Engineering the energy gap near the valence band edge in Mn-incorporated Cu3Ga5Te9 for an enhanced thermoelectric performance
2016 ◽
Vol 4
(34)
◽
pp. 8014-8019
◽
Keyword(s):
Mn substitution for Cu in Cu3Ga5Te9 engineers the energy gap (ΔEA) between impurity and valence bands, which is responsible for the reduction of the potential barrier for thermal excitation of carriers.