scholarly journals Study on the preparation and performance of low gas permeability trifluoropropyl phenyl silicone rubber

RSC Advances ◽  
2017 ◽  
Vol 7 (63) ◽  
pp. 39739-39747 ◽  
Author(s):  
Huaijun Zhu ◽  
Zilin Dai ◽  
Weiping Tu

Low gas permeability coating can prevent oxygen and sulphur vapour from permeating into silicone rubber and protect electronic components, chips, electrodes, medicines, etc. from oxidation and sulfuration.

Author(s):  
Grigory Yakovlev ◽  
Jadvyga Keriene ◽  
Anastasiia Gordina ◽  
Irina Polyanskikh ◽  
Milan Bekmansurov

The paper presents possible ways of utilizing technogenic waste – fluorine anhydrite – by its use in production of dry mortars and piece goods from lightweight concrete with expanded polystyrene, as a organic filler, for low-rise construc-tion. The developed dry mortars are based on fluorine anhydrite binder and complex modifier comprising curing activator (sulfate or alkaline) and finely dispersed additive. The fluorine anhydrite-based compositions have improved physical and performance characteristics, including the improved strength and average density and reduced water absorption compared to the control composition. The developed lightweight anhydrite polystyrene concrete has the density grade of 700 kg/m3 and good vapor and gas permeability. The concrete is stabile while using and fire safe, because each granule of expanded poly-styrene is coated with anhydrite matrix, and has the strength sufficient for structural and heat insulating slabs and blocks. All mentioned compositions are eco-friendly and are in great demand for low-rise construction. Therefore the manufacturing of these compositions will consume a large amount of technogenic waste and will reduce the environmental load on the region where the waste is located.


Author(s):  
G. Yadagiri ◽  
K. K. Goswami ◽  
K. S. Gurumurthy ◽  
Satyam ◽  
K. N. Shankara

The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important technologies adopted in the miniaturization of electronic systems. Normally only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the intermediate layers using conventional thick film materials using co-firing process has been examined in this paper. Normally multilayer structures are fabricated by printing / drying / firing of each layer separately starting from the bottom most layer (sequential processing). In this process the bottom layers undergo sintering many times. To avoid many firing cycles and to save power and processing time, a study is taken up to examine the effects of co-firing on the multilayer structure with embedded resistors. The results of the study are presented in this paper.


Author(s):  
Saeed Rafie

One of the main challenges in designing oil & gas downhole wireline logging tools for high temperature and high pressure (HTHP) environments is to put together the most efficient thermal packaging to enhance the tool’s temperature survival time. In general, not all electronic components and sensors can withstand severe downhole temperature (max 500 degrees Fahrenheit). For those heat sensitive components, their electrical response and performance either decay or in some cases they completely fail when their temperature exceeds 300° F. In oil & gas wireline logging applications, the heat sensitive components can be thermally protected inside a Dewar vacuum flask that includes one or two thermal isolators and heat sinks. Cooler electronic components results in longer logging times that lead to a much higher performance and profitability. This paper first discusses the development of a one-dimensional analytical model to determine the transient temperature of heat sensitive sensors and electronic components in wireline logging tools. Second, it introduces a new and improved thermal packaging scheme based on a newly developed and commercially available nanoporous material. This material has a very low thermal conductivity and is used as a thermal shield between the outside environment and the electronics inside the flask. The new packaging scheme also includes a new design for the heat sink which is made of several solid disks separated by this nanoporous material. Results from this new design have shown roughly a 30% improvement compared with the conventional design. Results from both analytical and laboratory tests are discussed in this paper.


AIChE Journal ◽  
1977 ◽  
Vol 23 (4) ◽  
pp. 567-578 ◽  
Author(s):  
S. A. Stern ◽  
F. J. Onorato ◽  
Charles Libove

2014 ◽  
Vol 51 (8) ◽  
pp. 639-645 ◽  
Author(s):  
Miao Zhao ◽  
Yakai Feng ◽  
Yuan Li ◽  
Guang Li ◽  
Yalong Wang ◽  
...  

1981 ◽  
Vol 3 (4) ◽  
pp. 352-368 ◽  
Author(s):  
J. Fleming Dias

A technique for electrically connecting to the PZT elements in a phased array transducer of a cardiac imaging probe is described. The transducer is a stack consisting of a PZT substrate with metallized faces and is bonded to an acoustic absorber across a thin alumina substrate of proper acoustic impedance. The PZT substrate is sawed into an array of elements and a metal foil with an integrally moulded acoustic lens is bonded to the tops of the elements to form the common ground connection. The transducer stack is enclosed in an alumina box and the electrical connection to the PZT elements is made by silk-screened metallic conductors on the sides of the box. The stack transducer module is enclosed in a two part linen bakelite case which is sealed by injecting silicone rubber. A technique that was used to prepare the surface of the acoustic absorber, which resulted in wide bandwidth transducers, is described. Finally, we show the pulse-echo response of the completed transducer imaging a point target in water.


2012 ◽  
Vol 622-623 ◽  
pp. 182-186
Author(s):  
Chin Koi Khoo ◽  
Jane Burry ◽  
Mark Burry

This research explores the potential for developing responsive composite materials with sensing, kinetic and luminous capacity for application in the design of responsive architectural morphing skins. We integrate sensing devices and building skin as one 'integrated' entity, eliminating the need to embed discrete components in a vulnerable system. This investigation develops and explores the properties and performance of a new material, Lumina for application as a lightweight, flexible and economical luminous architectural skin that responds to proximity and lighting stimuli. The design exploration uses silicone rubber, glow pigments, embedded physical computational and shape change material. It is controlled using parametric design processes.


Sign in / Sign up

Export Citation Format

Share Document