Thermal conductivity of V2O5 nanowires and their contact thermal conductance

Nanoscale ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 1138-1143 ◽  
Author(s):  
Qilang Wang ◽  
Xing Liang ◽  
Bohai Liu ◽  
Yihui Song ◽  
Guohua Gao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Heat Dissipation ◽  
Thermal Conductance ◽  
Vital Role ◽  
Interfacial Thermal Resistance ◽  
Li Ion Batteries ◽  
Thermal Measurements ◽  
Li Ion

Thermal measurements of V2O5 nanowires suggest the vital role of interfacial thermal resistance in the heat dissipation in Li-ion batteries.

Thermal conductivity and interfacial Thermal Resistance Behavior for the Polyaniline (C3N)– boron carbide (BC3) Heterostructure

2021 ◽  
Author(s):  
Arian Mayelifartash ◽  
Mohammad Ali Abdol ◽  
Sadegh Sadeghzadeh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Boron Carbide ◽  
Molecular Dynamics Simulations ◽  
Thermal Conductance ◽  
Interfacial Thermal Resistance ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
Non Equilibrium

In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the thermal conductance of hybrid formed by polyaniline (C3N) and boron carbide (BC3) in both armchair and zigzag configurations has...

The Modulation of Interfacial Thermal Resistance in Graphite

2014 ◽  
Author(s):  
Chenhan Liu ◽  
Zhiyong Wei ◽  
Weiyu Chen ◽  
Juekuan Yang ◽  
Yunfei Chen
Keyword(s):  
Thermal Resistance ◽  
Basal Plane ◽  
Heat Dissipation ◽  
Interaction Strength ◽  
Thermal Conductance ◽  
Transmission Function ◽  
Low Frequency ◽  
Blue Shift ◽  
Mean Free Path ◽  
Interfacial Thermal Resistance

It is demonstrated through the nonequilibrium Green’s function method that the interfacial thermal resistance (Ω) of graphite can be modulated by loading pressure in x direction, x and y directions and all three directions respectively in this paper. For graphite without pressure, the interfacial thermal resistance is about 8×10−9 m2K/W. The pressure in the z direction from tensile −1GPa to compressive 10GPa can reduce the Ω by one order of magnitude, which is caused by the increase in the phonon transmission possibility resulting from the increase in the interlayer interaction strength. And the phonon transmission function has the phenomenon of blue shift in the low-frequency range during the process. The pressure in the x-y plane changes from −10GPa to 1.5GPa has slight impact on the phonon transmission and interfacial thermal resistance Ω while there has no pressure or a small pressure in the z direction. So pressure in the basal plane has slight effect on the interfacial thermal conductance and phonon transmission in the graphite. Furthermore, the discrete layer in the graphite separates mutually when the pressure reaches to the critical value 1∼2GPa in the basal plane or to −2∼−1GPa in the z direction. It is worth noted that low-frequency phonons have larger phonon transmission due to longer mean free path and the soft van der Waals interaction between the neighboring layers. Our results suggest that the interfacial thermal resistance of graphite or few-layer graphene can be modulated in a large scope and then can be applied for both heat dissipation and insulation through the pressure engineering.

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

2013 ◽  
Author(s):  
Hua Bao ◽  
Shirui Luo ◽  
Ming Hu
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Thermal Transport ◽  
Heat Dissipation ◽  
Thermal Conductance ◽  
Thermal Interface Material ◽  
Interfacial Thermal Resistance ◽  
Material Interfaces ◽  
Material Interface ◽  
Dynamics Simulations

Thermal transport across material interfaces is crucial for many engineering applications. For example, in microelectronics, small interfacial thermal resistance is desired to achieve efficient heat dissipation. Carbon nanotube (CNT) has extremely high thermal conductivity and can potentially serve as an efficient thermal interface material. However, heat dissipation through CNTs is limited by the large thermal resistance at the CNT-material interface. Here we have proposed a CNT-graphene junction structure to enhance the interfacial thermal transport. Non-equilibrium molecular dynamics simulations have been carried out to show that the thermal conductance can be significantly enhanced by adding a single graphene layer in between CNT and silicon. The mechanism of enhanced thermal transport is attributed to the efficient thermal transport between CNT and graphene and the good contact between graphene and silicon surface.

Thermal Conductivity of Suspensions Based on Core–Shell Particles

2016 ◽  
Vol 138 (6) ◽  
Author(s):  
G. I. Sukhinin ◽  
M. A. Serebryakova ◽  
S. A. Novopashin
Keyword(s):  
Thermal Conductivity ◽  
Analytical Solution ◽  
Thermal Resistance ◽  
Thermal Conduction ◽  
Interfacial Thermal Resistance ◽  
Core Shell ◽  
Kapitza Resistance ◽  
First Case ◽  
Shell Particles

An analytical solution of the problem of the thermal conductivity of a suspension containing core–shell particles was found. Solutions were found under the thickness of the shell tending to zero while the thermal conductivity of the shell was tending to zero and infinity. In the first case, the solution is shown to be equivalent to the solution that takes into account Kapitza interfacial thermal resistance. The role of contact Kapitza resistance in the processes of the thermal conduction of nanofluids is discussed.

Evaluation of NO-treated fossil carbons as possible anode materials for Li-ion batteries – role of prior activation

2007 ◽  
Vol 11 (1) ◽  
pp. 40-44
Author(s):  
M. Hofman ◽  
M. Walkowiak ◽  
L. Wachowski ◽  
B. Czajka ◽  
D. Waszak
Keyword(s):  
Anode Materials ◽  
Li Ion Batteries ◽  
Li Ion

scholarly journals Thermal Conductivity of Unidirectionally Aligned SiC Whisker Reinforced Al Alloy Matrix Composite with Interfacial Thermal Resistance

2005 ◽  
Vol 46 (2) ◽  
pp. 148-151 ◽  
Author(s):  
Yibin Xu ◽  
Yoshihisa Tanaka ◽  
Masaharu Murata ◽  
Kazushige Kamihira ◽  
Yukihiro Isoda ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Matrix Composite ◽  
Interfacial Thermal Resistance ◽  
Al Alloy ◽  
Alloy Matrix

Enhanced Thermal Conductivity of Composite Materials by Filling Sheet and Fiber Under Effect of Filler Contact

2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Percolation Threshold ◽  
Filler Content ◽  
Interfacial Thermal Resistance ◽  
Combined Effects ◽  
Enhanced Thermal Conductivity ◽  
The Ideal

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).

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