scholarly journals All-conjugated donor–acceptor block copolymers featuring a pentafulvenyl-polyisocyanide-acceptor

2020 ◽  
Vol 11 (11) ◽  
pp. 1852-1859
Author(s):  
Sandra Schraff ◽  
Sudeshna Maity ◽  
Laura Schleeper ◽  
Yifan Dong ◽  
Sebastian Lucas ◽  
...  

A fulvenyl-functionalized polyisocyanide (PIC2) with a high electron mobility of μe = 10−2 cm2 V−1 s−1 has been incorporated into donor–acceptor block copolymers. Their self-assembly and bulk-morphology have been studied, and potential device applications have been explored.

Crystals ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 25 ◽  
Author(s):  
Chia-Hao Liu ◽  
Hsien-Chin Chiu ◽  
Chong-Rong Huang ◽  
Kuo-Jen Chang ◽  
Chih-Tien Chen ◽  
...  

The impact of gate metal on the leakage current and breakdown voltage of normally-off p-GaN gate high-electron-mobility-transistor (HEMT) with nickel (Ni) and zirconium (Zr) metals were studied and investigated. In this study, a Zr metal as a gate contact to p-GaN/AlGaN/GaN high mobility transistor (HEMT) was first applied to improve the hole accumulation at the high gate voltage region. In addition, the ZrN interface is also beneficial for improving the Schottky barrier with low nitrogen vacancy induced traps. The features of Zr are low work function (4.05 eV) and high melting point, which are two key parameters with p-GaN Schottky contact at reversed voltage. Therefore, Zr/p-GaN interface exhibits highly potential for GaN-based switching power device applications.


2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  

2021 ◽  
Vol 33 (10) ◽  
pp. 2170075
Author(s):  
Ze‐Fan Yao ◽  
Yu‐Qing Zheng ◽  
Jin‐Hu Dou ◽  
Yang Lu ◽  
Yi‐Fan Ding ◽  
...  

Author(s):  
Yu-Chen Lai ◽  
Yi-Nan Zhong ◽  
Ming-Yan Tsai ◽  
Yue-Ming Hsin

AbstractThis study investigated the gate capacitance and off-state characteristics of 650-V enhancement-mode p-GaN gate AlGaN/GaN high-electron-mobility transistors after various degrees of gate stress bias. A significant change was observed in the on-state capacitance when the gate stress bias was greater than 6 V. The corresponding threshold voltage exhibited a positive shift at low gate stress and a negative shift when the gate stress was greater than 6 V, which agreed with the shift observation from the I–V measurement. Moreover, the off-state leakage current increased significantly after the gate stress exceeded 6 V during the off-state characterization although the devices could be biased up to 1000 V without breakdown. The increase in the off-state leakage current would lead to higher power loss.


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