scholarly journals Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

RSC Advances ◽  
2017 ◽  
Vol 7 (37) ◽  
pp. 23136-23142 ◽  
Author(s):  
Mi-Seok Park ◽  
Do-Hwan Nam ◽  
Ki-Min Jung ◽  
Kyung-Sik Hong ◽  
Hyuk-Sang Kwon
Keyword(s):  
Sulfonic Acid ◽  
Flip Chip ◽  
Degradation Mechanism ◽  
Methanesulfonic Acid ◽  
Acid Electrolyte ◽  
Methane Sulfonic Acid ◽  
Solder Bumps ◽  
Alloy Solder ◽  
Collapse Failure

The degradation mechanism of the methanesulfonic acid based electroplating bath used for the electrodeposition of Sn–Ag alloy solder bumps and its effects on the collapse failure of flip-chip solder bumps.

Hydration of Some Acids in Sulfolane

1975 ◽  
Vol 53 (18) ◽  
pp. 2683-2688 ◽  
Author(s):  
R. L. Benoit ◽  
S. Y. Lam
Keyword(s):  
Acetic Acid ◽  
Sulfonic Acid ◽  
Picric Acid ◽  
Methanesulfonic Acid ◽  
Pressure Measurements ◽  
Methane Sulfonic Acid ◽  
Enthalpy Changes ◽  
Low Concentrations ◽  
Vapor Pressure Measurements ◽  
And Calorimetry

Interaction between water at low concentrations and some carboxylic acids, methane-sulfonic acid and picric acid, HA, have been studied in Sulfolane at 30 °C. Vapor pressure measurements and calorimetry were used. Results are interpreted in terms of hydration constants K1 and enthalpy changes ΔH1, for the 1:1 complexes [Formula: see text] The values of K1 are low and generally increase slightly with the strength of the acid HA from ∼0.4 for acetic acid to 5.7 for methanesulfonic acid.

THE REACTION OF METHANESULFONIC ACID WITH SULFUR TRIOXIDE

1966 ◽  
Vol 44 (12) ◽  
pp. 1437-1444 ◽  
Author(s):  
E. A. Robinson ◽  
V. Silberberg
Keyword(s):  
Nuclear Magnetic Resonance ◽  
Magnetic Resonance ◽  
Raman Spectra ◽  
Sulfonic Acid ◽  
Sulfur Trioxide ◽  
Methanesulfonic Acid ◽  
Resonance Peak ◽  
Methane Sulfonic Acid ◽  
Low Concentrations ◽  
Rapid Equilibrium

The reaction of sulfur trioxide with methanesulfonic acid has been studied by examination of the nuclear magnetic resonance (n.m.r.) and Raman spectra of solutions containing up to 0.8 stoichiometric mole fraction of SO3.At relatively low SO3 concentrations the polysulfonic acid CH3S2O6H is formed initially and reacts with excess methane sulfonic acid to give methanesulfonic anhydride.[Formula: see text]CH3S2O6H and CH3SO3H exchange protons and SO3 rapidly and a single methyl resonance peak only is observed for these species in the n.m.r. spectrum. A separate methyl resonance is observed for (CH3)2S2O5 at relatively low concentrations of SO3, but at higher concentrations the peak merges with that due to CH3SO3H and CH3S2O6H because of the rapid equilibration of (CH3)2S2O5 with H2S2O7.[Formula: see text]At higher concentrations of SO3 it is likely that the system contains polymers of the three series CH3Sn+1O3n+3H, (CH3)2Sn+2O3n+5, and H2Sn+1O3n+4 in rapid equilibrium. Free SO3 is not found in the system at concentrations less than 60 mole %.

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

scholarly journals Pretreatment of Switchgrass for Production of Glucose via Sulfonic Acid-Impregnated Activated Carbon

Processes ◽  
2021 ◽  
Vol 9 (3) ◽  
pp. 504
Author(s):  
Yane Ansanay ◽  
Praveen Kolar ◽  
Ratna Sharma-Shivappa ◽  
Jay Cheng ◽  
Consuelo Arellano
Keyword(s):  
Activated Carbon ◽  
Sulfonic Acid ◽  
Solid Acid ◽  
Methanesulfonic Acid ◽  
Biofuel Production ◽  
Acid Catalysts ◽  
Effects Of Temperature ◽  
Carbon Catalysts ◽  
Hydrolysis Of

In the present research, activated carbon-supported sulfonic acid catalysts were synthesized and tested as pretreatment agents for the conversion of switchgrass into glucose. The catalysts were synthesized by reacting sulfuric acid, methanesulfonic acid, and p-toluenesulfonic acid with activated carbon. The characterization of catalysts suggested an increase in surface acidities, while surface area and pore volumes decreased because of sulfonation. Batch experiments were performed in 125 mL serum bottles to investigate the effects of temperature (30, 60, and 90 °C), reaction time (90 and 120 min) on the yields of glucose. Enzymatic hydrolysis of pretreated switchgrass using Ctec2 yielded up to 57.13% glucose. Durability tests indicated that sulfonic solid-impregnated carbon catalysts were able to maintain activity even after three cycles. From the results obtained, the solid acid catalysts appear to serve as effective pretreatment agents and can potentially reduce the use of conventional liquid acids and bases in biomass-into-biofuel production.

scholarly journals Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

2009 ◽  
Vol 4 (11) ◽  
pp. T11001-T11001
Author(s):  
E Skup ◽  
M Trimpl ◽  
R Yarema ◽  
J C Yun
Keyword(s):  
Flip Chip ◽  
Fine Pitch ◽  
Solder Bumps

Defect Detection of Flip Chip Solder Bumps Through Local Temporal Coherence Analysis of Laser Ultrasound Signals

2007 ◽  
Author(s):  
Jin Yang ◽  
Charles Ume
Keyword(s):  
Defect Detection ◽  
Flip Chip ◽  
Solder Bump ◽  
Temporal Coherence ◽  
Coherence Analysis ◽  
Laser Ultrasound ◽  
Surface Mount ◽  
Flip Chips ◽  
Solder Bumps ◽  
Ultrasound Signals

Microelectronics packaging technology has evolved from through-hole and bulk configuration to surface-mount and small-profile ones. In surface mount packaging, such as flip chips, chip scale packages (CSP), and ball grid arrays (BGA), chips/packages are attached to the substrates or printed wiring boards (PWB) using solder bump interconnections. Solder bumps, which are hidden between the device and the substrate/board, are no longer visible for inspection. A novel solder bump inspection system has been developed using laser ultrasound and interferometric techniques. This system has been successfully applied to detect solder bump defects including missing, misaligned, open, and cracked solder bumps in flip chips, and chip scale packages. This system uses a pulsed Nd:YAG laser to induce ultrasound in the thermoelastic regime and the transient out-of-plane displacement response on the device surface is measured using the interferometric technique. In this paper, local temporal coherence (LTC) analysis of laser ultrasound signals is presented and compared to previous signal processing methods, including Error Ratio and Correlation Coefficient. The results show that local temporal coherence analysis increases measurement sensitivity for inspecting solder bumps in packaged electronic devices. Laser ultrasound inspection results are also compared with X-ray and C-mode Scanning Acoustic Microscopy (CSAM) results. In particular, this paper discusses defect detection for a 6.35mm×6.35mm×0.6mm PB18 flip chip and a flip chip (SiMAF) with 24 lead-free solder bumps. These two flip chip specimens are both non-underfilled.

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