Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding
2017 ◽
Vol 5
(48)
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pp. 12769-12776
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Keyword(s):
Low Cost
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A convenient and low-cost approach to fabricate a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference (EMI) shielding is introduced in this paper.
2017 ◽
Vol 225
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pp. 140-149
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