kcal/mol were employed in eHEX processes in order to study the effect of different thermal gradients on the Soret coefficient. Moreover, a phenomenological description was applied to discuss the mechanism of this effect. Present results show that the Soret coefficient values firstly fluctuate violently and then become increasingly stable with increasing ΔQ (especially in the mixture with a mole fraction of 0.75), which means that ΔQ has a smaller effect on the Soret coefficient when the temperature gradient is higher than a certain thermal gradient. Thus, a high temperature gradient is recommended for calculating the Soret coefficient under the conditions that a linear response and constant phase are ensured in the system. In addition, the simulated Soret coefficient obtained at the highest ΔQ within three different compositions is in great agreement with experimental data.

Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Rafael Kakitani ◽  
Cassio Augusto Pinto da Silva ◽  
Bismarck Silva ◽  
Amauri Garcia ◽  
Noé Cheung ◽  
...  
Keyword(s):  
Cooling Rate ◽  
Thermal Gradient ◽  
Experimental Spectrum ◽  
Eutectic Growth ◽  
Solidification Velocity ◽  
Solder Alloys ◽  
Content Type ◽  
Growth Zones ◽  
Coupled Growth

Purpose Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity. Design/methodology/approach Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, Ṫ, data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added. Findings When analyzing the cooling rate (Ṫ = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) + cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. Originality/value The present paper is devoted to the establishment of (v vs. G) + cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product.

scholarly journals Powder bed binder jet 3D printing of Inconel 718: Densification, microstructural evolution and challenges☆

2017 ◽  
Vol 21 (4) ◽  
pp. 207-218 ◽  
Author(s):  
Peeyush Nandwana ◽  
Amy M. Elliott ◽  
Derek Siddel ◽  
Abbey Merriman ◽  
William H. Peter ◽  
...  
Keyword(s):  
3D Printing ◽  
Microstructural Evolution ◽  
Inconel 718 ◽  
Powder Bed

scholarly journals Metal casting or metal 3D printing

2019 ◽  
Author(s):  
A.A. Polienko ◽  
O.G. Tikhomirova
Keyword(s):  
3D Printing ◽  
Metal Casting ◽  
Metal 3D Printing
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