Impact of solution phase behaviour and external fields on thin film morphology: PCBM and RRa-P3HT model system

Soft Matter ◽  
2017 ◽  
Vol 13 (4) ◽  
pp. 827-835 ◽  
Author(s):  
A. A. Y. Guilbert ◽  
J. T. Cabral

We report the impact of solution phase behaviour and external fields on PCBM crystallisation and thin film morphology.

2018 ◽  
Author(s):  
Andrea Pereira ◽  
Jay Joseph Van Bavel ◽  
Elizabeth Ann Harris

Political misinformation, often called “fake news”, represents a threat to our democracies because it impedes citizens from being appropriately informed. Evidence suggests that fake news spreads more rapidly than real news—especially when it contains political content. The present article tests three competing theoretical accounts that have been proposed to explain the rise and spread of political (fake) news: (1) the ideology hypothesis— people prefer news that bolsters their values and worldviews; (2) the confirmation bias hypothesis—people prefer news that fits their pre-existing stereotypical knowledge; and (3) the political identity hypothesis—people prefer news that allows their political in-group to fulfill certain social goals. We conducted three experiments in which American participants read news that concerned behaviors perpetrated by their political in-group or out-group and measured the extent to which they believed the news (Exp. 1, Exp. 2, Exp. 3), and were willing to share the news on social media (Exp. 2 and 3). Results revealed that Democrats and Republicans were both more likely to believe news about the value-upholding behavior of their in-group or the value-undermining behavior of their out-group, supporting a political identity hypothesis. However, although belief was positively correlated with willingness to share on social media in all conditions, we also found that Republicans were more likely to believe and want to share apolitical fake new. We discuss the implications for theoretical explanations of political beliefs and application of these concepts in in polarized political system.


1988 ◽  
Vol 40-41 ◽  
pp. 786-787
Author(s):  
Baozhu Luo ◽  
Jiaqi Yu ◽  
Guozhu Zhong
Keyword(s):  

2014 ◽  
Vol 104 (23) ◽  
pp. 233306 ◽  
Author(s):  
Kenji Kotsuki ◽  
Hiroshige Tanaka ◽  
Seiji Obata ◽  
Sven Stauss ◽  
Kazuo Terashima ◽  
...  

Circuit World ◽  
2014 ◽  
Vol 40 (1) ◽  
pp. 7-12 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Grazyna Koziol ◽  
Tomasz Serzysko

Purpose – The purpose of this paper is to investigate the influence of parameters of embedded resistive elements manufacturing process as well as the influence of environmental factors on their electrical resistance. The investigations were made in comparison to the similar constructions of discrete chip resistors assembled to standard printed circuit boards (PCBs). Design/methodology/approach – The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon-silver inks as well as chip resistors in 0402 and 0603 packages. The polymer thick-film resistive films were screen-printed on the several types finishing materials of contact terminations such as copper, silver, and gold. To determine the sensitivity of embedded resistors versus standard assembled chip resistors on environmental exposure, the climatic chamber was used. The measurements of resistance were carried out periodically during the tests, and after the exposure cycles. Findings – The results show that the change of electrical resistance of embedded resistors, in dependence of construction and base material, is different and mainly not exceed the range of 3 per cent. The achieved results in reference to thin-film resistors are comparable with results for standard chip resistors. However, the results that were obtained for thick-film resistors with Ag and Ni/Au contacts are similar. It was not found the big differences between resistors with and without conformal coating. Research limitations/implications – The studies show that embedded resistors can be used interchangeably with chip resistors. It allows to save the area on the surface of PCB, occupied by these passive elements, for assembly of active elements (ICs) and thus enable to miniaturization of electronic devices. But embedding of passive elements into PCB requires to tackle the effect of each forming process steps on the operational properties. Originality/value – The technique of passive elements embedding into PCB is generally known; however, there are no detailed reports on the impact of individual process steps and environmental conditions on the stability of their electrical resistance. The studies allow to understand the importance of each factor process and the mechanisms of operational properties changes depending on the used materials.


Author(s):  
Qiusong Chen ◽  
Dong Lin ◽  
Qinhao Wang ◽  
Jiang Yang ◽  
Juan E. Sanchez ◽  
...  

Optik ◽  
2019 ◽  
Vol 180 ◽  
pp. 387-393 ◽  
Author(s):  
F. Ungan ◽  
M.E. Mora-Ramos ◽  
E. Kasapoglu ◽  
H. Sari ◽  
I. Sökmen

MRS Bulletin ◽  
1992 ◽  
Vol 17 (2) ◽  
pp. 30-36 ◽  
Author(s):  
Jeff Cheung ◽  
Jim Horwitz

The laser, as a source of “pure” energy in the form of monochromatic and coherent photons, is enjoying ever increasing popularity in diverse and broad applications from drilling micron-sized holes on semiconductor devices to guidance systems used in drilling a mammoth tunnel under the English Channel. In many areas such as metallurgy, medical technology, and the electronics industry, it has become an irreplaceable tool.Like many other discoveries, the various applications of the laser were not initially defined but were consequences of natural evolution led by theoretical studies. Shortly after the demonstration of the first laser, the most intensely studied theoretical topics dealt with laser beam-solid interactions. Experiments were undertaken to verify different theoretical models for this process. Later, these experiments became the pillars of many applications. Figure 1 illustrates the history of laser development from its initial discovery to practical applications. In this tree of evolution, Pulsed Laser Deposition (PLD) is only a small branch. It remained relatively obscure for a long time. Only in the last few years has his branch started to blossom and bear fruits in thin film deposition.Conceptually and experimentally, PLD is extremely simple, probably the simplest among all thin film growth techniques. Figure 2 shows a schematic diagram of this technique. It uses pulsed laser radiation to vaporize materials and to deposit thin films in a vacuum chamber. However, the beam-solid interaction that leads to evaporation/ablation is a very complex physical phenomenon. The theoretical description of the mechanism is multidisciplinary and combines equilibrium and nonequilibrium processes. The impact of a laser beam on the surface of a solid material, electromagnetic energy is converted first into electronic excitation and then into thermal, chemical, and even mechanical energy to cause evaporation, ablation, excitation, and plasma formation.


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