scholarly journals Resolving single Cu nanoparticle oxidation and Kirkendall void formation with in situ plasmonic nanospectroscopy and electrodynamic simulations

Nanoscale ◽  
2019 ◽  
Vol 11 (43) ◽  
pp. 20725-20733 ◽  
Author(s):  
Sara Nilsson ◽  
David Albinsson ◽  
Tomasz J. Antosiewicz ◽  
Joachim Fritzsche ◽  
Christoph Langhammer
Keyword(s):  
Heterogeneous Catalysis ◽  
Void Formation ◽  
Kirkendall Void ◽  
Current Interest ◽  
High Current ◽  
Cu Nanoparticle

Copper nanostructures are ubiquitous in microelectronics and heterogeneous catalysis and their oxidation is a topic of high current interest and broad relevance.

Real-time plasmon spectroscopy study of the solid-state oxidation and Kirkendall void formation in copper nanoparticles

Nanoscale ◽  
2017 ◽  
Vol 9 (34) ◽  
pp. 12573-12589 ◽  
Author(s):  
Mariano D. Susman ◽  
Yishai Feldman ◽  
Tatyana A. Bendikov ◽  
Alexander Vaskevich ◽  
Israel Rubinstein
Keyword(s):  
Solid State ◽  
Real Time ◽  
Copper Nanoparticles ◽  
Void Formation ◽  
Kirkendall Effect ◽  
Kirkendall Void ◽  
Spectroscopy Study ◽  
Cu Nanoparticle

In situ LSPR measurements establish the role of the nano Kirkendall effect in Cu nanoparticle oxidation.

In situ construction of phenanthroline-based cationic radical porous hybrid polymers for metal-free heterogeneous catalysis

2021 ◽  
Vol 9 (12) ◽  
pp. 7556-7565
Author(s):  
Guojian Chen ◽  
Yadong Zhang ◽  
Ke Liu ◽  
Xiaoqing Liu ◽  
Lei Wu ◽  
...  
Keyword(s):  
Heterogeneous Catalysis ◽  
Heterogeneous Catalysts ◽  
Hybrid Polymers ◽  
Metal Free ◽  
Oxidation Of Sulfides

Constructing phenanthroline-based cationic radical porous hybrid polymers as versatile metal-free heterogeneous catalysts for both oxidation of sulfides and CO2 conversion.

High Current Density Effect on In-situ Atomic Migration Characteristics of a BiTe Thin Film System

2013 ◽  
Vol 52 (10S) ◽  
pp. 10MC06
Author(s):  
Seunghyun Kim ◽  
Yong-Jin Park ◽  
Young-Chang Joo ◽  
Young-Bae Park
Keyword(s):  
Thin Film ◽  
Current Density ◽  
High Current Density ◽  
Density Effect ◽  
Film System ◽  
High Current ◽  
Thin Film System

scholarly journals Kirkendall void formation in reverse step graded Si1−xGex/Ge/Si(001) virtual substrates

2018 ◽  
Vol 33 (2) ◽  
pp. 024002 ◽  
Author(s):  
Vineet Sivadasan ◽  
Stephen Rhead ◽  
David Leadley ◽  
Maksym Myronov
Keyword(s):  
Void Formation ◽  
Kirkendall Void

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

2004 ◽  
Vol 812 ◽  
Author(s):  
Ehrenfried Zschech ◽  
Moritz A. Meyer ◽  
Eckhard Langer
Keyword(s):  
Mass Transport ◽  
Grain Boundaries ◽  
Void Formation ◽  
Degradation Process ◽  
Copper Interconnects ◽  
Second Phase ◽  
Copper Interconnect ◽  
Void Evolution ◽  
Two Phases

AbstractIn-situ SEM electromigration studies were performed at fully embedded via/line interconnect structures to visualize the time-dependent void evolution in inlaid copper interconnects. Void formation, growth and movement, and consequently interconnect degradation, depend on both interface bonding and copper microstructure. Two phases are distinguished for the electromigration-induced interconnect degradation process: In the first phase, agglomerations of vacancies and voids are formed at interfaces and grain boundaries, and voids move along weak interfaces. In the second phase of the degradation process, they merge into a larger void which subsequently grows into the via and eventually causes the interconnect failure. Void movement along the copper line and void growth in the via are discontinuous processes, whereas their step-like behavior is caused by the copper microstructure. Directed mass transport along inner surfaces depends strongly on the crystallographic orientation of the copper grains. Electromigration lifetime can be drastically increased by changing the copper/capping layer interface. Both an additional CoWP coating and a local copper alloying with aluminum increase the bonding strength of the top interface of the copper interconnect line, and consequently, electromigration-induced mass transport and degradation processes are reduced significantly.

Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints

2010 ◽  
Vol 2010 (1) ◽  
pp. 000294-000297 ◽  
Author(s):  
S. H. Kim ◽  
Jin Yu
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Void Formation ◽  
Kirkendall Void ◽  
Fe Content ◽  
Kirkendall Voids

Ternary Sn-3.5Ag-xFe solders with varying amount of Fe; 0.1, 0.5, 1.0, and 2.0 wt. % were reacted with Cu UBM which was electroplated using SPS additive and characteristics of Kirkendall void formation at the solder joints were investigated. Results indicate that the propensity to form Kirkendall voids at the solder joint decreased with the Fe content. It showed that Fe dissolved in the Cu UBM and reduced the segregation of S atoms to the Cu3Sn/Cu interface, which suppressed the nucleation of Kirkendall voids at the interface.

scholarly journals Occultation studies with small telescopes

1986 ◽  
Vol 118 ◽  
pp. 199-211
Author(s):  
Robert L. Millis
Keyword(s):  
Solar System ◽  
Solar System Research ◽  
Current Interest ◽  
High Current ◽  
System Research

Various types of occultations and eclipses offer individuals with access to small telescopes the opportunity to contribute significantly to modern solar system research. In fact, often it is only through the cooperation of several such observers that the desired scientific objectives can be realized. This review discusses three classes of occultations which are of high current interest and which are particularly suitable for investigation with small telescopes.

scholarly journals Nanoscale Perspectives of Metal Degradation via In Situ Atom Probe Tomography

2020 ◽  
Vol 63 (15-18) ◽  
pp. 1606-1622 ◽  
Author(s):  
Sten V. Lambeets ◽  
Elizabeth J. Kautz ◽  
Mark G. Wirth ◽  
Graham J. Orren ◽  
Arun Devaraj ◽  
...  
Keyword(s):  
Heterogeneous Catalysis ◽  
Instrument Development ◽  
Atom Probe Tomography ◽  
Atom Probe ◽  
Development Effort ◽  
Subsurface Structure ◽  
Structure Changes ◽  
Reactor Cell ◽  
Reactive Gas

AbstractWe report a unique in situ instrument development effort dedicated to studying gas/solid interactions relevant to heterogeneous catalysis and early stages of oxidation of materials via atom probe tomography and microscopy (APM). An in situ reactor cell, similar in concept to other reports, has been developed to expose nanoscale volumes of material to reactive gas environments, in which temperature, pressure, and gas chemistry are well controlled. We demonstrate that the combination of this reactor cell with APM techniques can aid in building a better mechanistic understanding of resultant composition and surface and subsurface structure changes accompanying gas/surface reactions in metal and metal alloy systems through a series of case studies: O2/Rh, O2/Co, and O2/Zircaloy-4. In addition, the basis of a novel operando mode of analysis within an atom probe instrument is also reported. The work presented here supports the implementation of APM techniques dedicated to atomic to near-atomically resolved gas/surface interaction studies of materials broadly relevant to heterogeneous catalysis and oxidation.

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