Enhanced thermoelectric properties of (015) plane-oriented n-type Bi2Se0.5Te2.5 films with wide temperature range stability

CrystEngComm ◽  
2020 ◽  
Vol 22 (45) ◽  
pp. 7790-7793
Author(s):  
Lili Cao ◽  
Hongli Gao ◽  
Min Miao

Enhanced thermoelectric properties with wide temperature range stability are achieved through a facile post-annealing process.

2010 ◽  
Vol 667-669 ◽  
pp. 1009-1014 ◽  
Author(s):  
Farzad Khodabakhshi ◽  
Mohsen Kazeminezhad ◽  
Mohammad Azarnush ◽  
Seyyed Hossein Miran

There are many works on annealing process of SPDed bulk metals but there are limited works on annealing process of SPDed sheets. Therefore, in this study the annealing response after constrained groove pressing (CGP) of low carbon steel sheets has been investigated. These sheets are subjected to severe plastic deformation at room temperature by CGP method up to three passes. Nano-structured low carbon steel sheets produced by severe plastic deformation are annealed at temperature range of 100 to 600 °C for 20 min. The microstructural changes after deformation and annealing are studied by optical microscopy. The effects of CGP strain and annealing temperature on microstructure, strength and hardness evolutions of the nano-scale grained low carbon steel are examined. The results show that annealing phenomena can effectively improve the elongation of process sheets with preserving the hardness and mechanical strength. Also, a thermal stability of microstructure can be observed with annealing at a temperature range of 375–425 °C and 400 °C is achieved as an optimum annealing temperature. Microstructure after post-annealing at temperatures of higher than 600 °C shows abnormal grain growth.


2019 ◽  
Vol 125 (11) ◽  
Author(s):  
A. Szajek ◽  
A. Kowalczyk

Abstract We present thermoelectric properties of the CeNi2Al3 compound in the temperature range from 4 to 300 K. The electrical resistance (ρ) exhibits a metallic-like character reaching approximately 50 μΩ cm at room temperature. The temperature dependence of the Seebeck coefficient (S) is typical for mixed valence compounds having positive values with a broad maximum (~ 46 μV/K) over a wide temperature range from 200 to 300 K. The thermal conductivity (κ) value reaches 15 W/(m K) at T = 300 K. The power factor (PF = S2/ρ) at 150 K is high (~ 70 μW/cm K2), larger than for conventional thermoelectric materials based on Bi2Te3. The dimensionless figure of merit (ZT) has a broad maximum over a wide temperature range, which reaches the value of 0.1 around 220 K. The experimental results are supported by calculations within the density functional theory (DFT) performed on the basis of the full-potential local-orbital minimum-basis scheme (FPLO). The coherent potential approximation (CPA) is used to simulate the chemical disorder. The calculations are focused on the site preference of Ni and Al atoms. Investigations of the energetic stability have shown that in CeNi2Al3 the aluminum atoms prefer the 3g sites and the nickel ones the 2c sites.


RSC Advances ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 4190-4197 ◽  
Author(s):  
Hyunyong Cho ◽  
Song Yi Back ◽  
Jin Hee Kim ◽  
Omkaram Inturu ◽  
Ho Seong Lee ◽  
...  

Temperature-dependent ZT values of (CuI)y(Bi2Te3)0.95−x(Bi2Se3)x(Bi2S3)0.05 (x = 0.05, 0.2; y = 0.0, 0.003) compounds compared with other related n-type compounds.


2009 ◽  
Vol 38 (7) ◽  
pp. 990-993 ◽  
Author(s):  
O.N. Uryupin ◽  
M.V. Vedernikov ◽  
A.A. Shabaldin ◽  
Y.V. Ivanov ◽  
Y.A. Kumzerov ◽  
...  

2017 ◽  
Vol 5 (33) ◽  
pp. 8559-8565 ◽  
Author(s):  
Hyeongdo Choi ◽  
Sun Jin Kim ◽  
Yongjun Kim ◽  
Ju Hyung We ◽  
Min-Wook Oh ◽  
...  

We report on a TE device composed of p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.7Se0.3 TE materials prepared using a screen-printing process.


2016 ◽  
Vol 8 (10) ◽  
pp. 859-863 ◽  
Author(s):  
No-Won Park ◽  
Sang-Hyeok Cho ◽  
Jay-Young Park ◽  
Jin-Tak Jeong ◽  
In-Hwan Choi ◽  
...  

1987 ◽  
Vol 134 (5) ◽  
pp. 291 ◽  
Author(s):  
K.T.V. Grattan ◽  
J.D. Manwell ◽  
S.M.L. Sim ◽  
C.A. Willson

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