Low-temperature sintering of highly conductive silver ink for flexible electronics

2016 ◽  
Vol 4 (36) ◽  
pp. 8522-8527 ◽  
Author(s):  
Kiesar Sideeq Bhat ◽  
Rafiq Ahmad ◽  
Yousheng Wang ◽  
Yoon-Bong Hahn
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Low Temperature Sintering ◽  
Conductive Particle ◽  
Silver Ink

Development of a highly conductive, particle-free, durable and low-temperature sintered SOP ink for patterning conductive features using a broad-range of techniques.

Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink

2018 ◽  
Vol 459 ◽  
pp. 249-256 ◽  
Author(s):  
Yun Mou ◽  
Yuru Zhang ◽  
Hao Cheng ◽  
Yang Peng ◽  
Mingxiang Chen
Keyword(s):  
Low Temperature ◽  
Printed Electronics ◽  
Low Temperature Sintering ◽  
Silver Ink

A high-sensitivity printed antenna prepared by rapid low-temperature sintering of silver ink

RSC Advances ◽  
2016 ◽  
Vol 6 (87) ◽  
pp. 84363-84368 ◽  
Author(s):  
Hirotaka Koga ◽  
Tetsuji Inui ◽  
Itaru Miyamoto ◽  
Takuya Sekiguchi ◽  
Masaya Nogi ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Sensitivity ◽  
Hot Water ◽  
Low Temperature Sintering ◽  
Printed Antenna ◽  
Dipole Antennas ◽  
Silver Ink

Rapid, low-temperature, and eco-friendly fabrication of printed dipole antennas with high sensitivity is achieved by hot-water sintering of silver precursor-based ink.

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

2010 ◽  
Vol 97 (15) ◽  
pp. 153117 ◽  
Author(s):  
A. Hu ◽  
J. Y. Guo ◽  
H. Alarifi ◽  
G. Patane ◽  
Y. Zhou ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Low Temperature Sintering

scholarly journals Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Nanomaterials ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1689 ◽  
Author(s):  
Daisuke Tomotoshi ◽  
Hideya Kawasaki
Keyword(s):  
Low Temperature ◽  
Oxidation Resistance ◽  
Flexible Electronics ◽  
Cupric Oxide ◽  
Flexible Substrates ◽  
Low Temperature Sintering ◽  
Conductive Inks ◽  
Surface And Interface ◽  
Surface Control ◽  
Interface Designs

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

Exothermic and Recursive Reaction of Self-Sinterable Silver Ink for Flexible Electronics

2013 ◽  
Vol 1567 ◽  
Author(s):  
Dong-Youn Shin ◽  
Sangki Chun
Keyword(s):  
Silver Nanoparticles ◽  
Low Temperature ◽  
Flexible Electronics ◽  
Printed Electronics ◽  
Exothermic Reaction ◽  
Conductive Ink ◽  
Crucial Issue ◽  
Polymeric Substrate ◽  
Silver Ink ◽  
Silver Carboxylate

ABSTRACTFor the construction of highly conductive printed electrodes on a polymeric substrate with a low glass transition temperature, the development of a low temperature sinterable conductive ink has been a crucial issue in printed electronics and display applications. In this work, we introduce a novel type of self-sinterable silver ink, whose sintering is triggered at a low temperature and completed with the aid of its own exothermic reaction, and propose its exothermic reaction mechanism. Although individual components of this self-sinterable silver ink, Ag2O and silver carboxylate, exhibit endothermic behaviors, their mixture form shows a strong exothermic reaction when heated at 150 °C. It is found that the dissociated form of the used silver carboxylate contributes to the reduction of Ag2O to Ag through its recursive reaction and produces silver nanoparticles. The major source of an exothermic reaction results from the nucleation and fusion of silver nanoparticles.

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

2017 ◽  
Vol 29 (6) ◽  
pp. 4432-4440 ◽  
Author(s):  
Weifang Shao ◽  
Gang Li ◽  
Pengli Zhu ◽  
Yu Zhang ◽  
Qionglin Ouyang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Low Temperature Sintering ◽  
Facile Synthesis
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