scholarly journals Enhanced electrochemical biosensor and supercapacitor with 3D porous architectured graphene via salt impregnated inkjet maskless lithography

2019 ◽  
Vol 4 (3) ◽  
pp. 735-746 ◽  
Author(s):  
John A. Hondred ◽  
Igor L. Medintz ◽  
Jonathan C. Claussen

Advances in solution-phase graphene patterning has provided a facile route for rapid, low-cost and scalable manufacturing of electrochemical devices, even on flexible substrates.

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.


Author(s):  
G.A. Cirino ◽  
S.A. Lopera ◽  
L.G. Neto ◽  
A.N. Montagnoli ◽  
R.D. Mansano

2019 ◽  
Vol 2019 (1) ◽  
pp. 000163-000168 ◽  
Author(s):  
Sk Yeahia Been Sayeed ◽  
Daniel Wilding ◽  
Jose Solis Camara ◽  
Dieff Vital ◽  
Shubhendu Bhardwaj ◽  
...  

Abstract A new class of interconnects that exhibit resilience to mechanical deformation are demonstrated with flexible fan-out or embedded-die packages. Active device embedding in flexible substrates is accomplished with direct printed interconnects onto die pads. Such a planar fan-out interconnect technology with a low-cost manufacturable process-flow results in the lowest electrical parasitics compared to flipchip with adhesives or printed-ramp interconnections with surface-assembled devices. The interconnects are made with conductive flexible silver-elastomer composites to sustain elastic deformation. The process is also modified to realize flexible backside-assembled fan-out interconnections where the backside of the die is accessible.


Coatings ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 659 ◽  
Author(s):  
Sheng Lei ◽  
Xinzuo Fang ◽  
Fajun Wang ◽  
Mingshan Xue ◽  
Junfei Ou ◽  
...  

The mixture of insoluble organics and water seriously affects human health and environmental safety. Therefore, it is important to develop an efficient material to remove oil from water. In this work, we report a superhydrophobic Cu2O mesh that can effectively separate oil and water. The superhydrophobic Cu2O surface was fabricated by a facile chemical reaction between copper mesh and hydrogen peroxide solution without any low surface reagents treatment. With the advantages of simple operation, short reaction time, and low cost, the as-synthesized superhydrophobic Cu2O mesh has excellent oil–water selectivity for many insoluble organic solvents. In addition, it could be reused for oil–water separation with a high separation ability of above 95%, which demonstrated excellent durability and reusability. We expect that this fabrication technique will have great application prospects in the application of oil–water separation.


2020 ◽  
Vol 8 (46) ◽  
pp. 16443-16451
Author(s):  
Wendong Yang ◽  
Florian Mathies ◽  
Eva L. Unger ◽  
Felix Hermerschmidt ◽  
Emil J. W. List-Kratochvil

A do-it-yourself silver particle-free ink is presented, which shows good stability, low cost and excellent printability. The ink is formulated in selected alcohols. Highly conductive silver patterns were printed on both glass and flexible substrates.


2005 ◽  
Vol 865 ◽  
Author(s):  
Dirk Herrmann ◽  
Friedrich Kessler ◽  
Ulf Klemm ◽  
Robert Kniese ◽  
Theresa Magorian Friedlmeier ◽  
...  

AbstractCIGS (Cu(In,Ga)Se2) thin-film solar modules on glass substrates are currently on the verge of commercialization. Entirely new application areas could be accessed with CIGS modules fabricated on thin and flexible non-glass substrates. Additionally, the roll-to-roll manufacturing of such flexible CIGS modules promises to be a low-cost production method. Different external Na supply methods and a vacuum-deposited buffer were investigated in this contribution, a sample of the challenges we face when modifying the standard, industrial CIGS module production process to the particular requirements of flexible substrates. Both metal foil substrates and polymer films are considered. Our excellent best results of above 14 % for single cells on titanium, more than 11% on polyimide, and around 7 % for modules on both substrates indicate our progress in developing flexible CIGS.


2011 ◽  
Vol 11 (1) ◽  
pp. 210-216 ◽  
Author(s):  
Vivek Nandakumar ◽  
Daniel Bishop ◽  
Eric Alonas ◽  
Jeffrey LaBelle ◽  
Lokesh Joshi ◽  
...  

2018 ◽  
Vol 54 (16) ◽  
pp. 1992-1995 ◽  
Author(s):  
Yixin Dong ◽  
Gangri Cai ◽  
Qi Zhang ◽  
Hui Wang ◽  
Zhe Sun ◽  
...  

Here, we demonstrate a novel solution-based route for deposition of tin monosulfide (SnS) thin films, which are emerging, non-toxic absorber materials for low-cost and large-scale PV applications, via thermo-reducing Sn(iv) to Sn(ii).


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