Cu(ii)-Based binuclear compound for the application of photosensitive electronic devices

2018 ◽  
Vol 42 (11) ◽  
pp. 8629-8637 ◽  
Author(s):  
Basudeb Dutta ◽  
Arka Dey ◽  
Kaushik Naskar ◽  
Faruk Ahmed ◽  
Rakesh Purkait ◽  
...  
Keyword(s):  
Hydrogen Bonding ◽  
Electronic Device ◽  
Electronic Devices ◽  
Π Interactions ◽  
Light Sensing ◽  
Supramolecular Aggregate

Binuclear Cu(ii)-acetylenedicarboxylate assembled through extensive hydrogen bonding and C–H⋯π interactions to make 3D supramolecular aggregate behaves as light sensing electronic device.

Comparative analysis of existing methods for improving reliability of vacuum electronic devices

2019 ◽  
pp. 38-41
Author(s):  
A. A. Korneev
Keyword(s):  
Comparative Analysis ◽  
Electronic Device ◽  
Electronic Devices ◽  
Import Substitution ◽  
Electronic Control ◽  
Electronic Control System ◽  
Vacuum Electronic Devices ◽  
Electric Vacuum ◽  
Rational Control ◽  
Complex Technical Systems

The article presents the results of the study of the filament modes of electronic lamps and ensuring the rational temperature of the cathode. A brief description and comparative analysis of existing methods with the proposed author are given. The dependence diagrams obtained as a result of a real experiment are presented. A new method of rational control of the electric vacuum devices (EVP) filament mode is proposed, thereby increasing the reliability and increasing the durability of the EVP during operation in high-quality and expensive complex technical systems. According to the results of the study, a new specialized electronic device was developed, which allowed to smoothly regulate the supply of the filament voltage, thereby ensuring the rational control of the operation of the EVP. The technique and specialized electronic device are developed on the basis of modern scientific and technical achievements. This made it possible to increase the reliability and efficiency of the electronic control system for solving critical tasks. When implementing the developed device, the problem of import substitution was solved.

scholarly journals Deciphering the Role of π-Interactions in Polyelectrolyte Complexes Using Rationally Designed Peptides

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2074
Author(s):  
Sara Tabandeh ◽  
Cristina Elisabeth Lemus ◽  
Lorraine Leon
Keyword(s):  
Hydrogen Bonding ◽  
Phase Separation ◽  
Liquid Phase ◽  
Charge Density ◽  
Secondary Structures ◽  
Liquid Phase Separation ◽  
Polyelectrolyte Complexes ◽  
Π Interactions ◽  
Liquid Liquid Phase Separation

Electrostatic interactions, and specifically π-interactions play a significant role in the liquid-liquid phase separation of proteins and formation of membraneless organelles/or biological condensates. Sequence patterning of peptides allows creating protein-like structures and controlling the chemistry and interactions of the mimetic molecules. A library of oppositely charged polypeptides was designed and synthesized to investigate the role of π-interactions on phase separation and secondary structures of polyelectrolyte complexes. Phenylalanine was chosen as the π-containing residue and was used together with lysine or glutamic acid in the design of positively or negatively charged sequences. The effect of charge density and also the substitution of fluorine on the phenylalanine ring, known to disrupt π-interactions, were investigated. Characterization analysis using MALDI-TOF mass spectroscopy, H NMR, and circular dichroism (CD) confirmed the molecular structure and chiral pattern of peptide sequences. Despite an alternating sequence of chirality previously shown to promote liquid-liquid phase separation, complexes appeared as solid precipitates, suggesting strong interactions between the sequence pairs. The secondary structures of sequence pairs showed the formation of hydrogen-bonded structures with a β-sheet signal in FTIR spectroscopy. The presence of fluorine decreased hydrogen bonding due to its inhibitory effect on π-interactions. π-interactions resulted in enhanced stability of complexes against salt, and higher critical salt concentrations for complexes with more π-containing amino acids. Furthermore, UV-vis spectroscopy showed that sequences containing π-interactions and increased charge density encapsulated a small charged molecule with π-bonds with high efficiency. These findings highlight the interplay between ionic, hydrophobic, hydrogen bonding, and π-interactions in polyelectrolyte complex formation and enhance our understanding of phase separation phenomena in protein-like structures.

Theoretical ab initio study of substituted benzene trimer: Interplay between hydrogen bonding and π–π interactions

2011 ◽  
Vol 975 (1-3) ◽  
pp. 106-110 ◽  
Author(s):  
Carolina Estarellas ◽  
Antonio Frontera ◽  
David Quiñonero ◽  
Pere M. Deyà
Keyword(s):  
Hydrogen Bonding ◽  
Ab Initio ◽  
Ab Initio Study ◽  
Π Interactions

Design and Characteristics of Microfocus X-ray Source with Sealed Tube and Transmissive Target on Diamond Window

2021 ◽  
Vol 79 (6) ◽  
pp. 631-640
Author(s):  
Takaaki Tsunoda ◽  
Takeo Tsukamoto ◽  
Yoichi Ando ◽  
Yasuhiro Hamamoto ◽  
Yoichi Ikarashi ◽  
...  
Keyword(s):  
Power Density ◽  
High Power ◽  
High Speed ◽  
Electronic Device ◽  
High Reliability ◽  
Electronic Devices ◽  
Lithium Ion ◽  
High Power Density ◽  
High Magnification ◽  
X Ray

Electronic devices such as medical instruments implanted in the human body and electronic control units installed in automobiles have a large impact on human life. The electronic circuits in these devices require highly reliable operation. Radiographic testing has recently been in strong demand as a nondestructive way to help ensure high reliability. Companies that use high-density micrometer-scale circuits or lithium-ion batteries require high speed and high magnification inspection of all parts. The authors have developed a new X-ray source supporting these requirements. The X-ray source has a sealed tube with a transmissive target on a diamond window that offers advantages over X-ray sources having a sealed tube with a reflective target. The X-ray source provides high-power-density X-ray with no anode degradation and a longer shelf life. In this paper, the authors will summarize X-ray source classification relevant to electronic device inspection and will detail X-ray source performance requirements and challenges. The paper will also elaborate on technologies employed in the X-ray source including tube design implementations for high-power-density X-ray, high resolution, and high magnification simultaneously; reduced system downtime for automated X-ray inspection; and reduced dosages utilizing quick X-ray on-and-off emission control for protection of sensitive electronic devices.

Canadian Registry of Electronic Device Outcomes: remote monitoring outcomes in the Abbott battery performance alert—a multicentre cohort

EP Europace ◽  
2021 ◽  
Author(s):  
Sharath Kumar ◽  
Jason Davis ◽  
Bernard Thibault ◽  
Iqwal Mangat ◽  
Benoit Coutu ◽  
...  
Keyword(s):  
Remote Monitoring ◽  
Primary Outcome ◽  
Electronic Device ◽  
Electronic Devices ◽  
Cardiac Resynchronization ◽  
Device Performance ◽  
Cardiac Implantable Electronic Devices ◽  
All Cause Mortality ◽  
Multicentre Cohort

Abstract Aims Cardiac implantable electronic devices with device advisories have the potential of device malfunction. Remote monitoring (RM) of devices has been suggested to allow the identification of abnormal device performance and permit early intervention. We sought to describe the outcomes of patients with and without RM in devices subject to the Abbott Premature Battery Depletion (PBD) advisory with data from a Canadian registry. Methods and results Patients with an Abbott device subject to the PBD advisory from nine implantable cardioverter defibrillator (ICD) implanting centres in Canada were included in the registry. The use of RM was identified from baseline and follow-up data in the registry. The primary outcome was detection of PBD and all-cause mortality. A total of 2666 patients were identified with a device subject to the advisory. In all, 1687 patients (63.2%) had RM at baseline. There were 487 deaths during follow-up. At a mean follow-up of 5.7 ± 0.7 years, mortality was higher in those without a remote monitor compared with RM at baseline (24.7% vs. 14.5%; P < 0.001). Pre-mature battery depletion was identified in 36 patients (2.1%) with RM vs. 7 (0.7%) without RM (P = 0.004). Time to battery replacement was significantly reduced in patients on RM (median 5 vs. 13 days, P = 0.001). Conclusion The use of RM in patients with ICD and cardiac resynchronization therapy under advisory improved detection of PBD, time to device replacement, and was associated with a reduction in all-cause mortality. The factors influencing the association with mortality are unknown and deserve further study.

(Acetylacetonato-κ2O,O′)[1-(4-bromophenyl-κC2)-3-methylimidazol-2-ylidene-κC2]platinum(II)

2012 ◽  
Vol 68 (8) ◽  
pp. m203-m205 ◽  
Author(s):  
Mario Tenne ◽  
Yvonne Unger ◽  
Thomas Strassner
Keyword(s):  
Hydrogen Bonding ◽  
Solid State ◽  
Intermolecular Hydrogen Bonding ◽  
Coordination Environment ◽  
Π Interactions ◽  
New Class ◽  
Square Planar ◽  
Parallel Fashion

The title platinum(II) complex, [Pt(C10H8BrN2)(C5H7O2)], has a bidentate cyclometallated phenylimidazolylidene ligand and an acetylacetonate spectator ligand, which form a distorted square-planar coordination environment around the PtIIcentre. In the solid state, the molecules are oriented in a parallel fashion by intermolecular hydrogen bonding and π–π and C—H...π interactions, while close Pt...Pt contacts are not observed. The structure is only the second example for this new class of compounds.

Fluoride-Selective Host Based on Anion–π Interactions, Ion Pairing, and Hydrogen Bonding: Synthesis and Fluoride-Ion Sandwich Complex

2007 ◽  
Vol 119 (46) ◽  
pp. 8938-8940 ◽  
Author(s):  
Mark Mascal ◽  
Ilya Yakovlev ◽  
Edward B. Nikitin ◽  
James C. Fettinger
Keyword(s):  
Hydrogen Bonding ◽  
Ion Pairing ◽  
Fluoride Ion ◽  
Sandwich Complex ◽  
Π Interactions

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

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