scholarly journals Customizing a Li–metal battery that survives practical operating conditions for electric vehicle applications

2019 ◽  
Vol 12 (7) ◽  
pp. 2174-2184 ◽  
Author(s):  
Jang-Yeon Hwang ◽  
Seong-Jin Park ◽  
Chong S. Yoon ◽  
Yang-Kook Sun
Keyword(s):  
Electric Vehicle ◽  
Electric Vehicles ◽  
Current Density ◽  
High Current Density ◽  
Operating Conditions ◽  
High Loading ◽  
Loading Capacity ◽  
High Current ◽  
Charging Rate

We customized a combination of cathode, anode, and electrolyte to develop an LMB capable of cycling both at a high loading capacity and at a high current density that satisfy the capacity and charging rate requirements for future electric vehicles.

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

2020 ◽  
Author(s):  
Mahsa Montazeri ◽  
David R. Huitink
Keyword(s):  
Tensile Stress ◽  
Thermal Cycling ◽  
Current Density ◽  
Flip Chip ◽  
High Current Density ◽  
Operating Conditions ◽  
Reliability Estimation ◽  
High Current ◽  
Test Setup ◽  
Solder Interconnects

Abstract One key concern that arises from scaling of device interconnects with increasing power density requirements is electromigration (EM). On the other hand, thermal cycling fatigue has always been a reliability challenge in solder interconnects. Variations in device temperature caused by environmental or operating conditions induce stress in solders, as they usually connect two components with different coefficients of thermal expansion (CTE). These thermally induced stresses may lead to crack formation within the solders. The combination of EM effects and thermal cycling add to the complexity of the reliability estimation for high current density applications. In this work, a novel test setup has been designed and developed to estimate the reliability of solder interconnects under high current density, while a constant tensile stress is also applied to the solder interconnect. The test set up offers the ability to test up to four samples at the same time. Additionally, the test samples are fabricated with two copper wires connected by Pb/Sn solder to imitate copper UBM in a flip-chip bonding connection. Strain in solder is measured by monitoring the elongation of the wire during testing, while failure of the connection is detected by continuous monitoring of the electrical resistance. The experiment is conducted for conditions including pure tensile stress, pure EM and coupled EM and tensile stress where a significant reduction in life-time is observed for the coupled degradation effects. Comparing the experimental results of different current densities at different stress levels will help in identifying the nature of degradation in solders, which will help inform the drive for miniaturization.

Three-dimensional porous copper-decorated bismuth-based nanofoam for boosting electrochemical reduction of CO2 to formate

2021 ◽  
Author(s):  
Yingchun Zhang ◽  
Changsheng Cao ◽  
Xintao Wu ◽  
Qi-Long Zhu
Keyword(s):  
Current Density ◽  
High Current Density ◽  
Three Dimensional ◽  
Co2 Reduction ◽  
Reduction Reaction ◽  
High Current ◽  
Porous Copper ◽  
Reduction Of Co2 ◽  
Co2 Reduction Reaction ◽  
Wide Potential

Bismuth (Bi)-based nanomaterials are considered as the promising electrocatalysts for electrocatalytic CO2 reduction reaction (CO2RR), but it is challenging to achieve high current density and selectivity in a wide potential...

Cu-Doped Alloy Layer Guiding Uniform Li Deposition on a Li–LLZO Interface under High Current Density

2021 ◽  
Author(s):  
Xia He ◽  
Fei Yan ◽  
Mingyuan Gao ◽  
Yunjing Shi ◽  
Guanglong Ge ◽  
...  
Keyword(s):  
Current Density ◽  
High Current Density ◽  
Alloy Layer ◽  
High Current

Implementation of Trigger Unit for Generation of High-Current-Density Electron Beam

2021 ◽  
pp. 1-6
Author(s):  
Anand Abhishek ◽  
Niraj Kumar ◽  
Udit Narayan Pal ◽  
Bhim Singh ◽  
S. A. Akbar
Keyword(s):  
Electron Beam ◽  
Current Density ◽  
High Current Density ◽  
High Current

A High-Current-Density Electron Beam for Millimeter-Wave Amplifiers

2021 ◽  
pp. 1-5
Author(s):  
Alan M. Cook ◽  
Edward L. Wright ◽  
Khanh T. Nguyen ◽  
Colin D. Joye ◽  
John C. Rodgers ◽  
...  
Keyword(s):  
Electron Beam ◽  
Millimeter Wave ◽  
Current Density ◽  
High Current Density ◽  
High Current
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