scholarly journals Live-cell fluorescence imaging: assessment of thioflavin T uptake in human epidermal carcinoma cells

MedChemComm ◽  
2018 ◽  
Vol 9 (6) ◽  
pp. 946-950
Author(s):  
G. S. M. Sundaram ◽  
Kristen Binz ◽  
Vedica Sharma ◽  
Melany Yeung ◽  
Vijay Sharma
Keyword(s):  
Fluorescence Imaging ◽  
Live Cell Imaging ◽  
Cell Imaging ◽  
Carcinoma Cells ◽  
Live Cell ◽  
Thioflavin T ◽  
Epidermal Carcinoma

Live-cell imaging shows that thioflavin-T is recognized by Pgp as its transport substrate due to its either exclusion- or LY335979-induced accumulation in MDR cells.

scholarly journals Monitoring individual cell-signaling activity using combined metal-clad waveguide and surface-enhanced fluorescence imaging

The Analyst ◽  
2018 ◽  
Vol 143 (22) ◽  
pp. 5559-5567 ◽  
Author(s):  
Thomas Söllradl ◽  
Kevin Chabot ◽  
Ulrike Fröhlich ◽  
Michael Canva ◽  
Paul G. Charette ◽  
...  
Keyword(s):  
Cell Signaling ◽  
Fluorescence Imaging ◽  
Live Cell Imaging ◽  
Cell Imaging ◽  
Individual Cell ◽  
Live Cell ◽  
Enhanced Fluorescence ◽  
Surface Enhanced Fluorescence ◽  
Surface Enhanced ◽  
Signaling Activity

Validation of a combined metal-clad waveguide and surface enhanced fluorescence imaging platform for live cell imaging.

Fabrication of Silicon on Borosilicate Glass Microarrays for Quantitative Live Cell Imaging

2011 ◽  
Vol 1346 ◽  
Author(s):  
David T. Martin ◽  
Sergio Sandoval ◽  
Andy Carter ◽  
Mark Rodwell ◽  
Stefan Smith ◽  
...  
Keyword(s):  
Single Cell ◽  
Fluorescence Imaging ◽  
Borosilicate Glass ◽  
Live Cell Imaging ◽  
Cell Imaging ◽  
Live Cell ◽  
Silicon Etching ◽  
Deep Reactive Ion Etching ◽  
Planar Arrays ◽  
Si Wafer

ABSTRACTPlanar arrays of microwells were fabricated in Silicon on borosilicate glass (pyrex) substrates in order to facilitate live cell fluorescence imaging experiments for cells sequestered inside their own individual microenvironments for incubation and quantification of single cell seceretions. Two methods of deep silicon etching were compared: cryogenic deep reactive ion etching (DRIE) and time multiplexed DIRE (Bosch Process). A 200um Si wafer was bonded to a 500um pyrex substrate. Cryogenic DRIE allowed for the reliable fabrication of 75-100um deep microwells with 60x60um openings across a 10x10mm substrate while the Bosh Process allowed for etching entirely through the Si layer, producing 200um deep microwells with transparent bottoms and steep sidewalls while maintaining the target 60x60um opening geometry.

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