Modified graphene/polyimide composite films with strongly enhanced thermal conductivity

Nanoscale ◽  
2019 ◽  
Vol 11 (17) ◽  
pp. 8219-8225 ◽  
Author(s):  
Xian Wu ◽  
Haoliang Li ◽  
Kui Cheng ◽  
Hanxun Qiu ◽  
Junhe Yang

An effective “modified-welding” approach to prepare graphene films with excellent thermal conductivity and flexibility for highly efficient thermal management.

Nanomaterials ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1681 ◽  
Author(s):  
Bin Luo ◽  
Mingchao Chi ◽  
Qingtong Zhang ◽  
Mingfu Li ◽  
Changzhou Chen ◽  
...  

Technical lignin from pulping, an aromatic polymer with ~59% carbon content, was employed to develop novel lignin-based nano carbon thin film (LCF)-copper foil composite films for thermal management applications. A highly graphitized, nanoscale LCF (~80–100 nm in thickness) was successfully deposited on both sides of copper foil by spin coating followed by annealing treatment at 1000 °C in an argon atmosphere. The conditions of annealing significantly impacted the morphology and graphitization of LCF and the thermal conductivity of LCF-copper foil composite films. The LCF-modified copper foil exhibited an enhanced thermal conductivity of 478 W m−1 K−1 at 333 K, which was 43% higher than the copper foil counterpart. The enhanced thermal conductivity of the composite films compared with that of the copper foil was characterized by thermal infrared imaging. The thermal properties of the copper foil enhanced by LCF reveals its potential applications in the thermal management of advanced electronic products and highlights the potential high-value utility of lignin, the waste of pulping.


2020 ◽  
Vol 3 (6) ◽  
pp. 6061-6070
Author(s):  
Ya Li ◽  
Xu Li ◽  
Md Mofasserul Alam ◽  
Dongbo Yu ◽  
Jibin Miao ◽  
...  

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.


RSC Advances ◽  
2016 ◽  
Vol 6 (44) ◽  
pp. 37773-37783 ◽  
Author(s):  
Sumanta Kumar Karan ◽  
Amit Kumar Das ◽  
Ranadip Bera ◽  
Sarbaranjan Paria ◽  
Anirban Maitra ◽  
...  

Dependence of thermal conductivity and energy density on the amount of crystalline γ-phase and γ-crystallite size of PVDF in Fe-rGO/PVDF nanocomposites has been explored.


2011 ◽  
Vol 72 (1) ◽  
pp. 112-118 ◽  
Author(s):  
Hong-Baek Cho ◽  
Ayumi Konno ◽  
Takeshi Fujihara ◽  
Tsuneo Suzuki ◽  
Satoshi Tanaka ◽  
...  

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