scholarly journals Strong interface scattering induced low thermal conductivity in Bi-based GeTe/Bi2Te3 superlattice-like materials

RSC Advances ◽  
2019 ◽  
Vol 9 (17) ◽  
pp. 9457-9461 ◽  
Author(s):  
Yang Zhou ◽  
Kaijin Huang ◽  
Lingjun Zhou ◽  
Xiaomin Cheng ◽  
Ming Xu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Low Thermal Conductivity ◽  
Interface Scattering

Strong interface scattering caused by Bi atoms in Bi-based GeTe/Bi2Te3 superlattice-like materials leads to the decrease of thermal conductivity.

scholarly journals SnTe–AgBiTe2 as an efficient thermoelectric material with low thermal conductivity

2014 ◽  
Vol 2 (48) ◽  
pp. 20849-20854 ◽  
Author(s):  
Gangjian Tan ◽  
Fengyuan Shi ◽  
Hui Sun ◽  
Li-Dong Zhao ◽  
Ctirad Uher ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Seebeck Coefficient ◽  
Thermoelectric Material ◽  
Lattice Thermal Conductivity ◽  
Alloying Effect ◽  
Low Thermal Conductivity ◽  
Interface Scattering

SnTe–AgBiTe2 is not only a solid solution but a nanocomposite. The alloying effect coupled with intense interface scattering leads to considerably decreased lattice thermal conductivity. Bi is much more powerful in neutralizing holes than Sb, giving rise to a much higher Seebeck coefficient. A high ZT was then obtained.

Structure and Thermoelectric Properties of New Quaternary Tin and Lead Bismuth Selenides, K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1+xSn5-xBi11+xSe22

2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
Thermoelectric Properties ◽  
Three Dimensional ◽  
Structure Type ◽  
Narrow Gap ◽  
Low Thermal Conductivity ◽  
Seebeck Coefficients ◽  
Metal Atoms ◽  
Anionic Framework

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.

A Novel Poly(Ionic Liquid) as the Thermal Insulating Material

2020 ◽  
Vol 13 (3) ◽  
pp. 241-247
Author(s):  
Wenxin Wei ◽  
Guifeng Ma ◽  
Hongtao Wang ◽  
Jun Li
Keyword(s):  
Thermal Conductivity ◽  
Ionic Liquid ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Flame Resistance ◽  
Insulating Material ◽  
Low Thermal Conductivity ◽  
Thermal Insulating ◽  
Poly Ionic Liquid

Objective: A new poly(ionic liquid)(PIL), poly(p-vinylbenzyltriphenylphosphine hexafluorophosphate) (P[VBTPP][PF6]), was synthesized by quaternization, anion exchange reaction, and free radical polymerization. Then a series of the PIL were synthesized at different conditions. Methods: The specific heat capacity, glass-transition temperature and melting temperature of the synthesized PILs were measured by differential scanning calorimeter. The thermal conductivities of the PILs were measured by the laser flash analysis method. Results: Results showed that, under optimized synthesis conditions, P[VBTPP][PF6] as the thermal insulator had a high glass-transition temperature of 210.1°C, high melting point of 421.6°C, and a low thermal conductivity of 0.0920 W m-1 K-1 at 40.0°C (it was 0.105 W m-1 K-1 even at 180.0°C). The foamed sample exhibited much low thermal conductivity λ=0.0340 W m-1 K-1 at room temperature, which was comparable to a commercial polyurethane thermal insulating material although the latter had a much lower density. Conclusion: In addition, mixing the P[VBTPP][PF6] sample into polypropylene could obviously increase the Oxygen Index, revealing its efficient flame resistance. Therefore, P[VBTPP][PF6] is a potential thermal insulating material.

Origin of low thermal conductivity in monolayer PbI2

2021 ◽  
Vol 327 ◽  
pp. 114223
Author(s):  
E. Bolen ◽  
E. Deligoz ◽  
H. Ozisik
Keyword(s):  
Thermal Conductivity ◽  
Low Thermal Conductivity

Thermoelectric properties of PEDOT:PSS aerogel secondary-doped in supercritical CO2 atmosphere with low thermal conductivity

Polymer ◽  
2020 ◽  
Vol 206 ◽  
pp. 122912
Author(s):  
Naoya Yanagishima ◽  
Shinji Kanehashi ◽  
Hiromu Saito ◽  
Kenji Ogino ◽  
Takeshi Shimomura
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Properties ◽  
Supercritical Co2 ◽  
Low Thermal Conductivity ◽  
Co2 Atmosphere

Sticky thermoelectric materials for flexible thermoelectric modules to capture low-temperature waste heat

MRS Advances ◽  
2020 ◽  
Vol 5 (10) ◽  
pp. 481-487 ◽  
Author(s):  
Norifusa Satoh ◽  
Masaji Otsuka ◽  
Yasuaki Sakurai ◽  
Takeshi Asami ◽  
Yoshitsugu Goto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Waste Heat ◽  
Air Cooling ◽  
Conductive Adhesives ◽  
Hot Plate ◽  
Low Thermal Conductivity ◽  
Te Modules ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACTWe examined a working hypothesis of sticky thermoelectric (TE) materials, which is inversely designed to mass-produce flexible TE sheets with lamination or roll-to-roll processes without electric conductive adhesives. Herein, we prepared p-type and n-type sticky TE materials via mixing antimony and bismuth powders with low-volatilizable organic solvents to achieve a low thermal conductivity. Since the sticky TE materials are additionally injected into punched polymer sheets to contact with the upper and bottom electrodes in the fabrication process, the sticky TE modules of ca. 2.4 mm in thickness maintained temperature differences of ca. 10°C and 40°C on a hot plate of 40 °C and 120°C under a natural-air cooling condition with a fin. In the single-cell resistance analysis, we found that 75∼150-µm bismuth powder shows lower resistance than the smaller-sized one due to the fewer number of particle-particle interfaces in the electric pass between the upper and bottom electrodes. After adjusting the printed wiring pattern for the upper and bottom electrodes, we achieved 42 mV on a hot plate (120°C) with the 6 x 6 module having 212 Ω in the total resistance. In addition to the possibility of mass production at a reasonable cost, the sticky TE materials provide a low thermal conductivity for flexible TE modules to capture low-temperature waste heat under natural-air cooling conditions with fins for the purpose of energy harvesting.

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