scholarly journals Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity

RSC Advances ◽  
2019 ◽  
Vol 9 (36) ◽  
pp. 20663-20669 ◽  
Author(s):  
Yanchao Li ◽  
Guoyou Gan ◽  
Yukuan Huang ◽  
Xianglei Yu ◽  
Junhua Cheng ◽  
...  

Heat dissipation is a critical issue in high-performance electronics, which needs to be solved, and an electronic paste is a good choice to solve this issue.

2018 ◽  
Vol 38 (8) ◽  
pp. 767-774 ◽  
Author(s):  
Liang Wang ◽  
Luchong Zhang ◽  
Andreas Fischer ◽  
Yuhua Zhong ◽  
Dietmar Drummer ◽  
...  

Abstract High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m·K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.


Author(s):  
Ni Tang ◽  
Zhan Peng ◽  
Rulei Guo ◽  
Meng An ◽  
Xiandong Chen ◽  
...  

As the interface between human and machine becomes blurred, hydrogel incorporated electronics and devices have emerged to be a new class of flexible/stretchable electronic and ionic devices due to their extraordinary properties, such as soft, mechanically robust and biocompatible. However, heat dissipation in these devices could be a critical issue and remains unexplored. Here, we report the experimental measurements and equilibrium molecular dynamics simulations of thermal conduction in polyacrylamide (PAAm) hydrogels. The thermal conductivity of PAAm hydrogels can be modulated by both the crosslinking density and water content in hydrogels. The crosslinking density dependent thermal conductivity in hydrogels varies from 0.33 to 0.51 Wm-1K-1, giving a 54% enhancement. We attribute the crosslinking effect to the competition between the increased conduction pathways and the enhanced phonon scattering effect. Moreover,water content can act as filler in polymers which lead to nearly 40% enhancement in thermal conductivity in PAAm hydrogels with water content vary from 23 to 88 wt%. Furthermore,we find the thermal conductivity of PAAm hydrogel is insensitive to temperature in the range of 25 oC – 40 oC. Our study offers fundamental understanding of thermal transport in soft materials and provides design guidance for hydrogel-based devices. 


2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Akihiro Shimamura ◽  
Yuji Hotta ◽  
Hideki Hyuga ◽  
Mikinori Hotta ◽  
Kiyoshi Hirao

AbstractElectrically insulating and thermally conductive polymer matrix composites are desirable for industry applications as they improve the reliability of high-performance electronic devices, particularly via heat dissipation in devices loaded with several electronic components. In this study, an aggregated β-Si3N4 filler with randomly oriented grains was produced via combustion synthesis to improve the thermal conductivity of epoxy composites. The thermal conductivities of the prepared composites were investigated as a function of the filler content, and the values were compared to those of composites loaded with commercial β-Si3N4 (non-aggregated). Negligible difference was observed in the thermal conductivities of both types of composites when the Si3N4 content was below 40 vol%; however, above 40 vol%, the aggregated β-Si3N4 filler-loaded composites showed higher thermal conductivities than the commercial β-Si3N4-loaded composites. The aggregated β-Si3N4 filler-loaded composites exhibited isotropic thermal conductivities with a maximum value of 4.7 W m−1 K−1 at 53 vol% filler content, which is approximately 2.4 times higher than that of the commercial β-Si3N4-loaded composites, thereby suggesting that the morphology of the aggregated filler would be more efficient than that of the commonly used non-aggregated filler in enhancing the thermal conductivity of a polymer matrix composite.


2019 ◽  
Vol 111 ◽  
pp. 06069 ◽  
Author(s):  
Larisa Meliță ◽  
Cristiana Croitoru

In this paper data regarding the utilization of aerogel as a promising material for thermal insulation of the residential and commercial buildings are presented. Also, research work and developments in synthesis, properties and characterization of silica aerogels will be addressed. Aerogel is a synthetic porous ultralight material derived from a gel in which the liquid component of the gel has been replaced with a gas. The result is a solid with extremely low density and low thermal conductivity. Sol-gel is the most used method of preparation. Aerogel melts at 1200ºC and the thermal conductivity is almost 0. Is a solid material with the smallest density because contains about 99.8% air. This material has almost unlimited potential, believing that they might find application in most human activities and areas. Aerogel insulation is a good choice because nearly neutralizes all three methods of heat transfer: convection, conduction and radiation. The resistance to convective transfer is given by the fact that air does not circulate in the material structure. The resistance to thermal transfer by conduction is given by the majority of gaseous components. If using a carbon based gel, a high resistance to radiation transfer is obtained. Therefore, the most used aerogel for thermal insulation is the silica aerogel with carbon as nanostructured material. The high price makes it currently inaccessible and less used material. But, inevitably, the aerogel will quickly become one of the most attractive materials in the future.


2021 ◽  
Vol 880 ◽  
pp. 71-76
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Sunghoon Im ◽  
Jinho Yang ◽  
Sunchul Huh

An increase in power consumption density is related to the internal thermal characteristics of an electronic device, and the heat dissipation of the device is directly related to the high performance and miniaturization of the device. TIM (thermal interface material) with excellent internal heat dissipation performance are mainly used to improve the heat dissipation performance of electronic devices. Recently, the need for a high-efficiency TIM with high-performance thermal conductivity and low thermal contact resistance has increased. In this study, thermal grease was prepared by mixing Cu-Ni nanopowders with silicon oil, the thermal grease was then used as a heat transfer material. Compared to silicone thermal grease, the thermal conductivity of all prepared samples was excellent. In particularly, thermal conductivity was improved by about maximum 212% compared to that of thermal silicone of thermal grease mixed with Cu-Ni powder.


Author(s):  
A. Ferrerón Labari ◽  
D. Suárez Gracia ◽  
V. Viñals Yúfera

In the last years, embedded systems have evolved so that they offer capabilities we could only find before in high performance systems. Portable devices already have multiprocessors on-chip (such as PowerPC 476FP or ARM Cortex A9 MP), usually multi-threaded, and a powerful multi-level cache memory hierarchy on-chip. As most of these systems are battery-powered, the power consumption becomes a critical issue. Achieving high performance and low power consumption is a high complexity challenge where some proposals have been already made. Suarez et al. proposed a new cache hierarchy on-chip, the LP-NUCA (Low Power NUCA), which is able to reduce the access latency taking advantage of NUCA (Non-Uniform Cache Architectures) properties. The key points are decoupling the functionality, and utilizing three specialized networks on-chip. This structure has been proved to be efficient for data hierarchies, achieving a good performance and reducing the energy consumption. On the other hand, instruction caches have different requirements and characteristics than data caches, contradicting the low-power embedded systems requirements, especially in SMT (simultaneous multi-threading) environments. We want to study the benefits of utilizing small tiled caches for the instruction hierarchy, so we propose a new design, ID-LP-NUCAs. Thus, we need to re-evaluate completely our previous design in terms of structure design, interconnection networks (including topologies, flow control and routing), content management (with special interest in hardware/software content allocation policies), and structure sharing. In CMP environments (chip multiprocessors) with parallel workloads, coherence plays an important role, and must be taken into consideration.


Alloy Digest ◽  
1999 ◽  
Vol 48 (1) ◽  

Abstract Olin C197 is a second-generation high performance alloy developed by Olin Brass. It has a strength and bend formability similar to C194 (see Alloy Digest Cu-360, September 1978), but with 25% higher electrical and thermal conductivity. High conductivity allows C197 to replace brasses and bronzes in applications where high current-carrying capability is required. Also, the strength of C197 provides higher contact forces when substituted for many lower strength coppers. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as forming and joining. Filing Code: CU-627. Producer or source: Olin Brass.


1989 ◽  
Vol 170 ◽  
Author(s):  
Benjamin S. Hsiao ◽  
J. H. Eric

AbstractTranscrystallization of semicrystalline polymers, such as PEEK, PEKK and PPS, in high performance composites has been investigated. It is found that PPDT aramid fiber and pitch-based carbon fiber induce a transcrystalline interphase in all three polymers, whereas in PAN-based carbon fiber and glass fiber systems, transcrystallization occurs only under specific circumstances. Epitaxy is used to explain the surface-induced transcrystalline interphase in the first case. In the latter case, transcrystallization is probably not due to epitaxy, but may be attributed to the thermal conductivity mismatch. Plasma treatment on the fiber surface showed a negligible effect on inducing transcrystallization, implying that surface-free energy was not important. A microdebonding test was adopted to evaluate the interfacial strength between the fiber and matrix. Our preliminary results did not reveal any effect on the fiber/matrix interfacial strength of transcrystallinity.


2021 ◽  
Vol 7 (20) ◽  
pp. eabe6000
Author(s):  
Lin Yang ◽  
Madeleine P. Gordon ◽  
Akanksha K. Menon ◽  
Alexandra Bruefach ◽  
Kyle Haas ◽  
...  

Organic-inorganic hybrids have recently emerged as a class of high-performing thermoelectric materials that are lightweight and mechanically flexible. However, the fundamental electrical and thermal transport in these materials has remained elusive due to the heterogeneity of bulk, polycrystalline, thin films reported thus far. Here, we systematically investigate a model hybrid comprising a single core/shell nanowire of Te-PEDOT:PSS. We show that as the nanowire diameter is reduced, the electrical conductivity increases and the thermal conductivity decreases, while the Seebeck coefficient remains nearly constant—this collectively results in a figure of merit, ZT, of 0.54 at 400 K. The origin of the decoupling of charge and heat transport lies in the fact that electrical transport occurs through the organic shell, while thermal transport is driven by the inorganic core. This study establishes design principles for high-performing thermoelectrics that leverage the unique interactions occurring at the interfaces of hybrid nanowires.


Polymers ◽  
2021 ◽  
Vol 13 (2) ◽  
pp. 201
Author(s):  
Stefano Paolillo ◽  
Ranjita K. Bose ◽  
Marianella Hernández Santana ◽  
Antonio M. Grande

This article reviews some of the intrinsic self-healing epoxy materials that have been investigated throughout the course of the last twenty years. Emphasis is placed on those formulations suitable for the design of high-performance composites to be employed in the aerospace field. A brief introduction is given on the advantages of intrinsic self-healing polymers over extrinsic counterparts and of epoxies over other thermosetting systems. After a general description of the testing procedures adopted for the evaluation of the healing efficiency and the required features for a smooth implementation of such materials in the industry, different self-healing mechanisms, arising from either physical or chemical interactions, are detailed. The presented formulations are critically reviewed, comparing major strengths and weaknesses of their healing mechanisms, underlining the inherent structural polymer properties that may affect the healing phenomena. As many self-healing chemistries already provide the fundamental aspects for recyclability and reprocessability of thermosets, which have been historically thought as a critical issue, perspective trends of a circular economy for self-healing polymers are discussed along with their possible advances and challenges. This may open up the opportunity for a totally reconfigured landscape in composite manufacturing, with the net benefits of overall cost reduction and less waste. Some general drawbacks are also laid out along with some potential countermeasures to overcome or limit their impact. Finally, present and future applications in the aviation and space fields are portrayed.


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